Latest Headlines
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Nordic Semiconductor’s nRF5340 Dual Arm Cortex-M33 Processor Wireless SoC For Complex IoT Applications, Including LE Audio, Enters Commercial Production
12/3/2020
Nordic Semiconductor today announces the ‘nRF5340 high-end multiprotocol System-on-Chip (SoC)’ has entered volume production.
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NXP Extends Its Leadership In 5G Infrastructure With 2nd Generation RF Multi-Chip Modules That Amp Up Frequency, Power And Efficiency
12/2/2020
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the availability of its 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements for cellular base stations.
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CEVA's High-Performance DSP Solution To Power Renesas' Next-Generation Automotive SoC
11/11/2020
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).
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NXP Tackles Cost And Complexity Of Automotive Software Development With New S32K3 MCUs
11/9/2020
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the S32K3 microcontroller (MCU) family, the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development.
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Bluetooth LE And Ultra-Wideband Modules Support Precision Positioning And Location-Awareness Applications
11/9/2020
Nordic Semiconductor today announces that Tsingoal (Beijing) Technology Co., Ltd., a China-based Ultra-Wideband (UWB) precision ranging and positioning solutions provider, has selected Nordic’s nRF52833 Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC) to provide the processing power and wireless connectivity for its TSG5162 System-in-Package (SiP) modules.
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Telink And Andes Announce The TLSR9 SoC With RISC-V Processor
11/2/2020
Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series. Powered by the 32-bit AndesCore™ D25F, the TLSR9 series is designed for the next generation of hearables, wearables, and other high-performance IoT applications.
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EvoNexus And GLOBALFOUNDRIES Team To Accelerate Growth Of Wireless And IoT Startups
10/26/2020
EvoNexus, a leading non-profit technology incubator, and GLOBALFOUNDRIES® (GF®), the world’s leading specialty semiconductor foundry, today announced their collaboration to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT).
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Applied Materials And BE Semiconductor Industries To Accelerate Chip Integration Technology For The Semiconductor Industry
10/22/2020
Applied Materials, Inc. and BE Semiconductor Industries N.V. (Besi) today announced an agreement to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
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Nordic-Powered Next Generation Micro:Bit To Support AI And Machine Learning Applications
10/13/2020
Nordic Semiconductor today announces that the Micro:bit Educational Foundation, a London, U.K.-based not-for-profit organization, has specified Nordic’s nRF52833 Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC) to provide the core processing and wireless connectivity for the latest micro:bit.
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NEC Selects NXP RF Airfast Multi-Chip Modules For Massive MIMO 5G Antenna Radio Unit For Rakuten Mobile In Japan
10/12/2020
NXP® Semiconductors N.V. (NXP; NASDAQ: NXPI) and NEC Corporation (NEC; TSE: 6701) today announced that NEC selected NXP to supply RF Airfast multi-chip modules to be used in a Massive MIMO 5G antenna Radio Unit (RU) for Rakuten Mobile, one of Japan’s leading mobile network operators.