Latest Headlines
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E&R Strengthens North American Semiconductor Presence With New U.S. Subsidiary
9/24/2025
E&R Engineering Corp., a global leader in semiconductor laser and plasma equipment, announced the launch of its U.S. subsidiary in Phoenix, Arizona, established in August 2025.
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SEALSQ And The Seoul Metropolitan Government Sign MoU To Establish A Post-Quantum Semiconductor Personalization, Research And Design Center In Seoul
9/22/2025
SEALSQ Corp (NASDAQ: LAES) ("SEALSQ" or "Company"), a company that focuses on developing and selling Semiconductors, PKI, and Post-Quantum technology hardware and software products, today announced the signing of a Memorandum of Understanding (MoU) with the Seoul Metropolitan Government and Invest Seoul, represented by Mayor Oh Se-hoon, which aims to establish a Post-Quantum Semiconductor Personalization, Research and Design Center in Seoul.
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Pfeiffer Vacuum+Fab Solutions Showcases Complete Range Of Semiconductor Solutions At SEMICON West 2025
8/29/2025
As a leading provider of innovative vacuum and abatement solutions, Pfeiffer Vacuum+Fab Solutions aims to showcase its comprehensive range of products and services designed to optimize semiconductor manufacturing processes.
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Marvell Unveils Industry's First 64 Gbps/Wire Bi-Directional Die-To-Die Interface IP In 2nm To Power Next Generation XPUs
8/26/2025
Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area.
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Rapidus Announces Strategic Collaboration With Keysight To Improve Yield And Achieve High-Precision PDK For 2nm GAA Semiconductors
8/26/2025
Rapidus Corporation, a leading-edge Japanese foundry that manufactures advanced logic semiconductors, today announced a strategic collaboration with Keysight Technologies Japan K.K., the Japanese subsidiary of Keysight Technologies, Inc., and has signed a Memorandum of Cooperation.
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Xscape Photonics And Tower Semiconductor Unveil The Industry's First Optically Pumped On-Chip Multi-Wavelength Laser Platform For AI Datacenter Fabrics
8/25/2025
Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, and Xscape Photonics, a U.S.-based innovator in advanced photonic interconnects funded by industry leaders such as NVIDIA and Cisco, today announced the successful prototyping and validation kit availability of the industry’s first on-chip, optically pumped, multi-wavelength laser source
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Hyundai Mobis Acquires Semiconductor Development Process Certification For ISO 26262 ASIL-D
8/21/2025
Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process.
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NEO Semiconductor Introduces World's First Extreme High Bandwidth Memory (X-HBM) Architecture For AI Chips
8/5/2025
NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips.
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iDEAL Signs Technology Partner Agreement For SuperQ MOSFETs With Power System Specialist Richardson Electronics, Ltd
7/31/2025
iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.
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Navitas Powers Xiaomi's Next Generation GaN Charger
7/31/2025
Navitas Semiconductor (Nasdaq: NVTS), the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, today announced that Xiaomi’s next-generation 90W GaN charger will be powered by Navitas’ GaNSense Control ICs.