Latest Headlines
-
Centera Photonics Announces Industry-First 1.6Tbps Transceiver With Integrated Lasers-Based NewPhotonics NPG10201 Chip
3/31/2025
Centera Photonics Inc., a silicon photonics optical solution provider for data center interconnect, today announced the industry-first 1.6 terabits per seconds transceiver module featuring the NewPhotonics NPG10201 PIC transmitter-on-chip (TOC).
-
Pragmatic Semiconductor Set To Revolutionise NFC Connectivity With Sustainable Flexible Chips
3/27/2025
Pragmatic Semiconductor Ltd., a pioneer in flexible semiconductor technology, today announced the launch of its latest radio frequency identification (RFID) near-field communication (NFC) product line, Pragmatic NFC Connect.
-
Tower Semiconductor And Alcyon Photonics Announce Collaboration To Accelerate Integrated Photonics Innovation
3/25/2025
Tower Semiconductor [NASDAQ/TASE: TSEM], the leader in high-value analog semiconductor foundry solutions, and Alcyon Photonics, a leader in integrated photonics design, today announced their collaboration to accelerate photonics integration.
-
Valens Semiconductor Partners With Seven MIPI A-PHY Silicon Vendors, Successfully Completing Product Interoperability Testing To Advance The MIPI A-PHY Ecosystem In China And Globally
3/18/2025
Valens Semiconductor (NYSE: VLN) today announced that it hosted successful interoperability testing with seven other vendors of MIPI A-PHY silicon: Analogix, ESWIN Technology, Motorcomm, OmniVision Technologies, Silergy, SimChip, and Velink.
-
OpenLight And Tower Semiconductor Demonstrate 400G/lane Modulators Built On Silicon Photonic Wafers For Data Centers And AI Optical Connectivity
3/12/2025
OpenLight, the world leader in custom PASIC chip design and manufacturing, and Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, today announced the successful demonstration of the 400G/lane modulator on Tower's commercially available, integrated silicon photonics platform, PH18DA, achieving a better than 3.5db extinction ratio using the industry-standard PAM-4 modulation format and at a drive voltage of 0.6 volts peak-to-peak.
-
Tata Electronics, Himax Technologies And Powerchip Semiconductor Manufacturing Corporation Form Alliance To Revolutionize India's Display And Ultralow Power AI Sensing Product And Technology Ecosystem
3/5/2025
Himax Technologies, Inc. (“Himax” or “Company”) (Nasdaq: HIMX), an industry leader in fabless display driver ICs and other semiconductor products, today announced a Memorandum of Understanding (MoU) with Tata Electronics, a pioneering leader in India’s electronics manufacturing sector, and Powerchip Semiconductor Manufacturing Corporation (PSMC), a leading Taiwanese Foundry and Technology Transfer Partner of Tata Electronics, to revolutionize India’s display and ultralow power AI sensing product and technology ecosystem.
-
Silvaco Expands Product Offering With Acquisition Of Cadence's Process Proximity Compensation Product Line
3/4/2025
Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, today announced the strategic acquisition of the Process Proximity Compensation (“PPC”) product line of Cadence (Nasdaq: CDNS).
-
Matmerize And SCREEN Holdings Partner To Develop High-Resistance, PFAS-Free Polymers For Semiconductor Manufacturing
2/26/2025
Matmerize, Inc., a leader in AI-driven polymer informatics, and SCREEN Holdings, a global semiconductor equipment manufacturer, are pleased to announce a partnership focused on discovering PFAS-free polymers with high chemical resistance for semiconductor equipment applications.
-
Advantest Introduces SiConic: Groundbreaking Solution For Automated Silicon Validation
2/20/2025
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today unveiled SiConic: a scalable solution for automated silicon validation.
-
Lam Research Ushers In New Era Of Semiconductor Metallization With ALTUS® Halo For Molybdenum Atomic Layer Deposition
2/19/2025
Lam Research Corp. (Nasdaq: LRCX) today unveiled ALTUS® Halo, the world's first atomic layer deposition (ALD) tool that harnesses the capabilities of the metal molybdenum in the production of leading-edge semiconductors.