Latest Headlines

31. Applied Materials AI(x) Platform Harnesses The Power Of Big Data And AI To Accelerate Semiconductor Technology Breakthroughs From Lab To Fab 4/5/2021

    Applied Materials, Inc. today announced AIx TM, an innovative platform that accelerates the discovery, development and commercial deployment of new chip technologies.

32. Lavorro Selects Cimetrix Sapience® Data Collection Platform By PDF Solutions To Support Its Semiconductor Manufacturing AI/ML-Driven Smart-Bot Solution 3/30/2021

    PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor ecosystem, today announced that Lavorro Inc., a provider of integrated software solutions for semiconductor processing equipment, has selected the Cimetrix Sapience® platform to support the collection of manufacturing equipment data from the factory floor at a key customer.

33. Tower Semiconductor Introduces A Newly Developed, State-Of-The-Art Galvanic Isolation Technology 3/17/2021

    Tower Semiconductor (NASDAQ/TASE: TSEM), the leader in high-value analog semiconductor foundry solutions, today announced a newly developed, state-of-the-art galvanic capacitor technology integrated with its 0.18um power management and mixed-signal platforms, enabling up to 12kV isolated gate driver and digital isolator ICs, which enhance safety and power efficiency for applications in the automotive, green power and industrial markets, addressing an estimated $1B market.

34. Advantest To Exhibit Latest IC Test Solutions Advancing Technology Convergence At SEMICON China 2021 3/9/2021

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its newest products and solutions for advanced ICs at SEMICON China on March 17-19, 2021, at the Shanghai New International Expo Centre (SNIEC).

35. WISeKey Connects Its Digital Identity For People And Objects Semiconductor Install Base Of 1.6 Billion Secure Chips And 5 Billion Root Of Trust To HIRO Artificial Intelligence 3/9/2021

    WISeKey International Holding Ltd (“WISeKey”) (SIX: WIHN, NASDAQ: WKEY),), a leading global cybersecurity and IoT company today announced that its ecosystem of Digital Identity for people and objects is now connected to HIRO.

36. STMicroelectronics Boosts Automotive Innovation With Longevity Extension For Popular Body, Chassis, And Safety Microcontrollers 3/3/2021

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is extending its long-term commitment to support customers of the Company’s SPC56 automotive microcontrollers, which are deployed in millions of powertrain, chassis, and body-electronics applications worldwide.

37. NXP Unveils Advanced i.MX Applications Processors With Easy-To-Deploy Security, Energy Efficiency And Scalability For The Industrial And IoT Edge 3/1/2021

    NXP Semiconductors N.V. (NASDAQ: NXPI) today announces the expansion of its Edge se™ portfolio with its crosso applications processors, including i.MX 8ULP and i.MX 8ULP-CS (cloud secured) Microsoft Azure Sphere-certified families, as well as next-generation i.MX 9 series of high performance intelligent applications processors.

38. Bluetooth LE-Powered Wearable Delivers Wireless Smartphone Control For Active People 2/22/2021

    Nordic Semiconductor today announces that London, U.K.-based sports tech start-up, ArcX Technology, has selected Nordic’s nRF52832 Bluetooth Low Energy (Bluetooth LE) multiprotocol System-on-Chip (SoC) to provide the wireless connectivity for its ‘ArcX’ smart ring.

39. Quantum-Si, A Pioneer In Semiconductor Chip-Based Proteomics, To Combine With HighCape Capital Acquisition Corp. 2/18/2021

    Quantum-Si Incorporated (“Quantum-Si”, "QSi" or the "Company"), a pioneer in next generation semiconductor chip-based proteomics, and HighCape Capital Acquisition Corp. (Nasdaq: CAPA) (“HighCape”), a special purpose acquisition company sponsored by HighCape Capital LP, announced today that they have entered into a definitive business combination agreement.

40. Devices Could Become Even Smaller, More Powerful With Method For Integrating 2D Materials 2/10/2021

    If we could shrink semiconductors even further, a whole new silicon revolution would follow. But because that’s impossible, the next best hope is integrating semiconductors with 2D atomically-thin materials, such as graphene, upon which circuits can be created on an incredibly small scale.