Latest Headlines

  1. New S32J Family Of Safe And Secure Ethernet Switches Enables Scalable Vehicle Networks, Extending NXP CoreRide Platform 10/15/2024

    NXP Semiconductors N.V. (NASDAQ: NXPI), the worldwide leader in automotive processing and networking, has introduced the new S32J family of high-performance Ethernet switches and network controllers.

  2. Iridium To Collaborate With Nordic Semiconductor On Iridium NTN Direct Integration 10/9/2024

    Iridium Communications Inc. (NASDAQ: IRDM), a leading provider of global voice and data satellite communications, today announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct℠ service into Nordic's LTE-M/NB-IoT modules and chipsets.

  3. STMicroelectronics And Qualcomm Enter Into Strategic Collaboration In Wireless Internet Of Things 10/1/2024

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and Qualcomm Technologies International, Ltd., a subsidiary of Qualcomm Incorporated, today announced a new strategic collaboration to deliver next-generation Internet of Things (IoT) solutions for industrial and consumer applications powered by embedded artificial intelligence.

  4. Sivers Semiconductors Receives CHIPS Act Funding Award From NEMC Hub To Advance FR3 Beamformer ICs And Array Design For 5G/6G 9/30/2024

    Today, Sivers Semiconductors announced receiving first-year funding of $6 million from the Northeast Microelectronics Coalition (NEMC) Hub through U.S. CHIPS and Science Act under the Microelectronics Commons program, executed through the Naval Surface Warfare Center Crane Division and the National Security Technology Accelerator (NSTXL).

  5. SOITEC: Soitec And Resonac Announce The Signing Of A Joint Development Agreement Around Smarts™, To Accelerate The Adoption Of High-Performance Silicon Carbide In Next-Generation Electric Vehicles 9/24/2024

    Resonac Corporation (formerly Showa Denko KK) and Soitec (Euronext Paris – Tech Leaders), a world leader in designing and manufacturing innovative semiconductor materials, have signed an agreement to develop 200 mm SmartSiC™ silicon carbide (SiC) wafers using Resonac’s substrates and epitaxy processes.

  6. Axus Technology Delivers Industry's Lowest Cost Of Ownership For CMP Processes On 200mm Sic Wafers 9/24/2024

    Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide (SiC) wafers.

  7. Polymatech And ECM Group Forge Strategic Joint Venture For Semiconductor Wafer Fabrication In Grenoble, France 9/12/2024

    Polymatech, a multinational corporation (MNC), a leading player in semiconductor manufacturing with a strong presence in India and global business operations in USA, Singapore, Bahrain, UK and UAE today announced the signing of a Memorandum of Understanding (MoU) with ECM Group, a globally recognised leader in advanced microelectronics and semiconductor technologies to establish a Joint Venture Company in Grenoble, France.

  8. Sondrel Announces Advanced Modelling Process For AI Chip Designs 9/10/2024

    Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.

  9. Axcelis Announces Participation In SEMICON India 2024 9/2/2024

    Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its Purion™ and GSD Ovation™ Series of ion implanters at the inaugural SEMICON India 2024, India's premier semiconductor event.

  10. ROHM's 4th Generation SiC MOSFET Bare Chips Adopted In Three EV Models Of ZEEKR From Geely 8/29/2024

    ROHM Semiconductor today announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker.