Latest Headlines

1. Samsung Announces Availability Of Its Leading-Edge 2.5D Integration 'H-Cube' Solution For High Performance Applications 11/11/2021

   Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center and network products that require high-performance and large-area packaging technology.

2. Transphorm’s SuperGaN Gen IV Multi-Kilowatt Class Power FET Earns Automotive Qualification 11/10/2021

   Transphorm Inc.—a pioneer in and global supplier of high reliability, high performance gallium nitride (GaN) power conversion products—today announced that its flagship SuperGaN Gen IV 35 milliohm device has successfully completed the Automotive Electronics Council’s AEC-Q101 stress tests for automotive-grade discrete semiconductors.

3. Renesas Expands Lineup Of 28nm Cross-Domain Automotive Control Microcontrollers 11/9/2021

   Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced a powerful new group of microcontrollers (MCUs), the RH850/U2B MCUs, designed to address the growing need to integrate multiple applications into a single chip and realize a unified electronic control unit (ECU) for the evolving electrical-electronic (E/E) architecture.

4. Advantest Launches New Channel Cards, Adding Software-Based Functional Test And HSIO SCAN Test To The V93000 Platform 11/8/2021

   Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has launched its new Link Scale™ family of digital channel cards for the V93000 platform, enabling software-based functional testing and USB / PCI Express (PCIe) SCAN testing of advanced semiconductors.

5. Lattice To Host Webinar On Low Power Edge AI/ML Development With sensAI Solution Stack 11/5/2021

   Lattice Semiconductor Corporation, the low power programmable leader, will host a free webinar on developing low power Edge AI/ML applications using the award-winning Lattice sensAI solution stack on Wednesday, Nov. 17, 2021 for system and application engineers looking to quickly add more intelligence to their designs.

6. Tessolve Joins GlobalFoundries’ Design Enablement Network Program As A Design Partner To Bring Advanced Design Solutions To Accelerate Customer Product Development 11/3/2021

   Tessolve (www.tessolve.com), one of the global leaders providing semiconductor engineering solutions, has joined the GlobalFoundries (GF) Design Enablement Network Program.

7. Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform And Industry’s First 8MHz Reference Design 11/2/2021

   Morse Micro, a fabless semiconductor company reinventing Wi-Fi for the Internet of Things (IoT), today announced one of the industry’s first Wi-Fi CERTIFIED HaLow solutions and industry’s first 8 MHz reference design, highlighting the company’s technology leadership.

8. DNP Develops Lead Frame For Miniaturized, Highly Reliable Semiconductor Package QFN (Quad Flat Non-Leaded) 10/27/2021

   Dai Nippon Printing Co., Ltd. has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames that fix semiconductor chips and connects them externally.

9. indie Semiconductor Enters Definitive Agreement To Acquire Analog Devices’ Symeo Radar Division 10/25/2021

   indie Semiconductor, Inc., an Autotech solutions innovator, has executed a definitive agreement with Analog Devices, Inc. to purchase Symeo GmbH, ADI’s Munich-based radar division consisting of approximately 35 team members specializing in radar hardware and software development for emerging safety system applications.

10. Toshiba Shrinks Quantum Key Distribution Technology To A Semiconductor Chip 10/21/2021

    Toshiba Europe Ltd today announced it has developed the world’s first chip-based quantum key distribution (QKD) system.