Latest Headlines

  1. WISeKey, ON Semiconductor And Tatwah Announce The Release Of The World's First Secure IoT Beacon Device 11/26/2019

    WISeKey (WIHN.SIX), a Swiss based cyber security company, ON Semiconductor (Nasdaq: ON), a leading supplier of energy efficient semiconductor-based solutions, and Tatwah, a market leader in designing and manufacturing secure RFID tags and Bluetooth Low Energy beacons with a strong experience in security, announced today the release of the world’s first Secure IoT Beacon device

  2. Smart Systems For Semiconductor Manufacturing 11/25/2019

    Integrating smart systems into manufacturing offers the potential to transform many industries

  3. NXP, Dongfeng Venucia, And Hangsheng Electronics Collaboration Achieves Milestone: First Global Mass Production Of Smart eCockpits 11/21/2019

    NXP Semiconductors N.V. (NASDAQ: NXPI), Dongfeng Venucia, and Hangsheng Electronics today jointly announced that the Venucia T90 e-cockpit, “Venucia 3.0 PLUS,” marks a mass production milestone in the companies’ joint efforts to bring next-generation eCockpits to drivers

  4. LAPIS Semiconductor's New Multiband Wireless Communication LSI Optimized For Smart Meters World-Wide 11/12/2019

    ROHM Group company LAPIS Semiconductor recently announced the availability of a multiband (sub-1GHz/2.4GHz) wireless communication LSI, ML7421, optimized for applications requiring low power consumption over relatively long distances, such as smart meters, gas/fire alarms, smart agriculture and home/building security systems

  5. Thermo Fisher Centrios Improves Semiconductor Circuit Editing For Process Nodes 14nm And Above 11/12/2019

    Circuit edit (CE) engineers, whether supporting designers or in service labs, who are looking for a cost-effective solution can increase their productivity with the next-generation Thermo Scientific Centrios circuit edit system

  6. GOWIN Semiconductor Releases The First FPGA With Integrated Bluetooth Radio 11/12/2019

    GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their latest mSoC FPGA with integrated Bluetooth 5.0 Low Energy radio enabling an entirely new wave of FPGA computing capabilities at the edge

  7. NXP Announces New Automotive Ultra-Wideband Chip Capable Of Turning Smartphones Into Car Keys 11/12/2019

    NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest provider of automotive semiconductors, today announced an addition to its UWB portfolio with a new automotive UWB IC

  8. Half-Bridge Evaluation Board From GaN Systems And ON Semiconductor Demonstrates Next Performance Leap In GaN 11/4/2019

    GaN Systems, the global leader in GaN power semiconductors and ON Semiconductor, a world-leading supplier of power semiconductor ICs, today announced the availability of a high-speed, half-bridge GaN daughter board using GaN Systems’ 650 V, 30 A GaN E-HEMTs and ON Semiconductor’s award-winning NCP51820 high speed gate driver evaluation board

  9. Could A New 2D Material Allow Semiconductors To Keep Getting Smaller, Stronger, Better And Faster? 11/4/2019

    some things are really, really small. A group of engineers at The University of Texas at Austin may have found a new material for manufacturing even smaller computer chips that could replace silicon and help overcome one of the biggest challenges facing the tech industry in decades: the inevitable end of Moore’s Law

  10. Yole’s Analysts Announce A Consolidation Of The Market 10/28/2019

    “The die attach equipment market is showing a 6% CAGR between 2018 and 2024”, announces Santosh Kumar, Principal Analyst & Director Packaging, Assembly & Substrates, Yole Korea. “This industry will reach US$1.3B by 2024, fueled by assembly and packaging opportunities created by semiconductor megatrends”