Latest Headlines
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Lattice Accelerates Development Of Low Power FPGA-Based Custom Solutions With Lattice Design Group
11/11/2020
Lattice Semiconductor Corporation, the low power programmable leader, today announced the Lattice Design Group (LDG) to bring added focus to its comprehensive design services for accelerating the development of differentiated, value-added customer applications.
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CEVA's High-Performance DSP Solution To Power Renesas' Next-Generation Automotive SoC
11/11/2020
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies, today announced that Renesas has licensed a new, high-performance CEVA DSP to power its next-generation automotive System-on-Chip (SoC).
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Spectra7 Announces Longer Reach Active Copper Cable Solution For Data Center Connectivity Applications
11/10/2020
Spectra7 Microsystems Inc. (“Spectra7” or the “Company”), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, today announced the GC2802 IC to support longer reach data center server interconnect applications.
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Alpha And Omega Semiconductor Releases Fast Switching 600V αMOS5 Super Junction MOSFETs In SMD-Type TOLL Package
11/10/2020
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, today announced the release of a Fast Switching 600V αMOS5 Super Junction MOSFETs in SMD-type TOLL Package.
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Motor Development Kit From ON Semiconductor Prioritizes Energy Efficiency
11/9/2020
ON Semiconductor, driving energy efficient innovations, has introduced its advanced and flexible Motor Development Kit to accelerate the development of more efficient motor control solutions for applications ranging from less than 1 kW to over 10 kW.
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SiPM dToF LiDAR Platform From ON Semiconductor Provides Ready-To-Use Design For Industrial Range Finding Applications
11/9/2020
ON Semiconductor, driving energy efficient innovations, has introduced a single point direct Time-of-Flight (dToF) LiDAR solution enabled by the company's Silicon Photomultiplier (SiPM) technology.
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NXP Tackles Cost And Complexity Of Automotive Software Development With New S32K3 MCUs
11/9/2020
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the S32K3 microcontroller (MCU) family, the newest addition to its S32K product line. The S32K1 family, released in 2017, marked an important turning point in addressing software’s central role in automotive development.
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Bluetooth LE And Ultra-Wideband Modules Support Precision Positioning And Location-Awareness Applications
11/9/2020
Nordic Semiconductor today announces that Tsingoal (Beijing) Technology Co., Ltd., a China-based Ultra-Wideband (UWB) precision ranging and positioning solutions provider, has selected Nordic’s nRF52833 Bluetooth Low Energy (Bluetooth LE) advanced multiprotocol System-on-Chip (SoC) to provide the processing power and wireless connectivity for its TSG5162 System-in-Package (SiP) modules.
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Telink And Andes Announce The TLSR9 SoC With RISC-V Processor
11/2/2020
Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series. Powered by the 32-bit AndesCore™ D25F, the TLSR9 series is designed for the next generation of hearables, wearables, and other high-performance IoT applications.
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EvoNexus And GLOBALFOUNDRIES Team To Accelerate Growth Of Wireless And IoT Startups
10/26/2020
EvoNexus, a leading non-profit technology incubator, and GLOBALFOUNDRIES® (GF®), the world’s leading specialty semiconductor foundry, today announced their collaboration to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT).