Latest Headlines
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Cadence And Rapidus Collaborate On Leading-Edge 2nm Semiconductor Solutions For AI And HPC Applications
12/10/2024
Cadence Design Systems, Inc. today announced it is collaborating with Rapidus Corporation to provide co-optimized AI-driven reference design flows and a broad IP portfolio to support the Rapidus 2nm gate-all-around (GAA) process and leverage the design and manufacturing benefits from Rapidus’ backside power delivery network (BSPDN) technology.
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ROHM And TSMC Launch Strategic Gallium Nitride Technology Collaboration For The Automotive Industry
12/10/2024
ROHM Co., Ltd. (ROHM) today announced that they have entered into a strategic partnership with TSMC on the development and volume production of gallium nitride (GaN) power devices for electric vehicle applications.
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Destination 2D Brings Graphene To Mainstream CMOS - Breakthrough Interconnect Technology At Wafer Scale To Revolutionize Next-Generation Energy-Efficient Chips
12/6/2024
Destination 2D - a new semiconductor startup with unmatched expertise in graphene process technology - today announced it has successfully achieved wafer-scale synthesis of high-quality graphene within CMOS-compatible process conditions.
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Lumotive And Lattice Semiconductor To Demo Chip-Based Beam Steering For 3D Sensing At DevCon 2024
12/5/2024
Lumotive, a leader in optical semiconductor technology, and Lattice Semiconductor, renowned for low-power, scalable FPGA solutions, are excited to announce their collaboration on a revolutionary platform for advanced 3D sensing.
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Gigadevice GD25/55 Serial NOR Flash Automotive-Grade Product Family Certified For ISO 26262 ASIL D
12/5/2024
GigaDevice, a leading semiconductor company specializing in Flash Memory, 32-bit Microcontrollers (MCUs), Sensors, Analog products and solutions, announced its GD25/55 SPI NOR Flash Automotive-Grade Product Family has received ISO 26262:2018 ASIL D Automotive Functional Safety certification from SGS, the world’s leading Testing, Inspection and Certification company.
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Silvaco Joins SMART USA Institute To Propel Digital Twin Innovations Under CHIPS Manufacturing USA Program
12/4/2024
Silvaco Group, Inc,a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, is proud to announce its participation in the Semiconductor Manufacturing and Advanced Research with Twins (SMART) USA Institute.
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Sierra Space Signs Agreements To Advance Manufacturing In Microgravity
12/4/2024
Sierra Space, a leading commercial space company and defense tech prime that is Building a Platform in Space to Benefit Life on Earth, announced today two new agreements to further the advancement of manufacturing in the microgravity environments of Low Earth Orbit.
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Rocket Lab Signs $23.9M CHIPS Incentives Award To Boost Semiconductor Manufacturing
11/25/2024
Rocket Lab USA, Inc.(“Rocket Lab” or “the Company”), a global leader in launch services and space systems, has finalized a $23.9M award from the U.S. Department of Commerce to increase its compound semiconductor manufacturing capability and capacity at the Company’s Albuquerque, New Mexico facility.
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GCT Semiconductor Holding, Inc. Signs Strategic Definitive Agreement With European Tier One Telecommunications Supplier
11/25/2024
GCT Semiconductor Holding Inc. (“GCT” or the “Company”), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, announced today the signing of a definitive agreement with a European tier one wireless infrastructure and terminal provider (the “Tier One Supplier”) to collaborate on the development of Fixed Wireless Access (“FWA”) technology using GCT’s 5G solutions including modem chipset and RFIC.
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SEALSQ Post-Quantum Chips: Ideal For Securing Critical Infrastructures Against Quantum Attacks
11/25/2024
SEALSQ Corp (NASDAQ: LAES) (“SEALSQ” or the “Company”), a leader in semiconductor, PKI, and post-quantum technology solutions, today announced that is at the forefront of the transition to the robotization era with its groundbreaking post-quantum chips.