Latest Headlines

  1. Lumotive Creates World's First 2D Photonic Beamforming Semiconductor 3/19/2026

    Lumotive, a pioneer in programmable optical semiconductor technology, today announced a landmark breakthrough with the successful demonstration of the world’s first programmable two-dimensional (2D) photonic beamforming chip based on its Light Control Metasurface (LCM) architecture.

  2. Fraunhofer IPMS Expands Its Service Portfolio To Include Ultratrace Elemental Analysis On Wafers 3/4/2026

    The Fraunhofer Institute for Photonic Microsystems IPMS is expanding its analytical capabilities in the field of wafer contamination.

  3. Tower Semiconductor To Participate At OFC 2026 Highlighting Its Silicon Photonics Platform For AI, Telecom And Emerging Applications 3/4/2026

    Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming OFC 2026 (Optical Fiber Communication Conference and Exhibition), taking place March 17–19, 2026 at the Los Angeles Convention Center in Los Angeles, California, booth #2221.

  4. SPS-International Partners With Innodis To Bring Advanced Fitting Solutions To The Semiconductor Industry 3/3/2026

    SPS-International, a specialized supplier of semiconductor equipment and cleanroom consumables, today announced a new partnership with Innodis to offer their advanced range of high-purity fittings.

  5. Longsys Showcases Embedded Integrated Storage Innovations At MWC 2026 to Accelerate On-Device AI 3/3/2026

    Longsys (301308.SZ), a leading branded semiconductor memory enterprise, is showcasing its latest embedded integrated storage solutions at MWC 2026.

  6. embedUR systems And Alif Semiconductor Partner To Deliver The Industry's First End-To-End Edge AI Development Platform For Advanced Microcontrollers 3/2/2026

    embedUR systems today announced a partnership with Alif Semiconductor® to bring native support for Alif's Ensemble® Series of microcontrollers to ModelNova™ Fusion Studio, embedUR's end-to-end Edge AI development platform.

  7. PhotonIC Debuts Product Portfolio Based Upon Its Platform: Resiliency Of Optoelectronic Chip Supply-Chain™ (ROCS) 2/27/2026

    PhotonIC Technologies, a global fabless optoelectronic semiconductor company, today introduces a complete product portfolio leveraging its ROCS platform —engineered to give end customers greater control and predictability over performance scaling, geopolitical risks, and manufacturing strategy.

  8. Modus Test Partners With yieldWerx To Deliver Closed-Loop Socket To Silicon Correlation 2/26/2026

    Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence.

  9. Axcelis Unveils Purion H6: Next-Generation High Current Ion Implanter For Advanced Semiconductor Manufacturing 2/4/2026

    Axcelis Technologies, Inc. (NASDAQ:ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today introduced the Purion H6™ high current ion implanter—engineered to meet the demands of next-generation semiconductor devices with unmatched purity, precision and productivity.

  10. Siemens Acquires Canopus AI To Bring AI-Based Metrology To Semiconductor Manufacturing 2/4/2026

    Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.