LATEST HEADLINES

• Lattice FPGAs With High I/O Density Bring Low Power Signal Bridging And Interface Management To Edge Devices

  Lattice Semiconductor Corporation, the low power programmable leader, today announced new versions of the Lattice MachXO2ZE FPGA family with wafer level chip-scale packaging (WLCSP) and increased I/O density.

• Devices Could Become Even Smaller, More Powerful With Method For Integrating 2D Materials

  If we could shrink semiconductors even further, a whole new silicon revolution would follow. But because that’s impossible, the next best hope is integrating semiconductors with 2D atomically-thin materials, such as graphene, upon which circuits can be created on an incredibly small scale.

• WISeKey’s Identity Technology And Semiconductors Provides Remote Identification (Remote ID) For New Drones’ Digital License Plates

  WISeKey International Holding (“WISeKey”, SIX: WIHN, NASDAQ: WKEY), a leading cybersecurity IoT, AI company, today announced that its advanced digital security solutions provide drones with remote IDs to comply with the new tracking and safety regulations put in place by the Federal Aviation Administration (FAA) in the U.S.

• Renesas Updates Popular R-Car V3H With Improved Deep Learning Performance For Latest NCAP Requirements Including Driver And Occupant Monitoring Systems

  Today, Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced an update of its state-of the-art R-Car V3H system-on-chip (SoC) to deliver significantly improved deep learning performance for smart camera applications, including driver and occupant monitoring systems (DMS / OMS), automotive front cameras, surround view, and auto parking for high-volume vehicles up to Level 2+.

• Arteris® IP FlexNoC® Interconnect And Resilience Package Supports Socionext’s 5nm Automotive Chip Production

  Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property (IP), today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive systems-on-chip (SoCs) fabricated using 5nm semiconductor process technology.