Semiconductor Lecture: eSilicon’s Jack Harding To Deliver Logic NVM 2007 Semiconductor IP Memory Event Keynote
Founding Logic NVM Event sponsor, Impinj, Inc., recently announced that Jack Harding, chairman, president and CEO of eSilicon Corporation, will be the keynote speaker at the second annual Logic NVM Event in Santa Clara, California, on June 14, 2007. Mr. Harding’s presentation, “Smaller, Faster, Cheaper, Better: The Relentless Pressure on Consumer Electronics,” explores system-chip design trends and techniques, such as embedding NVM cores, which affect the quality and performance of electronics products.
The Case For Integrated Processes
Based on research and documented case studies, it is
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by developing integrated processes across the
enterprise. This white paper discusses what integrated processes
are, how they create value, specific cases of
companies succeeding with integrated processes, as
well as a checklist to determine how integrated your
own company’s processes are. Submitted by SAP Americas
Hotpack Large Capacity Glassware Washers Uniquely Designed For High Volume Washing
Hotpack Large Capacity, Top-of-the-Line Washers feature a unique triple tube spray system that is unmatched in the market, making them ideal for high volume washing in large laboratories and research centers.
Freescale Uses Cadence Analog Mixed Signal Kit For Flow Development
Cadence Design Systems, Inc. announced that the Cadence Analog Mixed Signal (AMS) Methodology Kit has been adopted by Freescale Semiconductor
Ansoft Releases New Version Of Turbo Package Analyzer Software
Ansoft Corporation announces Turbo Package Analyzer (TPA) v5. This latest version of TPA introduces new automation, design flow, and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging
Genesis Freeze Dryers Offer Versatility For Pilot Research Or Small Scale Production Applications
Genesis freeze dryers offer outstanding versatility for pilot, research, or small scale production applications. Part of the VirTis product line, these freeze dryers incorporate the technology and experience associated with the VirTis name...
Mimix Announces SMT Packaged, GaAs MMIC, Sub-Harmonically Pumped Chipset
Mimix Broadband, Inc. has introduced surface mount technology (SMT) packaged, gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC), sub-harmonically pumped
receiver and transmitter devices
Enabling Simultaneous RF And DC Measurements During Wafer Probing
By Randall Lee, Keithley Instruments, and Bernard Berger, Mesatronic Group
Keithley Instruments and Mesatronic Group (Voiron, France) have formed a technical alliance to address the need for small-geometry mixed-RF and DC testing. Engineers from the two companies are working together to create probe cards for parametric test systems that take RF and low-level DC measurements on any combination of wafer prober pins...
Advanced Technologies from SUSS MicroTec And SAESR Getters Extend Wafer-level Packaged MEMS Lifetime
The SAES Getters Group and SUSS MicroTec presented their technologies for wafer-level packaging applications to the MEMS industry community present at the MEMS Executive Congress (November 5 -7, 2006 Scottsdale, Arizona, USA)...
Taiwan’s XinTec Orders SUSS MicroTec Lithography Solutions For Chip Scale Packaging
SUSS MicroTec, manufacturer of innovative lithography, wafer bonding and test equipment, announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market...