Latest Headlines

  1. New All-In-One Hybrid Power Drive Module Solution From Microchip Is Designed For Electric Aviation Applications To Reduce Development Time And Weight 1/19/2023

    Aircraft manufacturers designing More Electric Aircraft (MEA) are looking to convert the flight control systems from hydraulic to electric to reduce weight and design complexities.

  2. Vishay Intertechnology Launches New Gen 7 Platform Of 1200 V FRED Pt® Hyperfast Rectifiers With Two Devices In SMA (DO-214AC) Package 1/17/2023

    Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first two devices in its new Gen 7 platform of 1200 V FRED Pt® Hyperfast rectifiers. Offered in the SMA (DO-214AC) package, the 1 A rectifiers offer the best trade-off between reverse recovery charge (Qrr) and forward voltage drop for devices in their class.

  3. Fujitsu Semiconductor Memory Solution, Marubun And Ossia Partner To Announce Cota® Real Wireless Power™ ePaper RFID Tags 1/5/2023

    Ossia Inc., the company behind FCC-approved Cota® Real Wireless Power™ — the patented technology that delivers power over-the-air, at a distance, and without the need for line-of-sight — today announced that its technology will open up market opportunities in the form of ePaper RFID Tags due to a strategic three-way partnership with Ossia, Marubun, and Fujitsu Semiconductor Memory Solution.

  4. Ambarella Expands CV3 Family Of Automotive AI Domain Controllers With New CV3-AD685 1/5/2023

    Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced at CES the introduction of the CV3-AD685, the first production version of the CV3 family of automotive AI domain controllers, targeting L2+ to L4 autonomous vehicles.

  5. NXP Introduces Advanced Automotive Radar One-Chip Family For Next-Gen ADAS And Autonomous Driving Systems 1/5/2023

    NXP Semiconductors (NASDAQ: NXPI), the market share leader in automotive radar according to Yole Intelligence, today announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

  6. Akoustis Acquires GDSI, A US-Based, Trusted Supplier Of Premium Semiconductor Back-End Supply Chain Services 1/4/2023

    Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced today that it has acquired Grinding and Dicing Services, Inc. (“GDSI”), a US-based provider of premium back-end semiconductor supply chain services.

  7. Synaptics Launches SYN4778, The Lowest Power, Smallest, Most Accurate GNSS IC For IoT Devices 1/3/2023

    Synaptics® Incorporated (Nasdaq: SYNA) today announced the SYN4778—the smallest, lowest power, most accurate Global Navigation Satellite Systems (GNSS) IC for the Internet of Things (IoT).

  8. Weebit Nano Tapes-Out First 22nm Demo Chip 1/2/2023

    Weebit Nano Limited (ASX:WBT), a leading developer of next-generation memory technologies for the global semiconductor industry, has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module in an advanced 22nm FD-SOI (fully depleted silicon on insulator) process technology.

  9. Stmicroelectronics And eYs3D Microelectronics To Showcase Collaboration On High-Quality 3D Stereo-Vision Camera For Machine Vision And Robotics At CES 2023 1/2/2023

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and eYs3D Microelectronics, a fabless semiconductor design house that focuses on end-to-end hardware and software systems for computer vision, including advanced vision-processing System-on-Chip (SoC) devices, will reveal the results of their collaboration on high-quality machine vision at CES 2023 in Las Vegas on January 5-8.

  10. Researchers Show A New Way To Induce Useful Defects Using Invisible Material Properties 12/29/2022

    Much of modern electronic and computing technology is based on one idea: Add chemical impurities, or defects, to semiconductors to change their ability to conduct electricity. These altered materials are then combined in different ways to produce the devices that form the basis for digital computing, transistors, and diodes.