LATEST HEADLINES

• Fujitsu Semiconductor Memory Solution, Marubun And Ossia Partner To Announce Cota® Real Wireless Power™ ePaper RFID Tags

  1/5/2023

  Ossia Inc., the company behind FCC-approved Cota® Real Wireless Power™ — the patented technology that delivers power over-the-air, at a distance, and without the need for line-of-sight — today announced that its technology will open up market opportunities in the form of ePaper RFID Tags due to a strategic three-way partnership with Ossia, Marubun, and Fujitsu Semiconductor Memory Solution.

• Ambarella Expands CV3 Family Of Automotive AI Domain Controllers With New CV3-AD685

  1/5/2023

  Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced at CES the introduction of the CV3-AD685, the first production version of the CV3 family of automotive AI domain controllers, targeting L2+ to L4 autonomous vehicles.

• NXP Introduces Advanced Automotive Radar One-Chip Family For Next-Gen ADAS And Autonomous Driving Systems

  1/5/2023

  NXP Semiconductors (NASDAQ: NXPI), the market share leader in automotive radar according to Yole Intelligence, today announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

• Wolfspeed Silicon Carbide Devices Power Future Mercedes-Benz Electric Vehicle Platforms

  1/4/2023

  Wolfspeed, Inc.today announced the company will be supplying Silicon Carbide devices to power future Mercedes-Benz Electric Vehicle (EV) platforms, enabling greater efficiency in the powertrain. Wolfspeed’s semiconductors will be incorporated into next generation powertrain systems for several Mercedes-Benz vehicle lines.

• Akoustis Acquires GDSI, A US-Based, Trusted Supplier Of Premium Semiconductor Back-End Supply Chain Services

  1/4/2023

  Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has acquired Grinding and Dicing Services, Inc. (“GDSI”), a US-based provider of premium back-end semiconductor supply chain services.