Latest Headlines

  1. Inprentus Has Been Awarded A Contract To Supply High-Precision Diffraction Gratings To The Semiconductor Industry For Metrology Applications 10/5/2022

    A contract has been awarded to Inprentus to supply custom manufactured diffraction gratings. These unique diffraction gratings will be used as optical components for semiconductor EUV metrology instrumentation manufactured by EUV Tech Inc. Inprentus and EUV Tech worked together to optimize the design of the optical components to maximize the efficiency and optical characteristics for the semiconductor metrology application.

  2. Materion Announces $20M In Investments In Massachusetts Facility To Expand Capacity For The Semiconductor Industry 10/4/2022

    Materion Corporation, a world leader in high-performing advanced materials, announced today that it is investing more than $20 Million in its recently acquired Newton, Massachusetts facility. The investments will significantly broaden capacity for materials used in semiconductor chip manufacturing and facilitate the continued development of products to support the logic and advanced chips found in today’s most powerful electronic devices.

  3. Vishay Intertechnology FRED Pt® Gen 5 600 V Hyperfast Rectifiers In Isolated Package Deliver Best In Class Reverse Recovery Performance 10/3/2022

    Vishay Intertechnology, Inc. (NYSE: VSH) today introduced four new FRED Pt® Gen 5 600 V Hyperfast rectifiers in a fully isolated TO-220 FullPAK 2L package. Offering the best reverse recovery performance for devices in their class, the 12 A VS-E5TW1206FP-N3 and VS-E5TX1206FP-N3 and 15 A VS-E5TW1506FP-N3 and VS-E5TX1506FP-N3 are designed to increase the efficiency of medium frequency converters and of hard- and soft-switched or resonant designs.

  4. Akoustis Receives Fourth Design Win For A New 5G Mobile Network Infrastructure XBAW Filter 9/28/2022

    Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) high-band RF filters for mobile and other wireless applications, announced that it has received a design win for its 3.5 GHz XBAW® filter from a new 5G mobile network infrastructure customer.

  5. GOWIN Semiconductor New 22nm High-Performance FPGA Family - Arora V 9/26/2022

    GOWIN Semiconductor Corporation, the world’s fastest growing FPGA company, announces today the release of its new generation Arora V high performance FPGA family utilizing advanced 22nm SRAM technology and integrating 270Mbps-12.5Gbps high speed SerDes interfaces, PCIe 2.1 hard core with support for PCIe x1, x2, x8 modes, along with MIPI hard core single lane module at up to 2.5Gbps, and DDR3 interfacing at speeds up to 1333 Mbps.

  6. FPT Software Launches Chipmaking Subsidiary; Produces First Semiconductor Chips 9/26/2022

    Vietnam’s leading ICT company FPT Software has launched a new subsidiary, FPT Semiconductor, marking a key milestone for the company as it enters the booming semiconductor industry. Through the new subsidiary, FPT Software aims to gain a slice of Asia Pacific’s semiconductor market which accounts for 60 percent of global sales1. IDC projects that worldwide semiconductor revenue will reach $661 billion in 2022, an increase of 13.7 percent over 20212.

  7. Advantest Launches ACS Solution Store To Enable Real-Time Data Analytics Solutions For Semiconductor Test 9/14/2022

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today rolled out the Advantest ACS Solution Store, an advanced online platform that provides ease of access to ACS real-time data infrastructure solutions and software applications.

  8. EV Group Revolutionizes 3D Integration From Advanced Packaging To Transistor Scaling With NanoCleave Layer Release Technology 9/12/2022

    EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced NanoCleave™, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as semiconductor advanced packaging.

  9. Wolfspeed Selects North Carolina For World’s Largest Silicon Carbide Materials Facility 9/9/2022

    Wolfspeed, Inc., the global leader in Silicon Carbide technology, today announced it will build a new, state-of-the-art, multi-billion-dollar Materials manufacturing facility in Chatham County, North Carolina.

  10. Exeger And Atmosic Technologies Partner To Create Energy Harvesting Solutions For The IoT Sector 9/9/2022

    Exeger, the Swedish deep tech company today announces its partnership with US-based semiconductor company Atmosic Technologies.