Latest Headlines

31. EV Group And Teramount Announce Collaboration To Implement Innovative Packaging Technologies For Photonic Integrated Circuits 3/2/2022

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, and Teramount, the leader in scalable solutions for connecting optical fibers to silicon chips, announce a collaboration on implementing wafer-level optics to solve a major obstacle of silicon photonics, namely fiber chip packaging. The collaboration will leverage EVG's nanoimprint lithography (NIL) technology, expertise and services with Teramount's PhotonicPlug technology.

32. Surprising Semiconductor Properties Revealed With Innovative New Method 3/1/2022

    A research team probing the properties of a semiconductor combined with a novel thin oxide film have observed a surprising new source of conductivity from oxygen atoms trapped inside.

33. Silanna Semiconductor Extends All-Silicon Reference Design Family To 65W 2/23/2022

    Silanna Semiconductor, The Power Density Leader, has launched a new active clamp flyback (ACF)-based reference design that simplifies and speeds the development of 65W 1C fast charger applications built using silicon power ICs.

34. IDTechEx Discuss The 5G Materials Battle: Sub-6 GHz vs mmWave 2/11/2022

    5G deployment is in full swing with mid-band infrastructure installed by the end of 2021 representing nearly 6 times what it was in 2019. However, this doesn't mean that all of the challenges have been solved. Much of the 5G infrastructure is repurposed 4G equipment at lower frequency bands.

35. Speeding Through Nanowire: Nanowires Under Tension Create The Basis For Ultrafast Transistors 2/7/2022
36. eMemory Partners With Intel Foundry Services To Boost Security In Leading-Edge Chips 2/7/2022

    eMemory Technology Inc., Asia's largest provider of semiconductor intellectual property (IP), today announced it is joining Intel Foundry Services (IFS) Accelerator – IP Alliance. The collaboration will provide the leading-edge security solutions for mutual customers with IFS.

37. Toshiba To Expand Power Semiconductor Production Capacity With 300-millimeter Wafer Fabrication Facility 2/4/2022

    Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced that it will construct a new 300-milimeter wafer fabrication facility for power semiconductors at its main discrete semiconductor production base, Kaga Toshiba Electronics Corporation, in Ishikawa Prefecture.

38. High Accuracy R-Theta 2-Axis Stages For Nanometer Precision Motion In Semiconductor And Laser Processing Applications 1/26/2022
39. Silanna Semiconductor Moves To Full Production Of Active Clamp Flyback (ACF) Controllers For Power Adapters Beyond 100W 1/26/2022

    Silanna Semiconductor, The Power Density Leader, has announced the full production release of an integrated active clamp flyback (ACF) controller that reduces the operational and no-load/ stand-by power consumption of high-efficiency chargers and adapters while driving down component count, BOM cost and size.

40. Top Tier Semiconductor Supplier Qualifies Veeco’s Wet Processing System For Next Generation High Bandwidth Memory Applications 1/25/2022

    Veeco Instruments Inc. (NASDAQ: VECO) today announced that a world leading semiconductor supplier has qualified Veeco’s WaferStorm® Wet Processing System for advanced packaging applications that will support next generation high bandwidth memory (HBM).