Mentor, a Siemens business, today announced certification for TSMC's 7nm FinFET Plus and the latest version of 5nm FinFET processes for its Mentor Calibre® nmPlatform and Analog FastSPICE™ (AFS™) Platforms
Synopsys, Inc. recently announced the Synopsys Design Platform fully supports TSMC's wafer-on-wafer (WoW) direct stacking and chip-on-wafer-on-substrate (CoWoS®) advanced packaging technologies
SILTECTRA GmbH, a leader in advanced wafering technology solutions and services, today announced that it will begin offering “outsourced wafering” services to customers, starting in January 2019
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, recently introduced the AP22815 and AP22615 3A single-channel high-side power switches for USB ports and other hot-swap applications
HEIDENHAIN announces a new series of angle encoders called the ERP 1000 with the design criteria of exceptionally high resolution, high speed, and high contamination resistance
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