Latest Headlines

  1. ACM Research Strengthens Wet Processing Portfolio With New Compound Semiconductor Tools 1/25/2022

    ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its comprehensive tool set to support compound semiconductor manufacturing.

  2. Weebit Nano Demonstrates Its First Crossbar ReRAM Arrays 1/24/2022

    Weebit Nano Limited (ASX:WBT; Weebit or the Company), a leading developer of next-generation memory technologies for the global semiconductor industry, is pleased to announce that together with its development partner CEA-Leti, it has demonstrated its first operational crossbar arrays, a key milestone on the Company’s path to creating discrete (stand-alone) non-volatile memory (NVM) chips.

  3. New Multi-Functional Micro- And Nanoimprint Solution From EV Group Offers Unprecedented Flexibility For High-Volume Optical Device Manufacturing 1/18/2022

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®7300 automated SmartNIL® nanoimprint and wafer-level optics system.

  4. Weebit Nano Joins The Global Semiconductor Alliance 1/12/2022

    Weebit Nano Limited (ASX:WBT), a leading developer of next-generation memory technologies for the global semiconductor industry, announces it has joined the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry.

  5. A*STAR’S Institute Of Microelectronics And Soitec To Develop Next-Generation Silicon Carbide Semiconductors 1/10/2022

    The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec (Euronext Paris) have announced a research collaboration to develop next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles and advanced high-voltage electronic devices.

  6. Mass Production Of New Computer Memory Now Closer With ULTRARAM On Silicon Wafers 1/6/2022

    A pioneering type of patented computer memory known as ULTRARAM has been demonstrated on silicon wafers in what is a major step towards its large-scale manufacture.

  7. Navitas Opens World's First GaN IC Design Center Dedicated To Electric Vehicles (EV) 1/4/2022

    Navitas Semiconductor (Nasdaq: NVTS), the industry-leader in gallium nitride (GaN) power integrated circuits (ICs), announced the opening of a new electric vehicle (EV) Design Center, further expanding into higher-power GaN markets.

  8. Kulicke & Soffa Launches KNeXt™ - The Next Generation Industry 4.0 Software Platform 1/4/2022

    Kulicke and Soffa Industries, Inc. announced at SEMICON Taiwan the launch of KNeXt™, the new web-based industry 4.0 software solution that connects K&S equipment and enables fleet management, factory automation and productivity improvement.

  9. Silanna Semiconductor Reference Design Supports Development Of Industry’s Most Efficient All-Silicon 33W 1C Chargers 1/3/2022

    Silanna Semiconductor, The Power Density Leader, has launched a new active clamp flyback (ACF)-based reference design that simplifies and speeds the development of 33W 1C fast charger applications built using silicon power FETs.

  10. Heterogeneous Integration Chip-let System Package Alliance Established To Expand Market Opportunities 12/27/2021

    The development of AI and 5G has boosted the demand for high-end semiconductor chips. In order to enhance critical capabilities of Taiwan's chip industry for this emerging market, the Department of Industrial Technology (DoIT), Ministry of Economic Affairs (MOEA), Taiwan, has supported ITRI to establish the Heterogeneous Integration Chip-let System Package Alliance (Hi-CHIP).