Latest Headlines

  1. TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone 5/16/2026

    TetraMem Inc., a Silicon Valley–based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22nm multi-level RRAM-based analog IMC system-on-chip (SoC).

  2. LTSCT Expands Advanced Power Design Capabilities With Synopsys 5/12/2026

    L&T Semiconductor Technologies Ltd (LTSCT), a leading Indian fabless semiconductor company and a wholly-owned subsidiary of Larsen & Toubro (L&T), today announced a multiyear license agreement with Synopsys Inc., a leader in engineering solutions from silicon to systems, to strengthen its advanced power electronics design capabilities and support India’s growing semiconductor ecosystem.

  3. Oracle Java To Power Samsung Electronics' Global Semiconductor Development 5/12/2026

    Oracle today announced that the Oracle Java SE Universal Subscription will help standardize global software development atSamsung Electronics, a world leader in advanced semiconductor technology.

  4. Siemens Collaborates With TSMC To Advance AI For Semiconductor Design 4/22/2026

    Siemens today announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.

  5. Applied Materials Announces Advantest As Innovation Partner For EPIC Platform In Silicon Valley 4/21/2026

    Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, today announced that Advantest Corporation (TSE: 6857), a leading semiconductor test equipment supplier, will join Applied’s EPIC platform as an innovation partner to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages, helping chipmakers bring new designs to market faster.

  6. ISRL USA And AI Infrastructure Partners Sign MOU To Build America's First Dedicated Semiconductor SubFAB R&D Facility 4/21/2026

    International SubFAB Research Labs (ISRL USA) and AI Infrastructure Partners (AIIP) today announced a memorandum of understanding (MOU) to design, build, and operate the United States’ first purpose-built research and development facility dedicated to semiconductor subfab infrastructure—a critical step toward enabling sustainable, high-volume semiconductor manufacturing at scale.

  7. yieldWerx And Enlight Technology Extend Design-To-Test Data Continuity Across Taiwan's Semiconductor Ecosystem 4/21/2026

    yieldWerx is expanding its presence in Taiwan through a collaboration with Enlight Technology Co., Ltd., bringing advanced test data aggregation and analysis capabilities to one of the world's most concentrated semiconductor markets.

  8. Silvaco Partners With ITRI To Support MCU Development And Startup Innovation 4/20/2026

    Silvaco Group, Inc. ("Silvaco"), a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, today announced a strategic partnership with the Industrial Technology Research Institute (ITRI).

  9. DEEPX Secures 27 Commercial Orders Across 8 Countries Within 7 Months Of Mass Production 3/27/2026

    DEEPX, a Seoul-based fabless semiconductor company developing ultra-low-power AI inference chips for physical AI applications, has secured 27 commercial purchase orders across eight countries within seven months of starting mass production of its first-generation AI chip — a pace that industry observers describe as highly unusual for an emerging fabless company at such an early stage of commercialization.

  10. Velaura AI Unveils Silicon Design And IP Platform Enabling Up To 2x Lower Power For AI Accelerators 3/24/2026

    Velaura AI, Inc. (formerly Auradine) today announced Titan Core™, a breakthrough silicon design and IP platform engineered to redefine power efficiency for AI accelerators.