LATEST HEADLINES

• Fraunhofer IPMS Expands Its Service Portfolio To Include Ultratrace Elemental Analysis On Wafers

  3/4/2026

  The Fraunhofer Institute for Photonic Microsystems IPMS is expanding its analytical capabilities in the field of wafer contamination.

• Tower Semiconductor To Participate At OFC 2026 Highlighting Its Silicon Photonics Platform For AI, Telecom And Emerging Applications

  3/4/2026

  Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming OFC 2026 (Optical Fiber Communication Conference and Exhibition), taking place March 17–19, 2026 at the Los Angeles Convention Center in Los Angeles, California, booth #2221.

• SPS-International Partners With Innodis To Bring Advanced Fitting Solutions To The Semiconductor Industry

  3/3/2026

  SPS-International, a specialized supplier of semiconductor equipment and cleanroom consumables, today announced a new partnership with Innodis to offer their advanced range of high-purity fittings.

• Longsys Showcases Embedded Integrated Storage Innovations At MWC 2026 to Accelerate On-Device AI

  3/3/2026

  Longsys (301308.SZ), a leading branded semiconductor memory enterprise, is showcasing its latest embedded integrated storage solutions at MWC 2026.

• Faraday Broadens IP Offerings On UMC's 14nm Process For Edge AI And Consumer Markets

  3/3/2026

  Faraday Technology Corporation a leading ASIC design and IP provider, today announced the continued expansion of its IP product lines on UMC’s 14nm FinFET Compact (14FCC) platform, covering USB 2.0/USB 3.2 Gen1 PHY, LVDS TX/RX I/O, DDR 3/4 combo PHY (up to 4.2 Gbps), and LPDDR 4/4X/5 PHY (up to 6.4 Gbps).