Latest Headlines

  1. NEO Semiconductor Introduces World's First Extreme High Bandwidth Memory (X-HBM) Architecture For AI Chips 8/5/2025

    NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips.

  2. UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance And Enhanced Manageability 8/5/2025

    Universal Chiplet Interconnect Express (UCIe) Consortium, the open standard for interconnects between chiplets within a package, today announced the release of the UCIe 3.0 specification, marking the next stage in the evolution of its open chiplet standard.

  3. iDEAL Signs Technology Partner Agreement For SuperQ MOSFETs With Power System Specialist Richardson Electronics, Ltd 7/31/2025

    iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.

  4. Navitas Powers Xiaomi's Next Generation GaN Charger 7/31/2025

    Navitas Semiconductor (Nasdaq: NVTS), the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, today announced that Xiaomi’s next-generation 90W GaN charger will be powered by Navitas’ GaNSense Control ICs.

  5. Rigaku Launches XTRAIA XD-3300 Mass Production For Semiconductor Market 7/29/2025

    Rigaku Corporation, a global solution partner in X-ray metrology systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), has launched full-fledged commercial production of XTRAIA XD-3300, a high-resolution microspot X-ray diffraction system.

  6. SkyWater Technology Expands Leadership In U.S. Semiconductor Manufacturing With Infineon IP License Agreement 7/29/2025

    SkyWater Technology, the trusted technology realization partner, today announced a license agreement with Infineon Technologies, granting access to a robust library of silicon-proven, mixed-signal ASIC design IP.

  7. CoAsia SEMI And Rebellions Join Forces To Jointly Develop Next-Generation AI Chiplet Based On REBEL 7/28/2025

    CoAsia SEMI (CEO DS, Shin), a system semiconductor design specialist subsidiary of CoAsia, is supporting the development of AI chiplet and software solutions for data centers by providing its advanced packaging technologies to Rebellions (CEO Sung hyun, Park), a Korean AI semiconductor unicorn.

  8. STMicroelectronics To Strengthen Position In Sensors With Acquisition Of NXP's MEMS Sensors Business 7/24/2025

    STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is strengthening its global sensors capabilities with the planned acquisition of NXP Semiconductors’ (NASDAQ: NXPI) MEMS sensors business, focused on automotive safety products as well as sensors for industrial applications.

  9. Teledyne HiRel Semiconductors Announces High-Density 16 GByte DDR4 Module 7/24/2025

    Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C.

  10. Incize And Atomera Announce Strategic Collaboration To Advance GaN-On-Si Technology For Next-Gen RF And Power Devices 7/9/2025

    Incize, a Belgian cutting-edge semiconductor characterization and modeling company, and Atomera, a pioneer in advanced semiconductor materials, today announced a strategic collaboration to enhance Gallium Nitride on Silicon (GaN-on-Si) technologies.