Latest Headlines

31. Secafy Licenses Menta's eFPGA IP To Power Chiplet-Based Secure Semiconductor Designs 5/14/2025

    Menta SAS, a leading provider of embedded FPGA (eFPGA) IP, today announced that Japanese technology company Secafy has licensed Menta's eFPGA IP to integrate into its upcoming chiplet-based products.

32. ROOTS Develops Ultra-Compact 450㎛ PiG Technology Optimized For Smart Multi-Beam Headlights 5/8/2025

    ROOTS CO., LTD., a company with proprietary Phosphor in Glass (PiG) technology—an essential optical component in automotive headlights—has successfully developed an ultra-compact 450㎛ PiG optimized for next-generation smart multi-beam headlights.

33. NEO Semiconductor Unveils Breakthrough 1T1C And 3T0C IGZO-Based 3D X-DRAM Technology 5/7/2025

    NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its groundbreaking 3D X-DRAM technology family — the industry-first 1T1C- and 3T0C-based 3D X-DRAM cell, a transformative solution designed to deliver unprecedented density, power efficiency, and scalability for the most demanding data applications.

34. Global Semiconductor IDM Qualifies Veeco Wet Processing Platform For Two New Applications In Advanced Packaging 4/29/2025

    Veeco Instruments Inc. (NASDAQ: VECO) today announced a global Semiconductor IDM qualified Veeco’s WaferStorm® and WaferEtch® platform for two new applications in Advanced Packaging.

35. Silvaco Expands Product Offerings In Photonics And Wafer-Scale Plasma Modeling For AI Applications With Acquisition Of Tech-X Corporation 4/29/2025

    Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, today announced the strategic acquisition of Tech-X Corporation, a leading provider of multi-physics simulation software used in applications such as Photonics, Electromagnetics and Plasma Dynamics.

36. Orbic North America And GCT Semiconductor Sign LOI To Develop And Supply Orbic-Branded FWA Gateway And Mobile Hotspot With GCT's Verizon-Certified 5G Module 4/16/2025

    Orbic North America, LLC ("Orbic"), an international leader in mobile technology innovation, and GCT Semiconductor Holding, Inc. ("GCT") (NYSE: GCTS), a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced the signing of a letter of intent (LOI) for a partnership to jointly develop and supply an Orbic-branded mobile hotspot and FWA gateway utilizing a Verizon-certified 5G module based on GCT's new 5G chipset.

37. The Semiconductor Fund Launches As The First-Ever Opportunity Zone Fund Focused On The Semiconductor Industry 4/15/2025

    The Semiconductor Fund Launches as the First-Ever Opportunity Zone Fund Focused on the Semiconductor Industry.

38. lowRISC And SCI Semiconductor Release Sunburst Chip Repository For Secure Microcontroller Development 4/2/2025

    lowRISC C.I.C., the open silicon ecosystem organisation, together with SCI Semiconductor, a leader in CHERI solutions and both CHERI Alliance founding members, today announced the release of the open source Sunburst Chip design repository, a key milestone in phase two of the DSbD/UKRI-funded Sunburst Project (Grant Number: 107540).

39. Ansys Semiconductor Solutions Certified By TSMC For Reliable, Accurate Analysis Of Evolving Chip Designs 4/2/2025

    Ansys (NASDAQ: ANSS) today announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology.

40. Tokyo Electron And IBM Renew Collaboration For Advanced Semiconductor Technology 4/2/2025

    Today, IBM and Tokyo Electron (TEL) announced an extension of their agreement for the joint research and development of advanced semiconductor technologies.