Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, recently announced the development of new low-power technology for use in embedded flash memory based on a 65 nanometer (nm) SOTB (Silicon On Thin Buried Oxide) process
Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its offering of FRED Pt® Ultrafast recovery rectifiers with eight new 100 V and 200 V devices in the eSMP® series SMP (DO-220AA) package, including the industry’s first to offer current ratings to 2 A. Measuring 3.85 mm by 2.03 mm with a low 1 mm profile, the Vishay Semiconductors diodes provide space-saving alternatives to devices in the SMA (DO-214AC)
NXP Semiconductors N.V. (NASDAQ:NXPI) today announced collaboration with Microsoft to deliver a new Microsoft Azure Sphere certified crossover applications processor, as an extension to their popular i.MX 8 high-performance applications processor series
GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, will deliver presentations and display numerous innovative wireless power transfer solutions enabled by GaN at Wireless Power Week taking place in London on June 17-21, 2019.
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, recently unveiled the HERCULES NIL 300 mm—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG’s proprietary SmartNIL wafer-level nanoimprint lithography (NIL) process in a single platform for wafers up to 300 mm in diameter
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