Latest Headlines

1. Resonac Launches 27-Member "JOINT3" Consortium To Develop Next-Generation Semiconductor Packaging 9/3/2025

   Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc.

2. Pfeiffer Vacuum+Fab Solutions Showcases Complete Range Of Semiconductor Solutions At SEMICON West 2025 8/29/2025

   As a leading provider of innovative vacuum and abatement solutions, Pfeiffer Vacuum+Fab Solutions aims to showcase its comprehensive range of products and services designed to optimize semiconductor manufacturing processes.

3. CG Semi Unveils One Of India's First End-To-End OSAT Facilities In Sanand, Gujarat 8/28/2025

   CG Semi Private Limited (“CG Semi”), a subsidiary of CG Power and Industrial Solutions Limited (“CG Power”) and part of the Murugappa Group, has announced the launch of its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.

4. Marvell Unveils Industry's First 64 Gbps/Wire Bi-Directional Die-To-Die Interface IP In 2nm To Power Next Generation XPUs 8/26/2025

   Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area.

5. Rapidus Announces Strategic Collaboration With Keysight To Improve Yield And Achieve High-Precision PDK For 2nm GAA Semiconductors 8/26/2025

   Rapidus Corporation, a leading-edge Japanese foundry that manufactures advanced logic semiconductors, today announced a strategic collaboration with Keysight Technologies Japan K.K., the Japanese subsidiary of Keysight Technologies, Inc., and has signed a Memorandum of Cooperation.

6. Rigaku Launches Sales Of The XHEMIS TX-3000, A TXRF Analytical System For Leading-Edge Semiconductor Processes 8/26/2025

   Rigaku Corporation, a global solution partner in X-ray analytical systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched sales of the XHEMIS (pronounced “ZEM-mis”) TX-3000, a total reflection X-ray fluorescence (TXRF) system that supports analysis of trace contamination on wafer surfaces in semiconductor manufacturing.

7. Xscape Photonics And Tower Semiconductor Unveil The Industry's First Optically Pumped On-Chip Multi-Wavelength Laser Platform For AI Datacenter Fabrics 8/25/2025

   Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, and Xscape Photonics, a U.S.-based innovator in advanced photonic interconnects funded by industry leaders such as NVIDIA and Cisco, today announced the successful prototyping and validation kit availability of the industry’s first on-chip, optically pumped, multi-wavelength laser source

8. Rocket Lab Announces Expanded U.S. Investments For National Security Programs And Semiconductor Manufacturing 8/22/2025

   Rocket Lab Corporation (“Rocket Lab” or “the Company”), a global leader in launch services and space systems, today announced it is boosting its U.S.

9. Hyundai Mobis Acquires Semiconductor Development Process Certification For ISO 26262 ASIL-D 8/21/2025

   Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process.

10. Nordson Electronics Solutions To Exhibit High-Yield Fluid Dispensing Technologies For Panel-Level And Wafer-Level Packaging At SEMICON Taiwan 2025 8/18/2025

    Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.