Supplier News
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SUSS MicroTec AG Appoints New Chief Financial Officer
5/16/2007
SUSS MicroTec has appointed Michael Knopp as the Group’s new Chief Financial Officer. He will join SUSS on August 1st 2007 and succeeds Stephan Schulak who left the company at the end of March
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Semiconductor Lecture: eSilicon’s Jack Harding To Deliver Logic NVM 2007 Semiconductor IP Memory Event Keynote
5/3/2007
Founding Logic NVM Event sponsor, Impinj, Inc., recently announced that Jack Harding, chairman, president and CEO of eSilicon Corporation, will be the keynote speaker at the second annual Logic NVM Event in Santa Clara, California, on June 14, 2007. Mr. Harding’s presentation, “Smaller, Faster, Cheaper, Better: The Relentless Pressure on Consumer Electronics,” explores system-chip design trends and techniques, such as embedding NVM cores, which affect the quality and performance of electronics products.
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The Case For Integrated Processes
3/28/2007
Based on research and documented case studies, it is clear that companies are realizing significant value by developing integrated processes across the enterprise. This white paper discusses what integrated processes are, how they create value, specific cases of companies succeeding with integrated processes, as well as a checklist to determine how integrated your own company’s processes are. Submitted by SAP Americas
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Freescale Uses Cadence Analog Mixed Signal Kit For Flow Development
2/1/2007
Cadence Design Systems, Inc. announced that the Cadence Analog Mixed Signal (AMS) Methodology Kit has been adopted by Freescale Semiconductor
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Ansoft Releases New Version Of Turbo Package Analyzer Software
1/22/2007
Ansoft Corporation announces Turbo Package Analyzer (TPA) v5. This latest version of TPA introduces new automation, design flow, and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging
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Mimix Announces SMT Packaged, GaAs MMIC, Sub-Harmonically Pumped Chipset
1/8/2007
Mimix Broadband, Inc. has introduced surface mount technology (SMT) packaged, gallium arsenide (GaAs) monolithic microwave integrated circuit (MMIC), sub-harmonically pumped receiver and transmitter devices
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Enabling Simultaneous RF And DC Measurements During Wafer Probing
1/5/2007
By Randall Lee, Keithley Instruments, and Bernard Berger, Mesatronic Group
Keithley Instruments and Mesatronic Group (Voiron, France) have formed a technical alliance to address the need for small-geometry mixed-RF and DC testing. Engineers from the two companies are working together to create probe cards for parametric test systems that take RF and low-level DC measurements on any combination of wafer prober pins... -
Advanced Technologies from SUSS MicroTec And SAESR Getters Extend Wafer-level Packaged MEMS Lifetime
11/16/2006
The SAES Getters Group and SUSS MicroTec presented their technologies for wafer-level packaging applications to the MEMS industry community present at the MEMS Executive Congress (November 5 -7, 2006 Scottsdale, Arizona, USA)...
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Taiwan’s XinTec Orders SUSS MicroTec Lithography Solutions For Chip Scale Packaging
11/10/2006
SUSS MicroTec, manufacturer of innovative lithography, wafer bonding and test equipment, announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market...
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Amkor Expands 300mm Wafer Bumping Capacity With SUSS MicroTec Lithography Solutions
10/27/2006
SUSS MicroTec announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc., Singapore...
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