Latest Headlines

  1. Synopsys Teams Up With SEMI Foundation To Drive Workforce Development Initiatives In Semiconductor Industry 2/18/2025

    Synopsys, Inc. (Nasdaq: SNPS) and the SEMI Foundation today announced the signing of a Memorandum of Understanding (MoU) at Synopsys' corporate headquarters in Sunnyvale, Calif.

  2. Oso Semiconductor Closes $5.2M Seed Round To Power The Next Generation Of Phased Array Antennas In Satellite Communication, 5G And Radar Systems 2/12/2025

    Oso Semiconductor, a developer of power-efficient, high-performance, low-cost chipsets for next generation wireless communication and sensing applications, today announced it has raised an oversubscribed $5.2M seed round.

  3. Teledyne HiRel Semiconductors Releases Wideband 50 GHz RF Switch 2/4/2025

    Teledyne HiRel Semiconductors announces the availability of its latest rad-tolerant wideband 50 GHz RF switch, model TDSW050A2T.

  4. 3M Joins Consortium To Accelerate Semiconductor Technology In The US 2/3/2025

    3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers.

  5. Teradyne And Infineon Announce Strategic Partnership To Advance Power Testing 1/31/2025

    Teradyne, Inc. a leading supplier of automated test solutions, and Infineon Technologies AG , a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.

  6. OKI Achieves 3D Integration Of Thin-Film Analog ICs Using CFB Technology In Collaboration With Nisshinbo Micro Devices 1/28/2025

    OKI, in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of thin-film analog ICs (Note 2) using Crystal Film Bonding (CFB) technology (Note 3).

  7. TANAKA PRECIOUS METAL TECHNOLOGIES Develops AgSn TLP Sheet, A Sheet-Type Bonding Material For Power Semiconductors 1/23/2025

    TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. , which engages in the industrial precious metals business of TANAKA, has announced the development of the AgSn TLP sheet, a sheet-type bonding material designed for die attachment in the manufacturing of power semiconductor packages.

  8. Global AI And Semiconductor Leaders Converge At AISC 2025: Aitomatic Reveals Advances In Semiconductor Foundation Model Semikong 1/22/2025

    The Industrial AI Federation, Aitomatic, and the National Innovation Center of Vietnam announced today the AI-Semiconductor Conference (AISC) 2025.

  9. Element Six Unveils Groundbreaking Copper Diamond Composite To Power Advanced Semiconductor Devices 1/22/2025

    Element Six (E6), a pioneer in the development of synthetic diamond advanced material solutions, will launch an innovative Cu-diamond product at Photonics West 2025.

  10. Alif Semiconductor Pioneers Generative AI In Edge And Endpoint Devices With 2nd Generation Low-Power Ensemble MCUs 1/7/2025

    Alif Semiconductor®, a leading global supplier of secure, connected, power efficient Artificial Intelligence and Machine Learning (AI/ML) microcontrollers (MCUs) and fusion processors, has reinforced its position as the pioneer of endpoint AI MCUs with the announcement of the second generation of its Ensemble ® family of products.