Latest Headlines

  1. Aehr Announces New Advanced Testing Capabilities On Its FOX-P™ Wafer Level Test & Burn-In Systems For Silicon Carbide And Gallium Nitride Technologies 10/6/2022

    Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has released two new enhancements for its FOX-P family of wafer level test and burn-in systems.

  2. Fostering Electromobility And Green Energy: Infineon Opens New Site For The Production Of High-Power Semiconductor Modules In Cegléd 10/6/2022

    Infineon Technologies AG has opened a new factory in Cegléd, Hungary. The factory is dedicated to the assembly and testing of high-power semiconductor modules to drive the electrification of vehicles, which is key in the improvement of the world’s CO 2 balance.

  3. Arcadis To Acquire DPS Group: Creating A Leading Global Position In Consultancy, Engineering And Construction Management For The Life Sciences And Semiconductor Manufacturing Market 10/5/2022

    Arcadis, the leading global design & consultancy organization for natural and built assets is pleased to announce it has entered into an agreement to acquire DPS Group, a leading consultancy, engineering and construction management company for Life Sciences and Semiconductor facilities.

  4. STMicroelectronics To Build Integrated Silicon Carbide Substrate Manufacturing Facility In Italy 10/5/2022

     STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, will build an integrated Silicon Carbide (SiC) substrate manufacturing facility in Italy to support the increasing demand from ST’s customers for SiC devices across automotive and industrial applications as they transition to electrification and seek higher efficiency. Production is expected to start in 2023, enabling a balanced supply of SiC substrate between internal and merchant supply.

  5. Inprentus Has Been Awarded A Contract To Supply High-Precision Diffraction Gratings To The Semiconductor Industry For Metrology Applications 10/5/2022

    A contract has been awarded to Inprentus to supply custom manufactured diffraction gratings. These unique diffraction gratings will be used as optical components for semiconductor EUV metrology instrumentation manufactured by EUV Tech Inc. Inprentus and EUV Tech worked together to optimize the design of the optical components to maximize the efficiency and optical characteristics for the semiconductor metrology application.

  6. Vishay Intertechnology FRED Pt® Gen 5 600 V Hyperfast Rectifiers In Isolated Package Deliver Best In Class Reverse Recovery Performance 10/3/2022

    Vishay Intertechnology, Inc. (NYSE: VSH) today introduced four new FRED Pt® Gen 5 600 V Hyperfast rectifiers in a fully isolated TO-220 FullPAK 2L package. Offering the best reverse recovery performance for devices in their class, the 12 A VS-E5TW1206FP-N3 and VS-E5TX1206FP-N3 and 15 A VS-E5TW1506FP-N3 and VS-E5TX1506FP-N3 are designed to increase the efficiency of medium frequency converters and of hard- and soft-switched or resonant designs.

  7. Akoustis Receives Fourth Design Win For A New 5G Mobile Network Infrastructure XBAW Filter 9/28/2022

    Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced that it has received a design win for its 3.5 GHz XBAW® filter from a new 5G mobile network infrastructure customer.

  8. GOWIN Semiconductor New 22nm High-Performance FPGA Family - Arora V 9/26/2022

    GOWIN Semiconductor Corporation, the world’s fastest growing FPGA company, announces today the release of its new generation Arora V high performance FPGA family utilizing advanced 22nm SRAM technology and integrating 270Mbps-12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps.

  9. Advantest Launches ACS Solution Store To Enable Real-Time Data Analytics Solutions For Semiconductor Test 9/14/2022

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today rolled out the Advantest ACS Solution Store, an advanced online platform that provides ease of access to ACS real-time data infrastructure solutions and software applications.

  10. EV Group Revolutionizes 3D Integration From Advanced Packaging To Transistor Scaling With NanoCleave Layer Release Technology 9/12/2022

    EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as semiconductor advanced packaging.