Latest Headlines

  1. Renesas Introduces New Gate Driver IC For IGBTs And SiC MOSFETs Driving EV Inverters 1/25/2023

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a new gate driver IC that is designed to drive high-voltage power devices such as IGBTs (Insulated Gate Bipolar Transistors) and SiC (Silicon Carbide) MOSFETs for electric vehicle (EV) inverters.

  2. Silicon Carbide Semiconductor Supplier Selects Aehr FOX System For Wafer Level Test And Burn-In Of Silicon Carbide Devices For Automotive Electric Vehicles 1/25/2023

    Aehr Test Systems, a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced that a new customer has selected its FOX-PTM test and burn-in system to be used for qualification and production wafer level test and burn-in of their silicon carbide devices for automotive electric vehicles.

  3. VORAGO Technologies To Move All Its Manufacturing Stateside In Strategic Partnership With SkyWater’s Trusted Foundry 1/24/2023

    SkyWater Technology, the trusted technology realization partner, today announced a strategic partnership with VORAGO Technologies, effectively moving VORAGO’s fabrication efforts stateside to SkyWater’s DMEA-accredited Category 1A Trusted Foundry. The partnership is based on SkyWater implementing VORAGO’s patented HARDSIL technology, which is a cost-effective semiconductor processing method that enables devices to operate at higher temperature and radiation levels.

  4. Amphenol Ardent Concepts Releases High-Density TR90™ Multicoax Connector For Semiconductor, Test & Measurement, Mobile Communication, And Automotive Sector E-Band Designs 1/24/2023

    Amphenol Ardent Concepts, a leading provider of ganged coaxial connectors for semiconductor, communications, quantum computing, and space and defense applications, is proud to announce the release of TR90, the next generation in its TR Multicoax Series.

  5. New All-In-One Hybrid Power Drive Module Solution From Microchip Is Designed For Electric Aviation Applications To Reduce Development Time And Weight 1/19/2023

    Aircraft manufacturers designing More Electric Aircraft (MEA) are looking to convert the flight control systems from hydraulic to electric to reduce weight and design complexities.

  6. Vishay Intertechnology Launches New Gen 7 Platform Of 1200 V FRED Pt® Hyperfast Rectifiers With Two Devices In SMA (DO-214AC) Package 1/17/2023

    Vishay Intertechnology, Inc. (NYSE: VSH) today introduced the first two devices in its new Gen 7 platform of 1200 V FRED Pt® Hyperfast rectifiers. Offered in the SMA (DO-214AC) package, the 1 A rectifiers offer the best trade-off between reverse recovery charge (Qrr) and forward voltage drop for devices in their class.

  7. Fujitsu Semiconductor Memory Solution, Marubun And Ossia Partner To Announce Cota® Real Wireless Power™ ePaper RFID Tags 1/5/2023

    Ossia Inc., the company behind FCC-approved Cota® Real Wireless Power™ — the patented technology that delivers power over-the-air, at a distance, and without the need for line-of-sight — today announced that its technology will open up market opportunities in the form of ePaper RFID Tags due to a strategic three-way partnership with Ossia, Marubun, and Fujitsu Semiconductor Memory Solution.

  8. Ambarella Expands CV3 Family Of Automotive AI Domain Controllers With New CV3-AD685 1/5/2023

    Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced at CES the introduction of the CV3-AD685, the first production version of the CV3 family of automotive AI domain controllers, targeting L2+ to L4 autonomous vehicles.

  9. NXP Introduces Advanced Automotive Radar One-Chip Family For Next-Gen ADAS And Autonomous Driving Systems 1/5/2023

    NXP Semiconductors (NASDAQ: NXPI), the market share leader in automotive radar according to Yole Intelligence, today announced a new industry-first 28nm RFCMOS radar one-chip IC family for next generation ADAS and autonomous driving systems.

  10. Wolfspeed Silicon Carbide Devices Power Future Mercedes-Benz Electric Vehicle Platforms 1/4/2023

    Wolfspeed, Inc.today announced the company will be supplying Silicon Carbide devices to power future Mercedes-Benz Electric Vehicle (EV) platforms, enabling greater efficiency in the powertrain. Wolfspeed’s semiconductors will be incorporated into next generation powertrain systems for several Mercedes-Benz vehicle lines.