Latest Headlines

  1. Silence, Please: UNSW Scientists Create Quietest Semiconductor Quantum Bits On Record 10/9/2020

    Researchers at UNSW Sydney have demonstrated the lowest noise level on record for a semiconductor quantum bit, or qubit. The research was published today in Advanced Materials.

  2. Quik-Pak, Agile Microwave Technology And OMMIC Verify RF-Capable Packaging Solutions For 5G And IoT Semiconductor Devices 10/6/2020

    Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak open-molded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of semiconductor devices for 5G and internet of things (IoT) millimeter-wave applications.

  3. Lextar Partners With X Display 10/6/2020

    Lextar Electronics Corp. ("Lextar") (TAIEX: 3698) a leader in Opto-Semiconductor solutions and X Display Company (XDC), a leader in MicroLED displays, announced today that the companies entered into agreements, including Development and License Agreement and Services Agreement wherein Lextar has licensed XDC's Intellectual Property, and both Lextar's and XDC's customers will be supplied Lextar's high-performance MicroLEDs.

  4. EV Group Brings Maskless Lithography To High-Volume Manufacturing With LITHOSCALE 9/22/2020

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the LITHOSCALE® maskless exposure system – the first product platform to feature EVG's revolutionary MLE™ (Maskless Exposure) technology. LITHOSCALE was developed by EVG to address lithography needs for markets and applications requiring a high degree of flexibility or product variation, including advanced packaging, MEMS, biomedical and IC substrate manufacturing.

  5. Axcelis Announces Multiple Shipments Of 'Purion H' Evaluation Systems For Advanced Logic And 3D NAND Applications 9/16/2020

    Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has shipped multiple evaluation systems for the next generation Purion H to advanced logic and advanced 3D NAND memory device manufacturers in Asia Pacific.

  6. NSITEXE Successfully Develops Multiple Custom Processors For Automotive Applications In Half The Time With Synopsys ASIP Designer Tool 9/16/2020

    Synopsys, Inc. (Nasdaq: SNPS) today announced that NSITEXE, a group company of DENSO Corporation that develops and sells high-performance semiconductor IP, used the Synopsys ASIP Designer Tool in the development of five specialized custom processors, including dedicated vector-processing engines, for its automotive data flow processor (DFP) platform.

  7. FormFactor Announces Cryogenic Probe Family For Emerging Computing Applications 9/16/2020

    FormFactor, Inc. (NASDAQ:FORM), a leading semiconductor test and measurement supplier, announced today that it has created a family of engineering probes optimized for operation at cryogenic temperatures.

  8. Seoul Semiconductor Obtains Permanent Injunction Against Philips Displays And Feit Light Bulbs 9/15/2020

    Seoul Semiconductor Co., Ltd. ("Seoul") (KOSDAQ 046890), a leading global innovator of LED products and technology, announced that it has successfully obtained a permanent injunction in a patent infringement lawsuit against The Factory Depot Advantages, Inc. ("Factory Depot") that sold Philips electronic products and Feit lighting products.

  9. ACM Research Introduces Thin Wafer Cleaning System For High-Volume Power Semiconductor Device Manufacturing 9/15/2020

    ACM Research, Inc. (NASDAQ: ACMR), a leading supplier of wafer-processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the introduction of its Thin Wafer Cleaning System, a high-throughput, four-chamber system designed for single-wafer wet processes including cleaning, etching and surface finishing.

  10. Bluetooth 5.2/Bluetooth LE Module With Built-In Sensors Helps OEMs Speed Up Development Cycle For IoT Applications 9/14/2020

    Nordic Semiconductor today announces that joint-venture startup Sensry, a full service provider of multisensor hardware enabling edge computing, has selected Nordic’s nRF52832 Bluetooth 5.2/Bluetooth Low Energy (Bluetooth LE) multiprotocol System-on-Chip (SoC) to provide the processing power and wireless connectivity for its ‘Sensry Kallisto’ sensor platform solution.