LATEST HEADLINES

• Buchanan Leads Bill To Ensure American Semiconductor Superiority In Space

  6/21/2026

  Today,Congressman Vern Buchanan,Vice Chairman of the House Ways and Means Committee,Congresswoman Terri Sewell(D-Ala.) andCongresswoman Suzan DelBene(D-Wash.) introduced theSemiconductor Superiority Actto amend the Section 48D Advanced Manufacturing Investment Credit to explicitly include property and infrastructure for space-based semiconductor manufacturing,as first reported byBloomberg Tax.

• NVIDIA And TSMC Bring AI Into Fabs To Advance Semiconductor Design And Manufacturing

  5/31/2026

  NVIDIA today announced that TSMC, the world’s leading semiconductor company, is using NVIDIA accelerated computing and AI to advance semiconductor design and manufacturing.

• Nordic Semiconductor Brings AI-Assisted Development To The Entire Product Lifecycle

  5/28/2026

  Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today brings AI-assisted development to all parts of the IoT device lifecycle.

• USI Showcases Advanced SiC Chip-Embedded Packaging Technology At PCIM Europe 2026

  5/27/2026

  USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions.

• NOVOSENSE Presents Semiconductor Technologies For xEV Powertrain And ADAS At Automotive Engineering Exposition 2026

  5/27/2026

  NOVOSENSE (688052.SH | 02676.HK) is exhibiting atAutomotive Engineering Exposition 2026, held fromMay 27 to 29atPACIFICO Yokohama, Booth No. 206.NOVOSENSE presents its automotive-grade automotivesemiconductorsolutions for xEV powertrain, ADAS, body electronics and lighting applications.