Latest Headlines
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Applied Materials Expands Patterning Solutions Portfolio For Angstrom Era Chipmaking
2/26/2024
Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.” As chipmakers transition to process nodes at 2nm and below, they increasingly benefit from new materials engineering and metrology techniques that help overcome EUV and High-NA EUV patterning challenges, including line edge roughness, tip-to-tip spacing limitations, bridge defects and edge placement errors.
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Alpha And Omega Semiconductor Announces Application-Specific EZBuck Regulator To Power Intel Meteor Lake And Arrow Lake Platforms
2/22/2024
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its new application-specific EZBuck regulator.
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Wipro And Intel Foundry Announce New Collaboration To Advance Chip Design And Development
2/21/2024
Wipro Limited, a leading global technology services and consulting company, today announced an expanded collaboration with Intel Foundry to accelerate chip design innovation. As the key Design Services and Alliance Partner, Wipro will work with Intel Foundry to accelerate the development of Intel’s most advanced process nodes, including the Intel18A process node.
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EdgeQ Deploys Arteris IP For Its 5G+AI Base Station-On-A-Chip For Wireless Infrastructure
2/13/2024
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that EdgeQ has deployed Arteris’ FlexNoC network-on-chip (NoC) IP on its revolutionary 5G and AI-driven Base Station-on-a-Chip.
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Redwire Space Announces Strategic Expansion Of Its In-Space Manufacturing Technology Portfolio To Tap Into Global Semiconductor Market
1/29/2024
Redwire Corporation, a leader in space infrastructure for the next generation space economy, announced today the strategic expansion of its in-space manufacturing technology portfolio with the first pathfinder mission for its autonomous semiconductor manufacturing platform, MSTIC. MSTIC will launch to the International Space Station (ISS) onboard Northrup Grumman’s 20th cargo resupply services mission (NG-20).
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Nanotronics To Present On Next Gen Semiconductor Material At Photonics West
1/25/2024
Nanotronics, the Industrial AI company, will exhibit their updated suite of AI-powered factory control tools at the annual SPIE Photonics West, the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics. The conference takes place from January 30th - February 1st.
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KYOCERA SLD Laser Demonstrates High-Speed Underwater Wireless Optical Communication And Custom GaN Laser Capabilities
1/25/2024
KYOCERA SLD Laser, Inc. (KSLD), a world leader in commercialization of laser light sources, has announced the demonstration of a high-speed, bidirectional link for Underwater Wireless Optical Communication (UWOC) and custom-chip gallium nitride (GaN) laser capabilities.
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Rakon Launches Small Form Factor IC-OCXO With 8hr Holdover For Cloud Data Centres And Next-Generation Telecom Networks
1/25/2024
Rakon has launched its first IC-OCXO products combining its in-house designed Mercury semiconductor chip and XMEMS resonators under the brand MercuryX. MercuryX OCXOs provide ultra-high stability and an extended holdover of 8 hours. in real-world conditions, all in a small form factor package size. The new OCXOs are an excellent fit for timing and synchronisation in AI computing / data centres and 5G, 5G Advanced and 6G telecommunications networks as well as satellite terminals and instrumentation.
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Moov Releases Equipment Management Software For Semiconductor Manufacturers
1/25/2024
Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced the release of its new Equipment Management Software (EMS) for semiconductor manufacturers.
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Keysight Introduces Chiplet PHY Designer For Simulating D2D To D2D PHY IP Supporting The UCIe Standard
1/24/2024
Keysight Technologies, Inc. introduces Chiplet PHY Designer, the latest member in its family of high speed digital design and simulation tools that provides die-to-die (D2D) interconnect simulation, which is a key step in verifying performance for heterogeneous and 3D integrated circuit (IC) designs commonly referred to as chiplets.