Latest Headlines

  1. AKHAN Semiconductor Fabricates First Of Its Kind 300MM Diamond Wafer 7/27/2021

    AKHAN Semiconductor (AKHAN), a technology company specializing in the fabrication and application of synthetic, lab-grown electronics-grade diamond materials addressing semiconductor, telecom, and consumer industries and global markets, today showcased the ability to manufacture 300MM complementary metal–oxide–semiconductor (CMOS) diamond wafers.

  2. STMicroelectronics Manufactures First 200mm Silicon Carbide Wafers 7/27/2021

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has manufactured the first 200mm (8-inch) Silicon-Carbide (SiC) bulk wafers for prototyping next-generation power devices from its facility in Norrköping, Sweden.

  3. Teledyne e2v HiRel Partners With Integra Technologies Inc. To Launch 100V GaN/SiC RF Power Technology For High Reliability Aerospace & Defense Applications 7/14/2021

    Teledyne e2v HiRel Electronics, a leading provider of high reliability semiconductor solutions, today announced that it will be offering High Reliability qualified versions of California-based Integra Technologies, Inc. (Integra) new 100V Gallium Nitride on Silicon Carbide (GaN/SiC) power transistors.

  4. dpiX And Mercury Systems Sign MOU To Formalize Partnership 7/13/2021

    dpiX and Mercury Systems today announced the signing of a Memorandum of Understanding (MOU) that outlines the companies’ cooperation in the development, prototyping and manufacturing for the next generation of best-in-class display technology.

  5. Semtech Announces EClamp Device To Solve Challenging EMC Immunity Requirements 7/13/2021

    Semtech Corporation, a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced the availability of EClamp8052P – a member of the EClamp platform of protection devices.

  6. New Renesas Solution For Automotive Cameras Enables High-Definition Video Using Low-Cost Cables And Connectors 7/13/2021

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced its new Automotive HD Link (AHL) technology that enables automotive manufacturers to deliver high-definition video over low-cost cables and connectors that currently support standard-definition video.

  7. Morse Micro Samples Best-In-Class Wi-Fi HaLow SoCs And Modules For Customer Evaluation 7/13/2021

    Morse Micro, a fabless semiconductor company reinventing Wi-Fi for the Internet of Things (IoT), today announced the availability of Wi-Fi HaLow system-on-chip (SoC) and module samples to early access partners and key customers.

  8. Bluetooth LE Beacon Supports Industrial IoT Asset Tracking And Condition Monitoring 7/8/2021

    Nordic Semiconductor today announces that Tampere, Finland-based Internet of Things (IoT) solutions company, Confidex, has selected Nordic’s nRF52832 Bluetooth Low Energy (Bluetooth LE) multiprotocol System-on-Chip (SoC) for its ‘Confidex Viking Tough’ beacon.

  9. Renesas’ New Modular IoT Development Platform Dramatically Reduces Time-To-Market and Design Complexity 7/7/2021

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced an innovative new IoT system design platform that significantly eases the prototyping of IoT systems.

  10. GOWIN Semiconductor Announces Their GoBridge™ ASSP Product Line With USB Peripheral Bridges 6/29/2021

    GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, introduces the GoBridge ASSP product line with the release of their GWU2X and GWU2U USB interface bridging devices.