Latest Headlines

  1. Secafy Licenses Menta's eFPGA IP To Power Chiplet-Based Secure Semiconductor Designs 5/14/2025

    Menta SAS, a leading provider of embedded FPGA (eFPGA) IP, today announced that Japanese technology company Secafy has licensed Menta's eFPGA IP to integrate into its upcoming chiplet-based products.

  2. ROOTS Develops Ultra-Compact 450㎛ PiG Technology Optimized For Smart Multi-Beam Headlights 5/8/2025

    ROOTS CO., LTD., a company with proprietary Phosphor in Glass (PiG) technology—an essential optical component in automotive headlights—has successfully developed an ultra-compact 450㎛ PiG optimized for next-generation smart multi-beam headlights.

  3. NEO Semiconductor Unveils Breakthrough 1T1C And 3T0C IGZO-Based 3D X-DRAM Technology 5/7/2025

    NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its groundbreaking 3D X-DRAM technology family — the industry-first 1T1C- and 3T0C-based 3D X-DRAM cell, a transformative solution designed to deliver unprecedented density, power efficiency, and scalability for the most demanding data applications.

  4. Stratedge LPA-Series Semiconductor Packages Take Center Stage At CS Mantech And Space Tech Expo USA 5/6/2025

    StratEdge Corporation, leader in the design, production, and assembly of high-frequency and high-power semiconductor packages for RF, microwave, and millimeter-wave devices, will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech, taking place May 19–21 at the Hilton New Orleans Riverside, and in Booth 723 at Space Tech Expo USA, June 2–4 at the Long Beach Convention Center.

  5. Alpha And Omega Semiconductor Enables 48V Hot Swap In AI Servers With New High SOA MOSFET 5/1/2025

    Alpha and Omega Semiconductor Limited (AOS) , a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its AOTL66935 utilizes AOS’ 100V AlphaSGT proprietary MOSFET technology which combines the advantages of trench technology for low on-resistance with high safe operating area (SOA) capability that meets 48V hot swap requirements in AI server and telecom applications.

  6. Global Semiconductor IDM Qualifies Veeco Wet Processing Platform For Two New Applications In Advanced Packaging 4/29/2025

    Veeco Instruments Inc. (NASDAQ: VECO) today announced a global Semiconductor IDM qualified Veeco’s WaferStorm® and WaferEtch® platform for two new applications in Advanced Packaging.

  7. Silvaco Expands Product Offerings In Photonics And Wafer-Scale Plasma Modeling For AI Applications With Acquisition Of Tech-X Corporation 4/29/2025

    Silvaco Group, Inc. (Nasdaq: SVCO) (“Silvaco” or the “Company”), a provider of TCAD, EDA software and SIP solutions that enable semiconductor design and digital twin modeling through AI software and innovation, today announced the strategic acquisition of Tech-X Corporation, a leading provider of multi-physics simulation software used in applications such as Photonics, Electromagnetics and Plasma Dynamics.

  8. ChEmpower Secures $18.7M To Advance Abrasive-Free Planarization In Chip Manufacturing 4/24/2025

    ChEmpower, a semiconductor materials company providing polish pads and chemical solutions for planarization, announced it has raised $18.7M in Series A funding.

  9. Polar Signs Agreement With Renesas To License GaN-on-Si Technology And Onshore Commercial Fabrication Of Advanced Devices On 200mm Wafers 4/16/2025

    Polar Semiconductor (“Polar”), the only U.S.-owned merchant foundry specializing in sensor, power, and high-voltage semiconductors, announced today the finalization of a strategic agreement with Renesas Electronics Corporation (“Renesas”) to license their Gallium Nitride on Silicon D-Mode (GaN-on-Si) technology.

  10. Spirit Electronics Expands U.S. Semiconductor Capacity With Acquisition Of SMART Microsystems 4/16/2025

    As part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.