Latest Headlines

  1. EvoNexus And GLOBALFOUNDRIES Team To Accelerate Growth Of Wireless And IoT Startups 10/26/2020

    EvoNexus, a leading non-profit technology incubator, and GLOBALFOUNDRIES® (GF®), the world’s leading specialty semiconductor foundry, today announced their collaboration to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT).

  2. Applied Materials And BE Semiconductor Industries To Accelerate Chip Integration Technology For The Semiconductor Industry 10/22/2020

    Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) today announced an agreement to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.

  3. Nordic-Powered Next Generation Micro:Bit To Support AI And Machine Learning Applications 10/13/2020

    Nordic Semiconductor today announces that the Micro:bit Educational Foundation, a London, U.K.-based not-for-profit organization, has specified Nordic’s nRF52833 Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC) to provide the core processing and wireless connectivity for the latest micro:bit.

  4. NEC Selects NXP RF Airfast Multi-Chip Modules For Massive MIMO 5G Antenna Radio Unit For Rakuten Mobile In Japan 10/12/2020

    NXP® Semiconductors N.V. (NXP; NASDAQ: NXPI) and NEC Corporation (NEC; TSE: 6701) today announced that NEC selected NXP to supply RF Airfast multi-chip modules to be used in a Massive MIMO 5G antenna Radio Unit (RU) for Rakuten Mobile, one of Japan’s leading mobile network operators.

  5. Silence, Please: UNSW Scientists Create Quietest Semiconductor Quantum Bits On Record 10/9/2020

    Researchers at UNSW Sydney have demonstrated the lowest noise level on record for a semiconductor quantum bit, or qubit. The research was published today in Advanced Materials.

  6. Quik-Pak, Agile Microwave Technology And OMMIC Verify RF-Capable Packaging Solutions For 5G And IoT Semiconductor Devices 10/6/2020

    Quik-Pak, together with Agile Microwave Technology (AgileMwT) and OMMIC SA, today announced its line of JEDEC-compliant air-cavity QFN packages. The Quik-Pak open-molded plastic packages (OmPP®) are RF-capable to data rates of 43GHz, which will help speed availability of semiconductor devices for 5G and internet of things (IoT) millimeter-wave applications.

  7. Lextar Partners With X Display 10/6/2020

    Lextar Electronics Corp. ("Lextar") (TAIEX: 3698) a leader in Opto-Semiconductor solutions and X Display Company (XDC), a leader in MicroLED displays, announced today that the companies entered into agreements, including Development and License Agreement and Services Agreement wherein Lextar has licensed XDC's Intellectual Property, and both Lextar's and XDC's customers will be supplied Lextar's high-performance MicroLEDs.

  8. EV Group Brings Maskless Lithography To High-Volume Manufacturing With LITHOSCALE 9/22/2020

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the LITHOSCALE® maskless exposure system – the first product platform to feature EVG's revolutionary MLE™ (Maskless Exposure) technology. LITHOSCALE was developed by EVG to address lithography needs for markets and applications requiring a high degree of flexibility or product variation, including advanced packaging, MEMS, biomedical and IC substrate manufacturing.

  9. Axcelis Announces Multiple Shipments Of 'Purion H' Evaluation Systems For Advanced Logic And 3D NAND Applications 9/16/2020

    Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has shipped multiple evaluation systems for the next generation Purion H to advanced logic and advanced 3D NAND memory device manufacturers in Asia Pacific.

  10. NSITEXE Successfully Develops Multiple Custom Processors For Automotive Applications In Half The Time With Synopsys ASIP Designer Tool 9/16/2020

    Synopsys, Inc. (Nasdaq: SNPS) today announced that NSITEXE, a group company of DENSO Corporation that develops and sells high-performance semiconductor IP, used the Synopsys ASIP Designer Tool in the development of five specialized custom processors, including dedicated vector-processing engines, for its automotive data flow processor (DFP) platform.