LATEST HEADLINES

• Cohu Announces Order For New Diamondx Instrument And Mixed Signal Platform

  9/5/2024

  Cohu, Inc., a global supplier of equipment and services optimizing semiconductor manufacturing yield and productivity, today announced a leading multinational Automotive, Industrial, and Computing customer has selected the Diamondx platform for testing power management devices.

• Electroninks Launches World-First Copper MOD Ink To Revolutionize Advanced Semiconductor Packaging

  9/3/2024

  Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company’s advanced conductive copper ink line.

• Axcelis Announces Participation In SEMICON India 2024

  9/2/2024

  Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its Purion™ and GSD Ovation™ Series of ion implanters at the inaugural SEMICON India 2024, India's premier semiconductor event.

• AGC Establishes A New Technical Service Site In Taiwan For Chemical Products Focused On Semiconductor And Electronic Materials

  9/1/2024

  AGC (AGC Inc., Headquarters: Tokyo; President: Yoshinori Hirai) has announced the opening of the AGC Chemicals Technical Center in Hsinchu, Taiwan, in October 2024.

• ROHM's 4^th Generation SiC MOSFET Bare Chips Adopted In Three EV Models Of ZEEKR From Geely

  8/29/2024

  ROHM Semiconductor today announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker.