Latest Headlines
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Lumotive Launches The World's First Commercially-Available Optical Beam Steering Semiconductor
8/31/2023
Optical semiconductor pioneer Lumotive announced today the launch of LM10, the first full production offering of its groundbreaking Light Control Metasurface (LCM™) technology – the world's first digital beam steering solution.
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GOWIN Semiconductor & Andes Technology Corp. Announce The First Ever RISC-V CPU And Subsystem Embedded 22nm SoC FPGA
8/29/2023
Andes Technology Corporation (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), a leading supplier of high efficiency, low-power 32/64-bit RISC-V processor cores and Founding Premier member of RISC-V International, is thrilled to announce that its AndesCore™ A25 RISC-V CPU IP and AE350 peripheral subsystem is hardened and embedded in the GW5AST-138 FPGA chip from GOWIN Semiconductor, the world’s fastest growing FPGA company.
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AMD Announces Plan To Invest Approximately $400M Over The Next Five Years To Expand Research, Development And Engineering Operations In India
7/28/2023
SemiconIndia 2023 — AMD (NASDAQ: AMD) today announced plans for continued growth in India through an approximate $400M investment over the next five years.
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Department Of Commerce And Department Of Defense Sign Memorandum Of Agreement To Strengthen U.S. Defense Industrial Base
7/26/2023
The United States Departments of Commerce (DoC) and Defense (DoD) have signed a Memorandum of Agreement (MOA) to expand collaboration to strengthen the U.S. semiconductor defense industrial base.
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NEO Semiconductor To Present Its Ground-Breaking 3D NAND And 3D DRAM Architectures In Keynote Address At Flash Memory Summit 2023
7/26/2023
NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced its participation at Flash Memory Summit 2023, taking place in person in Santa Clara, California, on August 8-10.
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Ansys 2023 R2 Powers Industry Innovation With Transformative Simulation Technologies
7/25/2023
The latest release from Ansys (NASDAQ: ANSS), 2023 R2 enables distributed engineering teams with new technologies and improved performance to drive industry innovation forward.
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Navitas And Plexim Accelerate Time-To-Market With PLECS Models For Next-Generation GeneSiC™ Power Semiconductors
6/29/2023
Navitas Semiconductor (Nasdaq: NVTS), and Plexim GmbH announce a partnership to release GeneSiC G3™ SiC MOSFET and Gen 5 MPS diode PLECS thermal loss models for highly-accurate simulations of complete power electronics systems.
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Ansys And Synopsys Accelerate RFIC Semiconductor Design With New Reference Flow For Samsung Technology
6/28/2023
Recognizing the increasing challenges faced by designers of 5G/6G systems-on-chip (SoCs) and autonomous driving systems, Ansys (NASDAQ: ANSS) and Synopsys, Inc. (NASDAQ: SNPS) announced the availability of a new reference flow for radio-frequency integrated circuit (RFIC) design developed with Samsung Foundry for its 14LPU process technology.
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Lam Research Introduces World's First Bevel Deposition Solution To Increase Yield In Chip Production
6/27/2023
Lam Research Corp. (Nasdaq: LRCX) today introduced Coronus DX, the industry's first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications.
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Purdue, TSMC Extend Partnership On Semiconductor Research And Workforce Development
6/22/2023
Purdue University continues to advance semiconductor workforce development by renewing a strong partnership between industry leader Taiwan Semiconductor Manufacturing Co. and the university’s Center for Secure Microelectronics Ecosystem.