Latest Headlines
-
ABM Expands Semiconductor And Technical Services Platform With Agreement To Acquire WGNSTAR
12/17/2025
ABM (NYSE: ABM), a major provider of integrated facility, infrastructure, and technical solutions, today announced a definitive agreement to acquire WGNSTAR, a leading provider of managed workforce solutions and equipment support services for the semiconductor and high-technology industries, in a cash transaction valued at approximately $275 million.
-
SEMIFIVE Secures AI Semiconductor Design Projects In Japan, Accelerating Global Expansion With New Local Subsidiary
12/11/2025
SEMIFIVE, a global leader in custom AI semiconductor (ASIC) design preparing for its KOSDAQ listing, announced today that it has secured multiple AI semiconductor design projects in Japan and recently established its subsidiary in Tokyo, Japan.
-
DNP Achieves 10nm Line Pattern Resolution On Nanoimprint Template For Cutting-Edge Semiconductors
12/9/2025
Dai Nippon Printing Co., Ltd. today announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter).
-
Gigaphoton Excimer Laser For Advanced Packaging Installed At Japanese Company
12/7/2025
Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that it has delivered an excimer laser for semiconductor advanced packaging to a Japanese company engaged in research and development of advanced semiconductors, and the installation of the system was successfully completed in November.
-
UMC And Polar Collaborate To Meet Growing Demand For U.S. Onshore Semiconductor Manufacturing
12/4/2025
United Microelectronics Corporation (“UMC”), a leading global semiconductor foundry, and Polar Semiconductor, LLC (“Polar”), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, today announced they have signed a Memorandum of Understanding (MOU) to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace & defense.
-
Rigaku Launches XTRAIA MF-3400, A Measuring Instrument For Next-Generation Semiconductors
12/4/2025
Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers.
-
Vinci Emerges From Stealth To Transform Semiconductor Design And Simulation
12/2/2025
Vinci, the pioneer of Physics-Driven AI for hardware design and simulation, emerged from stealth today and announced $46M in total funding, with its Series A led by Xora Innovation and its Seed round led by Eclipse.
-
Alpha And Omega Semiconductor Enables 48V Hot Swap In AI Servers With New High SOA MOSFET IN LFPAK 8x8
12/2/2025
Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its AOLV66935 a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8x8 package.
-
Nordic Semiconductor Unveils nRF54LV10A - A Breakthrough Low-Voltage Bluetooth LE SoC For Next-Gen Healthcare Wearables
12/2/2025
Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today launches the nRF54LV10A SoC, setting a new benchmark for integration, performance, and battery life in the smallest medical devices.
-
Marvell To Acquire Celestial AI, Accelerating Scale-Up Connectivity For Next-Generation Data Centers
12/2/2025
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced it has entered into a definitive agreement to acquire Celestial AI, a pioneer of a disruptive Photonic Fabric technology platform purpose-built for scale-up optical interconnect.