Latest Headlines

31. Ambarella And INVO Tech Deliver Driver And Occupant Monitoring System For Mass Production Of GAC Motor SUVs 11/9/2022

    Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, and Suzhou INVO Automotive Electronics Co., Ltd. (hereafter referred to as “INVO Tech”), a progressive intelligent driving customized system supplier, today announced that INVO Tech’s Cockpit Super Sensory Interactive System based on the Ambarella CV25AQ AI perception system-on-chip (SoC), has been mass-produced and delivered on the GAC Motor SUVs. This cooperation makes driving safer by bringing multi-sensor perception technology to vehicle smart cockpits.

32. TESCAN Unveils New TENSOR Scanning Transmission Electron Microscope 11/8/2022

    TESCAN ORSAY HOLDING a.s. today announced the revolutionary new TENSOR―the first 4D-scanning transmission electron microscope (4D-STEM) built from the ground up for a totally new level of performance and user experience.

33. Weebit Nano Receives From SkyWater Technology The First Silicon Wafers It Manufactured With Embedded Weebit ReRAM 11/8/2022

    Weebit Nano Limited , a leading developer of next-generation memory technologies for the global semiconductor industry, and SkyWater Technology , the trusted technology realization partner, announce the first silicon wafers integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module have been delivered to Weebit from SkyWater’s U.S. production fab.

34. Aehr Receives Over $4M In Orders For Its FOX WaferPak™ Full Wafer Contactors To Support Production Test And Burn-In Of Silicon Carbide Power Semiconductors For Electric Vehicles 11/4/2022

    Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has received $4.4 million in orders from its lead silicon carbide test and burn-in customer for multiple WaferPak™ full wafer Contactors to meet their increased production capacity needs for silicon carbide power semiconductors for the electric vehicle market.

35. ASE Announces FOCoS Advancements Under The VIPack Platform 11/3/2022

    Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced today the industry’s first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated redistribution layer (RDL) and Chip Last (FOCoS-CL) semiconductor packaging solution that elevates the performance for High Performance Computing (HPC), under the ASE VIPack platform.

36. Quest Global Acquires Adept, A Product Design House 11/3/2022

    Quest Global, one of the world's fastest growing engineering services firms, today announced the acquisition of Adept, a product design house with robust capabilities in the semi-conductor, automotive, and hi-tech verticals.

37. Qorvo And SK Siltron CSS Announce Long-Term Silicon Carbide (SiC) Supply Agreement 11/2/2022

    Qorvo, a leading global provider of connectivity and power solutions, and SK Siltron CSS, a semiconductor wafer manufacturer, announced today they have finalized a multi-year supply agreement for silicon carbide (SiC) bare and epitaxial wafers.

38. AlixLabs AB Demonstrates Pitch Splitting In Bulk Silicon For Leading Edge Semiconductor Manufacturing 11/2/2022

    AlixLabs from Lund, Sweden, demonstrates pitch splitting in bulk silicon using their proprietary patterning technology for semiconductor device manufacturing. The company has developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the semiconductor manufacturing process - Atomic Layer Etch Pitch Splitting (APS)^*.

39. Pearl Semiconductor SpurFree™ Technology Paves Way For Ultra-Low Noise Timing Solutions For Data Center Connectivity 11/2/2022

    High-performance timing company Pearl Semiconductor announced a patented all-digital PLL technology for ultra-low-noise timing solutions. Pearl's "SpurFree" architecture is a critical necessity in timing solutions for next-generation connectivity standards that will handle increasing data flow within and between data centers, including optical transmission networks and 5G backhaul.

40. Yield Engineering Systems Partners With Benchmark For Global Engineering And Manufacturing Support 10/6/2022

    Benchmark Electronics, Inc. (NYSE: BHE), a global provider of engineering, design, and manufacturing services, today announced it is partnering with Yield Engineering Systems (YES) to transfer the manufacturing of the YES flagship product line to its facility in Malaysia, as well as providing engineering and manufacturing support for YES's upcoming innovative modular wet process systems in the Phoenix, Arizona area.