Latest Headlines

  1. DG Matrix Selects Infineon As A Key Silicon Carbide Supplier For Its Multi-Port Solid-State Transformer Platform 3/24/2026

    DG Matrix, the global leader in solid-state transformer solutions, today announced that it will source latest-generation silicon carbide (SiC) MOSFETs from Infineon Technologies AG, a global semiconductor leader in power systems and IoT, for use in its Interport multi-port solid-state transformer platform.

  2. Semtech SurgeSwitch Tackles The USB-PD VBus Protection Gap At 53 V 3/24/2026

    Semtech Corporation, a leading provider of high-performance semiconductors powering data center networking, Internet of Things (IoT) connectivity and cellular infrastructure solutions, today announced the TDS5311P, the industry’s first circuit protection device to deliver near-constant clamping voltage for USB Power Delivery (PD) Extended Power Range (EPR) applications at 48 V.

  3. Power Integrations Extends The Power Range Of Flyback Topologies To 440W, Creating A Simpler Power Solution Than Resonant Designs 3/23/2026

    Power Integrations , a leading company in high-efficiency power conversion using high-voltage integrated circuits , today announced a breakthrough technology for flyback topologies, extending the power range of flyback converters to 440W—far exceeding the limits of traditionally more complex LLC resonant topologies.

  4. Lumotive Creates World's First 2D Photonic Beamforming Semiconductor 3/19/2026

    Lumotive, a pioneer in programmable optical semiconductor technology, today announced a landmark breakthrough with the successful demonstration of the world’s first programmable two-dimensional (2D) photonic beamforming chip based on its Light Control Metasurface (LCM) architecture.

  5. Fraunhofer IPMS Expands Its Service Portfolio To Include Ultratrace Elemental Analysis On Wafers 3/4/2026

    The Fraunhofer Institute for Photonic Microsystems IPMS is expanding its analytical capabilities in the field of wafer contamination.

  6. Tower Semiconductor To Participate At OFC 2026 Highlighting Its Silicon Photonics Platform For AI, Telecom And Emerging Applications 3/4/2026

    Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming OFC 2026 (Optical Fiber Communication Conference and Exhibition), taking place March 17–19, 2026 at the Los Angeles Convention Center in Los Angeles, California, booth #2221.

  7. SPS-International Partners With Innodis To Bring Advanced Fitting Solutions To The Semiconductor Industry 3/3/2026

    SPS-International, a specialized supplier of semiconductor equipment and cleanroom consumables, today announced a new partnership with Innodis to offer their advanced range of high-purity fittings.

  8. Longsys Showcases Embedded Integrated Storage Innovations At MWC 2026 to Accelerate On-Device AI 3/3/2026

    Longsys (301308.SZ), a leading branded semiconductor memory enterprise, is showcasing its latest embedded integrated storage solutions at MWC 2026.

  9. Faraday Broadens IP Offerings On UMC's 14nm Process For Edge AI And Consumer Markets 3/3/2026

    Faraday Technology Corporation a leading ASIC design and IP provider, today announced the continued expansion of its IP product lines on UMC’s 14nm FinFET Compact (14FCC) platform, covering USB 2.0/USB 3.2 Gen1 PHY, LVDS TX/RX I/O, DDR 3/4 combo PHY (up to 4.2 Gbps), and LPDDR 4/4X/5 PHY (up to 6.4 Gbps).

  10. United Semiconductors Reserves Payload Space With Starlab To Advance Commercial-Scale In-Space Semiconductor Manufacturing 3/3/2026

    Starlab Space LLC, the commercial space station developer expanding access to low Earth orbit research, today announced a payload reservation agreement with United Semiconductors LLC (USLLC) to support the transition of its space-based semiconductor crystal growth technology from demonstration aboard the International Space Station (ISS) to sustained commercial-scale production in low Earth orbit.