Latest Headlines

  1. Ansys Significantly Increases Speed And Capacity Of Semiconductor Signoff With Massively Scalable SeaScape Platform 6/8/2022

    Ansys (NASDAQ: ANSS) announced the release of two new semiconductor products – Ansys® Totem-SC™ and Ansys® PathFinder-SC™ – for power integrity and electrostatic discharge (ESD) reliability signoff, respectively.

  2. Empower Semiconductor To Showcase Innovation In Integrated Voltage Regulator And Silicon Capacitor Technologies At TSMC 2022 NA Technology Symposium 6/8/2022

    Empower Semiconductor, Inc. the world leader in integrated voltage regulators (IVRs) and silicon capacitors has announced that it will be participating at TSMC’s 2022 NA Technology Symposium at the Santa Clara Convention Center on June 16th, 2022.

  3. Navitas Highlights Long-Term Partnership With TSMC And Record GaN Shipments At TSMC 2022 Technology Symposium 6/8/2022

    Navitas Semiconductor (Nasdaq: NVTS), the industry-leader in gallium nitride (GaN) power integrated circuits, has announced its participation in the TSMC 2022 North America Technology Symposium on June 16, 2022, in Santa Clara, USA.

  4. Tower Semiconductor To Showcase Key Process And PDK Features Of Its Silicon Photonics Process 6/8/2022

    Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, today announced a webinar titled “Develop and Verify Designs Using a Silicon Photonics Platform with Integrated Lasers”. 

  5. Kandou Joins Global Semiconductor Alliance 6/7/2022

    Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions that improve the way the world connects and communicates, today joined the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry.

  6. ASE Introduces VIPack To Help Transform Packaging Solution Enablement 6/1/2022

    Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., today introduced VIPack, an advanced packaging platform designed to enable vertically integrated package solutions.

  7. Allegro MicroSystems Announces Agreement To Acquire Heyday Integrated Circuits 5/31/2022

    Allegro MicroSystems (Allegro), a global leader in sensing and power semiconductor solutions for motion control and energy-efficient systems, today announced the entry into an agreement to acquire Heyday Integrated Circuits (Heyday). Heyday is a privately-held company specializing in compact, fully-integrated isolated gate drivers that enable energy conversion in high-voltage gallium nitride (GaN) and silicon carbide (SiC) wide-bandgap (WBG) semiconductor designs.

  8. The MOSIS Service Of USC Information Sciences Institute And WIN Semiconductors Corp To Collaborate On III-V Compound Semiconductor Manufacturing 5/31/2022

    The MOSIS Service of Information Sciences Institute, University of Southern California and WIN Semiconductors Corp. today announced a Memorandum of Understanding to accelerate the development of GaAs and GaN Monolithic Microwave Integrated Circuits (MMICs) with WIN Semiconductors’ GaAs and GaN process technologies.

  9. Silanna Semiconductor’s Roll Out Of AnyPort™ Architecture Will Dramatically Simplify Development Of Multi Port Chargers 5/24/2022

    Silanna Semiconductor, The Power Density Leader, has announced that it will be making its flexible AnyPort™ architecture for multiport chargers available for a wide variety of silicon- and GaN-based designs supporting power levels beyond 100W.

  10. Diamondx Selected For Internet Of Things Semiconductor Test 5/23/2022

    Cohu, Inc., a global leader in back-end semiconductor equipment and services, today announced a leading U.S. semiconductor manufacturer has selected the Diamondx platform for testing their product portfolio.