Latest Headlines

  1. Boston Semi Equipment Launches New Test Site Module For Zeus Test Handler To Support Power IC Manufacturers 7/24/2024

    Boston Semi Equipment (BSE), a global leader in advanced automation solutions for the semiconductor and consumer electronics industries, today introduced a new test site module for its Zeus gravity feed test handler to support high-voltage and partial discharge (HVPD) applications in power electronics manufacturing.

  2. Rice Researchers Advancing Microelectronics Manufacturing On DARPA-Funded Team 7/22/2024

    A large collaborative team led by the University of Texas at Austin with Rice University as a key partner was awarded $840M to develop the next generation of high-performing semiconductor microsystems for the U.S. Department of Defense.

  3. Forge Nano Expands Semiconductor Business; Unveils New 200mm Wafer Atomic Layer Deposition Cluster Tool Ahead of SEMICON West 7/1/2024

    Forge Nano, Inc., a leading ALD equipment provider and materials science company, today further expanded into the semiconductor market with the unveiling of its new Atomic Layer Deposition (ALD) product offering

  4. Riber: Order For A Compact 21 Research Platform In France 6/27/2024

    RIBER, the global leader for Molecular Beam Epitaxy (MBE) equipment serving the semiconductor industry, is announcing the sale of a double Compact 21 research system in France.

  5. Efabless Empowers 40 Commercial Companies To Design Chips 6/24/2024

    Efabless Corporation, the creator platform for chips, is excited to announce that it has enabled 40 new companies to design chips.

  6. Vishay Intertechnology Releases Second-Generation Automotive Grade IHLE® Inductor With Integrated EMI Shield In 4040 Case Size 6/5/2024

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its IHLE® series of low profile, high current inductors featuring integrated E-field shields with a new second-generation Automotive Grade device in the 10 mm by 10 mm 4040 case size.

  7. EV Group Doubles Throughput Of Innovative Semiconductor Layer Transfer Technology With New EVG®880 LayerRelease™ System 5/28/2024

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®880 LayerRelease™ system, a dedicated high-volume manufacturing (HVM) equipment platform incorporating EVG's innovative infrared (IR) LayerRelease™ technology.

  8. TCS & IIT-Bombay To Build India's First Quantum Diamond Microchip Imager 5/28/2024

    Tata Consultancy Services, a global leader in IT services, consulting, and business solutions, has entered a strategic partnership with the Indian Institute of Technology, Bombay (IIT-Bombay), to develop India’s first Quantum Diamond Microchip Imager.

  9. Weebit Nano And Efabless Collaborate To Enable Easy, Affordable Prototyping Of Innovative SoC Designs 5/24/2024

    Weebit Nano Limited (ASX:WBT), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and Efabless Corporation, the creator platform for chips, announce their collaboration to enable fast and easy prototyping of intelligent devices using Weebit’s technology.

  10. The Dominican Republic And Purdue University Sign MOU To Drive Semiconductor Growth 5/23/2024

    The Ministry of Industry, Commerce, and MSMEs of the Dominican Republic (MICM) announced a significant Memorandum of Understanding (MOU) with Purdue University to propel the country's semiconductor industry and national development.