Supplier News

  1. Semiconductor Lecture: eSilicon’s Jack Harding To Deliver Logic NVM 2007 Semiconductor IP Memory Event Keynote 5/3/2007
    Founding Logic NVM Event sponsor, Impinj, Inc., recently announced that Jack Harding, chairman, president and CEO of eSilicon Corporation, will be the keynote speaker at the second annual Logic NVM Event in Santa Clara, California, on June 14, 2007. Mr. Harding’s presentation, “Smaller, Faster, Cheaper, Better: The Relentless Pressure on Consumer Electronics,” explores system-chip design trends and techniques, such as embedding NVM cores, which affect the quality and performance of electronics products.
  2. The Case For Integrated Processes 3/28/2007
    Based on research and documented case studies, it is clear that companies are realizing significant value by developing integrated processes across the enterprise. This white paper discusses what integrated processes are, how they create value, specific cases of companies succeeding with integrated processes, as well as a checklist to determine how integrated your own company’s processes are. Submitted by SAP Americas
  3. Hotpack Large Capacity Glassware Washers Uniquely Designed For High Volume Washing 2/21/2007
    Hotpack Large Capacity, Top-of-the-Line Washers feature a unique triple tube spray system that is unmatched in the market, making them ideal for high volume washing in large laboratories and research centers.
  4. Freescale Uses Cadence Analog Mixed Signal Kit For Flow Development 2/1/2007
    Cadence Design Systems, Inc. announced that the Cadence Analog Mixed Signal (AMS) Methodology Kit has been adopted by Freescale Semiconductor
  5. Ansoft Releases New Version Of Turbo Package Analyzer Software 1/22/2007
    Ansoft Corporation announces Turbo Package Analyzer (TPA) v5. This latest version of TPA introduces new automation, design flow, and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging
  6. Genesis Freeze Dryers Offer Versatility For Pilot Research Or Small Scale Production Applications 1/9/2007
    Genesis freeze dryers offer outstanding versatility for pilot, research, or small scale production applications. Part of the VirTis product line, these freeze dryers incorporate the technology and experience associated with the VirTis name...
  7. Mimix Announces SMT Packaged, GaAs MMIC, Sub-Harmonically Pumped Chipset 1/8/2007
    Mimix Broadband, Inc. has introduced surface mount technology (SMT) packaged, gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC), sub-harmonically pumped receiver and transmitter devices
  8. Enabling Simultaneous RF And DC Measurements During Wafer Probing 1/5/2007
    By Randall Lee, Keithley Instruments, and Bernard Berger, Mesatronic Group
    Keithley Instruments and Mesatronic Group (Voiron, France) have formed a technical alliance to address the need for small-geometry mixed-RF and DC testing. Engineers from the two companies are working together to create probe cards for parametric test systems that take RF and low-level DC measurements on any combination of wafer prober pins...
  9. Advanced Technologies from SUSS MicroTec And SAESR Getters Extend Wafer-level Packaged MEMS Lifetime 11/16/2006
    The SAES Getters Group and SUSS MicroTec presented their technologies for wafer-level packaging applications to the MEMS industry community present at the MEMS Executive Congress (November 5 -7, 2006 Scottsdale, Arizona, USA)...
  10. Taiwan’s XinTec Orders SUSS MicroTec Lithography Solutions For Chip Scale Packaging 11/10/2006
    SUSS MicroTec, manufacturer of innovative lithography, wafer bonding and test equipment, announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market...