Latest Headlines

  1. Sivers Semiconductors Receives CHIPS Act Funding Award From NEMC Hub To Advance FR3 Beamformer ICs And Array Design For 5G/6G 9/30/2024

    Today, Sivers Semiconductors announced receiving first-year funding of $6 million from the Northeast Microelectronics Coalition (NEMC) Hub through U.S. CHIPS and Science Act under the Microelectronics Commons program, executed through the Naval Surface Warfare Center Crane Division and the National Security Technology Accelerator (NSTXL).

  2. SOITEC: Soitec And Resonac Announce The Signing Of A Joint Development Agreement Around Smarts™, To Accelerate The Adoption Of High-Performance Silicon Carbide In Next-Generation Electric Vehicles 9/24/2024

    Resonac Corporation (formerly Showa Denko KK) and Soitec (Euronext Paris – Tech Leaders), a world leader in designing and manufacturing innovative semiconductor materials, have signed an agreement to develop 200 mm SmartSiC™ silicon carbide (SiC) wafers using Resonac’s substrates and epitaxy processes.

  3. Axus Technology Delivers Industry's Lowest Cost Of Ownership For CMP Processes On 200mm Sic Wafers 9/24/2024

    Axus Technology, a leading global provider of chemical mechanical planarization (CMP) equipment, critical for semiconductor and compound semiconductor fabrication, today announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide (SiC) wafers.

  4. Polymatech And ECM Group Forge Strategic Joint Venture For Semiconductor Wafer Fabrication In Grenoble, France 9/12/2024

    Polymatech, a multinational corporation (MNC), a leading player in semiconductor manufacturing with a strong presence in India and global business operations in USA, Singapore, Bahrain, UK and UAE today announced the signing of a Memorandum of Understanding (MoU) with ECM Group, a globally recognised leader in advanced microelectronics and semiconductor technologies to establish a Joint Venture Company in Grenoble, France.

  5. Sondrel Announces Advanced Modelling Process For AI Chip Designs 9/10/2024

    Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.

  6. Axcelis Announces Participation In SEMICON India 2024 9/2/2024

    Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its Purion™ and GSD Ovation™ Series of ion implanters at the inaugural SEMICON India 2024, India's premier semiconductor event.

  7. ROHM's 4th Generation SiC MOSFET Bare Chips Adopted In Three EV Models Of ZEEKR From Geely 8/29/2024

    ROHM Semiconductor today announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker.

  8. Finwave Semiconductor And GlobalFoundries Partner On RF GaN-on-Si Technology For Cellular Handset Applications 8/29/2024

    Finwave Semiconductor, Inc., a leading innovator in GaN (Gallium Nitride) technology, today announced a strategic technology development and licensing agreement with GlobalFoundries (GF), the world’s leading specialty foundry with a rich history of RF leadership.

  9. Nearfield Instruments Secures Purchase Order For Its QUADRA Metrology System From Leading Semiconductor Manufacturing Fab In Asia 7/30/2024

    Nearfield Instruments, provider of metrology and process control equipment for advanced semiconductor fabrication plants, today announced the receipt of a purchase order for its QUADRA® metrology systems from a major semiconductor manufacturing fab in Asia.

  10. Weebit Nano And DB HiTek Tape-Out ReRAM Module In DB HiTek's 130nm BCD process 7/30/2024

    Weebit Nano Limited (Weebit), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and tier-1 semiconductor foundry DB HiTek have taped-out (released to manufacturing) a demonstration chip integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM or RRAM) module in DB HiTek’s 130nm Bipolar-CMOS-DMOS (BCD) process.