Latest Headlines

  1. Axcelis Unveils Purion H6: Next-Generation High Current Ion Implanter For Advanced Semiconductor Manufacturing 2/4/2026

    Axcelis Technologies, Inc. (NASDAQ:ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today introduced the Purion H6™ high current ion implanter—engineered to meet the demands of next-generation semiconductor devices with unmatched purity, precision and productivity.

  2. Siemens Acquires Canopus AI To Bring AI-Based Metrology To Semiconductor Manufacturing 2/4/2026

    Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.

  3. THine Announces Its Optical DSP-Free Chipset, Best Suited For 'Slow And Wide' Interconnection In Scale-Up AI Networks Of The Next Generation 2/1/2026

    THine Electronics, Inc. a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, today announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW technology for short-reach optical interconnect of PCI Express7(PCIe7) 2TB/s linear pluggable optics(LPO) or co-packaged optics(CPO), enabling to save power by 73% and lower latency by 90%.

  4. Nova Announces Adoption Of Metrion® By Two Leading Global Manufacturers 1/29/2026

    Nova (Nasdaq:NVMI) a leading innovator in metrology and process control solutions for advanced semiconductor manufacturing, today announced the adoption of its Nova Metrion® platform by global leaders in Memory and Logic device production.

  5. Arasan Announces The Immediate Availability Of The Industry's First xSPI NOR + eMMC NAND Combo PHY IP 1/29/2026

    Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, today announced the immediate availability of its xSPI + eMMC combo PHY IP. This IP integrates both xSPI and eMMC 5.1 PHY into a single, unified solution, enabling support for two different storage protocols within the same IP.

  6. 2.5Gbps MIPI D-PHY Redriver From Diodes Incorporated Optimizes Signal Integrity For Automotive Camera Monitoring Systems And ADAS 1/29/2026

    Diodes Incorporated (Diodes) today announces the release of the automotive-compliant* PI2MEQX2505Q

  7. Credo Introduces Industry's First 224G Multiprotocol AI Scale-Up Retimer Supporting UALink, ESUN And Ethernet 1/29/2026

    Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced its Blue Heron 224G AI scale-up retimer, optimized to support the growing need for extended cable and PCB backplane links using UALink, ESUN, and Ethernet protocols.

  8. SK Keyfoundry Launches 4th-Generation 200V High-Voltage 0.18 Micron BCD Process, Accelerating Expansion Into Automotive•AI Power Semiconductor Markets 1/28/2026

    SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has recently launched its fourth-generation 200V high-voltage 0.18-micron BCD (Bipolar-CMOS-DMOS) process and will begin full-scale product development with major domestic and global customers, targeting mass production within the year.

  9. EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI 1/28/2026

    EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC).

  10. FPT Announces The Establishment Of An Advanced Semiconductor Testing And Packaging Plant, Accelerating The Integration Of Vietnam's Semiconductor Value Chain 1/28/2026

    On January 28, 2026, in Hanoi,FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming to strengthen connectivity across the semiconductor value chain and to realize Vietnam's major national orientations on mastering core and sovereign technologies, in line with Resolution No. 57-NQ/TW, Decision No. 1131/QĐ-TTg and Decision No. 1018/QĐ-TTg, thereby enabling Vietnam to move deeper into the global semiconductor supply chain.