Latest Headlines
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Teledyne HiRel Semiconductors Releases Wideband 50 GHz RF Switch
2/4/2025
Teledyne HiRel Semiconductors announces the availability of its latest rad-tolerant wideband 50 GHz RF switch, model TDSW050A2T.
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3M Joins Consortium To Accelerate Semiconductor Technology In The US
2/3/2025
3M is expanding its commitment to the semiconductor industry by joining the US-JOINT Consortium, a strategic partnership of 12 leading semiconductor suppliers.
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Teradyne And Infineon Announce Strategic Partnership To Advance Power Testing
1/31/2025
Teradyne, Inc. a leading supplier of automated test solutions, and Infineon Technologies AG , a global semiconductor leader in power systems and IoT, today announced they have entered into a strategic partnership to advance power semiconductor test.
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OKI Achieves 3D Integration Of Thin-Film Analog ICs Using CFB Technology In Collaboration With Nisshinbo Micro Devices
1/28/2025
OKI, in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of thin-film analog ICs (Note 2) using Crystal Film Bonding (CFB) technology (Note 3).
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TANAKA PRECIOUS METAL TECHNOLOGIES Develops AgSn TLP Sheet, A Sheet-Type Bonding Material For Power Semiconductors
1/23/2025
TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. , which engages in the industrial precious metals business of TANAKA, has announced the development of the AgSn TLP sheet, a sheet-type bonding material designed for die attachment in the manufacturing of power semiconductor packages.
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Global AI And Semiconductor Leaders Converge At AISC 2025: Aitomatic Reveals Advances In Semiconductor Foundation Model Semikong
1/22/2025
The Industrial AI Federation, Aitomatic, and the National Innovation Center of Vietnam announced today the AI-Semiconductor Conference (AISC) 2025.
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Element Six Unveils Groundbreaking Copper Diamond Composite To Power Advanced Semiconductor Devices
1/22/2025
Element Six (E6), a pioneer in the development of synthetic diamond advanced material solutions, will launch an innovative Cu-diamond product at Photonics West 2025.
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Guerrilla RF Unveils New Gallium Nitride (GaN) Dice For High-Performance RF Applications
1/16/2025
Guerrilla RF, Inc. announces the formal release of the GRF0020D and GRF0030D, the first in a new class of GaN on SiC HEMT power amplifiers being developed by the company.
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onsemi Completes Acquisition Of Qorvo's Silicon Carbide JFET Technology Portfolio
1/15/2025
onsemi today announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115M in cash.
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Polar Semiconductor Announces New Technology To Support U.S. National Security With Domestic Manufacturing Of High Voltage Power Management Devices
1/15/2025
Polar Semiconductor (“Polar”), the only U.S.-owned merchant foundry specializing in sensor, power and high-voltage semiconductors, announced that it has signed a technology licensing agreement with Tower Semiconductor (“Tower”) to enable domestic production of Tower’s robust TS18 Power Management (“TS18PM”) process.