Latest Headlines

  1. Plasma-Therm Strengthens Presence In Europe To Collaborate With Customers On New Microelectronics Development 11/15/2022

    SEMICON Europa — Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor and compound semiconductor markets, today announced its Grenoble location will serve as regional headquarters to support customers located in central Europe, Middle East and North Africa (EMEA) markets focused on developing power, wireless, memory, sensor and MEMS, and other advanced microelectronic devices.

  2. New NXP Analog Front-End Enables The Software-Defined Factory 11/14/2022

    Electronica -- NXP Semiconductors (NASDAQ: NXPI) today announced its new NXP analog front-end (N-AFE) family for high-precision data acquisition and condition monitoring systems for factory automation.

  3. Montage Technology Selects PDF Solutions® Exensio® Fabless For Advanced Semiconductor Analytics 11/14/2022

    PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of unified data and cloud analytics for the semiconductor ecosystem, today announced that Montage Technology selected PDF Solutions’ Exensio Fabless as its semiconductor analytics platform. Exensio Fabless is designed with a powerful and flexible analytics environment, which PDF Solutions believes was a critical factor in the decision.

  4. AMP’s Innovative Electric Vehicle Charging Solutions Utilize Wolfspeed’s E-Series Silicon Carbide Devices 11/9/2022

    AMP, a global leader in connected battery management and charging technologies for electric mobility, today announced the integration of Wolfspeed’s E-Series Silicon Carbide MOSFETs into AMP’s e-mobility Energy Management Unit. Using Wolfspeed’s innovative Silicon Carbide technology allows AMP to optimize battery performance, charging, and costs. “At AMP, we understand the power that Silicon Carbide brings to vehicle electrification.

  5. Ambarella And INVO Tech Deliver Driver And Occupant Monitoring System For Mass Production Of GAC Motor SUVs 11/9/2022

    Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, and Suzhou INVO Automotive Electronics Co., Ltd. (hereafter referred to as “INVO Tech”), a progressive intelligent driving customized system supplier, today announced that INVO Tech’s Cockpit Super Sensory Interactive System based on the Ambarella CV25AQ AI perception system-on-chip (SoC), has been mass-produced and delivered on the GAC Motor SUVs. This cooperation makes driving safer by bringing multi-sensor perception technology to vehicle smart cockpits.

  6. TESCAN Unveils New TENSOR Scanning Transmission Electron Microscope 11/8/2022

    TESCAN ORSAY HOLDING a.s. today announced the revolutionary new TENSOR―the first 4D-scanning transmission electron microscope (4D-STEM) built from the ground up for a totally new level of performance and user experience.

  7. Weebit Nano Receives From SkyWater Technology The First Silicon Wafers It Manufactured With Embedded Weebit ReRAM 11/8/2022

    Weebit Nano Limited , a leading developer of next-generation memory technologies for the global semiconductor industry, and SkyWater Technology , the trusted technology realization partner, announce the first silicon wafers integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module have been delivered to Weebit from SkyWater’s U.S. production fab.

  8. Aehr Receives Over $4M In Orders For Its FOX WaferPak™ Full Wafer Contactors To Support Production Test And Burn-In Of Silicon Carbide Power Semiconductors For Electric Vehicles 11/4/2022

    Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has received $4.4 million in orders from its lead silicon carbide test and burn-in customer for multiple WaferPak™ full wafer Contactors to meet their increased production capacity needs for silicon carbide power semiconductors for the electric vehicle market.

  9. ASE Announces FOCoS Advancements Under The VIPack Platform 11/3/2022

    Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced today the industry’s first Fan-Out Chip on Substrate Chip First (FOCoS-CF) with encapsulant-separated redistribution layer (RDL) and Chip Last (FOCoS-CL) semiconductor packaging solution that elevates the performance for High Performance Computing (HPC), under the ASE VIPack platform.

  10. Quest Global Acquires Adept, A Product Design House 11/3/2022

    Quest Global, one of the world's fastest growing engineering services firms, today announced the acquisition of Adept, a product design house with robust capabilities in the semi-conductor, automotive, and hi-tech verticals.