LATEST HEADLINES

• Rakon Introduces AI Computing Product Portfolio With Next-Generation Ultra Stable TCXO Platform Launch

  10/31/2023

  Rakon today launched Niku, a new in-house designed ASIC semiconductor chip for Ultra Stable TCXOs (Temperature Compensated Crystal Oscillators).

• Synopsys Delivers Seamless Interoperability For Semiconductor Design Ecosystem With New Synopsys Cloud OpenLink Program

  10/31/2023

  Synopsys, Inc. (Nasdaq: SNPS) today announced the launch of its new Synopsys Cloud OpenLink program to foster semiconductor industry interoperability through an open cloud environment. The first of its kind program enables chip designers to seamlessly access third-party electronic design automation (EDA) tools and IP in the Synopsys Cloud environment.

• US Chip Expansions In Need Of Significant Materials Support

  10/30/2023

  TECHCET—the electronic materials advisory firm providing market and supply-chain information—is forecasting US demand for the bulk chemical sector to increase by a combined 75% by 2027.

• Transphorm TOLT-FET With Top-Side Cooling Provides Superior Thermal And Electrical Performance For Computing, AI, Energy And Vehicle Propulsion Systems

  10/26/2023

  Transphorm, Inc., a global leader in robust GaN power semiconductors – the future of next-generation power systems – today introduced the SuperGaN TOLT FET before. With an on-resistance of 72 milliohms, the TP65H070G4RS transistor is the industry's first top-cooled GaN device in a JEDEC-compliant (MO-332) TOLT package.

• Morris Chang ’52, SM ’53 Describes The Secrets Of Semiconductor Success

  10/26/2023

  Groundbreaking technologist Morris Chang ’52, SM ’53 discussed the key elements behind Taiwan’s long-term ascendancy in semiconductor manufacturing, while speaking to a large campus audience in an MIT talk on Tuesday.