Taiwan's XinTec Orders SUSS MicroTec Lithography Solutions For Chip Scale Packaging

Munich, Germany -- SUSS MicroTec, manufacturer of innovative lithography, wafer bonding and test equipment, announced the completion of another equipment purchase agreement with XinTec Inc., Taiwan, a manufacturing service provider of advanced Wafer-Level Chip Size Packaging (CSP) technology and IC Packaging to the global semiconductor market. The order includes two SUSS Gamma coat/develop clusters and seven MA8 manual aligners. XinTec will employ the systems for its CSP production that is used for the manufacture of CMOS and CCD linear and area array image sensors, light detection devices and memories.

This follow-on order, which adds to XinTec's previously installed SUSS automated production full-field exposure and coating systems shows the continued success of SUSS equipment in the fast expanding field of wafer level packaging. "During the past years lithography equipment from SUSS MicroTec has demonstrated outstanding performance in the areas of wafer level packaging", says C.A Lin, VP Operation of Xintec. "SUSS MicroTec's mask aligners and coaters are known for their reliability, low cost of ownership, and great flexibility in processing various substrates and resists, which provides us with the technology needed to submit the latest design in chips size packages to the industry."

SUSS Gamma systems are cluster tracks capable of employing technology for wafer coat/bake and develop processes while maintaining all the process flexibility for which SUSS has been recognized. SUSS MA8 aligners are the leading system solution for lithography in R&D and Pre-Production on formats up to 200 mm.

"We are honored that one of the leading Taiwanese chip scale packaging service providers has decided to develop its innovative packaging solutions on SUSS equipment" comments Rolf Wolf, managing director for SUSS Micro Tec's lithography division. "XinTec has selected SUSS equipment because it is capable to perfectly support the fully packaged integrated circuit by WLPCSP technology, one of the most efficient packaging process. In addition all processes, developed on the manual SUSS aligner are exactly transferable to one of our fully automated exposure systems. This capability is essential for finding commercial uses for our novel technologies."

SOURCE: SUSS MicroTec