LATEST HEADLINES

• Renesas Electronics Develops Low-Power Technology For Embedded Flash Memory Based On SOTB Process To Enable Energy Harvesting And Eliminate Need For Batteries

  Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, recently announced the development of new low-power technology for use in embedded flash memory based on a 65 nanometer (nm) SOTB (Silicon On Thin Buried Oxide) process

• Vishay Intertechnology 1 A And 2 A FRED Pt® Ultrafast Rectifiers In SMP Package Increase Power Density, Improve Efficiency

  Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its offering of FRED Pt® Ultrafast recovery rectifiers with eight new 100 V and 200 V devices in the eSMP® series SMP (DO-220AA) package, including the industry’s first to offer current ratings to 2 A. Measuring 3.85 mm by 2.03 mm with a low 1 mm profile, the Vishay Semiconductors diodes provide space-saving alternatives to devices in the SMA (DO-214AC)

• NXP And Microsoft Bring Microsoft Azure Sphere Security To The Intelligent Edge With A New Energy-Efficient Processor

  NXP Semiconductors N.V. (NASDAQ:NXPI) today announced collaboration with Microsoft to deliver a new Microsoft Azure Sphere certified crossover applications processor, as an extension to their popular i.MX 8 high-performance applications processor series

• GaN Systems Shows How GaN Is Revolutionizing Wireless Charging At Wireless Power Week

  GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, will deliver presentations and display numerous innovative wireless power transfer solutions enabled by GaN at Wireless Power Week taking place in London on June 17-21, 2019.

• EV Group Brings Nanoimprint Lithography To Full-Scale Production With The First Fully Integrated 300-mm Nanoimprint Lithography Track System

  EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, recently unveiled the HERCULES NIL 300 mm—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG’s proprietary SmartNIL wafer-level nanoimprint lithography (NIL) process in a single platform for wafers up to 300 mm in diameter