Supplier News

  1. Semiconductor Lecture: eSilicon's Jack Harding To Deliver Logic NVM 2007 Semiconductor IP Memory Event Keynote 5/3/2007
    Founding Logic NVM Event sponsor, Impinj, Inc., recently announced that Jack Harding, chairman, president and CEO of eSilicon Corporation, will be the keynote speaker at the second annual Logic NVM Event in Santa Clara, California, on June 14, 2007. Mr. Harding’s presentation, “Smaller, Faster, Cheaper, Better: The Relentless Pressure on Consumer Electronics,” explores system-chip design trends and techniques, such as embedding NVM cores, which affect the quality and performance of electronics products.
  2. Advanced Technologies from SUSS MicroTec And SAESR Getters Extend Wafer-level Packaged MEMS Lifetime 11/16/2006
    The SAES Getters Group and SUSS MicroTec presented their technologies for wafer-level packaging applications to the MEMS industry community present at the MEMS Executive Congress (November 5 -7, 2006 Scottsdale, Arizona, USA)...
  3. Taiwan's XinTec Orders SUSS MicroTec Lithography Solutions For Chip Scale Packaging 11/10/2006
    SUSS MicroTec, manufacturer of innovative lithography, wafer bonding and test equipment, announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market...
  4. Amkor Expands 300mm Wafer Bumping Capacity With SUSS MicroTec Lithography Solutions 10/27/2006
    SUSS MicroTec announced that it has shipped and successfully installed a 300mm production lithography tool order at Amkor Technology, Inc., Singapore...
  5. Are you using elastomeric transfer hose when hose of Teflon® might serve you better? 10/16/2006
    No material comes close to Teflon® in physical, chemical and a variety of other properties. As a hose product the drawback to the product was simply: in smooth-tube designs most hoses are too stiff...
  6. Microsemi Announces New Line Of Power MOSFET And FREDFET Devices 9/15/2006
    Microsemi Corporation has launched the first 15 devices in its newest generation of POWER MOS 8 products. These new MOS 8 MOSFET and FREDFET devices are designed for high power, high performance switch mode applications including power factor correction, server and telecom power systems, solar inverters, arc welding, plasma cutting, battery chargers, medical, semiconductor capital equipment and induction heating...
  7. Fairchild Semiconductor Opens Design Center In South America 6/6/2006
    Fairchild Semiconductor has expanded its Global Power Resource design centers to nine worldwide with the addition of a facility in Sao Paulo, Brazil. This new design center responds to the burgeoning high-technology markets in South America...
  8. New Dissolved Ozone Sensors Introduced For Pharmaceutical And Semiconductor Water Sanitization 5/31/2006
    Mettler-Toledo Thornton introduces new dissolved ozone sensors for reliably monitoring pure water sanitization. Ozone, the tri-atomic form of oxygen (O3), is used increasingly in pharmaceutical, semiconductor, bottled water and beverage systems where Mettler-Toledo Thornton already provides measurements of many other parameters
  9. Finally, An Extremely Flexible Smooth Bore Hose Of Teflon® That Is Kink Resistant. Coreflex LLC Explains How! 4/5/2006
    Coreflex LLC offers a high purity, extremely flexible Teflon® hose that utilizes Dupont’s T-62 PTFE resin. Many hoses are marketed under the name of Teflon®, but in fact are flouropolymers...
  10. New CFO To Fairchild 3/2/2006
    Fairchild Semiconductor announced the appointment of Mark S. Frey as executive vice president and chief financial officer. Frey will report directly to President and CEO, Mark Thompson...