Latest Headlines

  1. Lattice FPGAs With High I/O Density Bring Low Power Signal Bridging And Interface Management To Edge Devices 2/10/2021

    Lattice Semiconductor Corporation, the low power programmable leader, today announced new versions of the Lattice MachXO2ZE FPGA family with wafer level chip-scale packaging (WLCSP) and increased I/O density.

  2. Devices Could Become Even Smaller, More Powerful With Method For Integrating 2D Materials 2/10/2021

    If we could shrink semiconductors even further, a whole new silicon revolution would follow. But because that’s impossible, the next best hope is integrating semiconductors with 2D atomically-thin materials, such as graphene, upon which circuits can be created on an incredibly small scale.

  3. WISeKey’s Identity Technology And Semiconductors Provides Remote Identification (Remote ID) For New Drones’ Digital License Plates 2/10/2021

    WISeKey International Holding (“WISeKey”, SIX: WIHN, NASDAQ: WKEY), a leading cybersecurity IoT, AI company, today announced that its advanced digital security solutions provide drones with remote IDs to comply with the new tracking and safety regulations put in place by the Federal Aviation Administration (FAA) in the U.S.

  4. Renesas Updates Popular R-Car V3H With Improved Deep Learning Performance For Latest NCAP Requirements Including Driver And Occupant Monitoring Systems 2/9/2021

    Today, Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced an update of its state-of the-art R-Car V3H system-on-chip (SoC) to deliver significantly improved deep learning performance for smart camera applications, including driver and occupant monitoring systems (DMS / OMS), automotive front cameras, surround view, and auto parking for high-volume vehicles up to Level 2+.

  5. Arteris® IP FlexNoC® Interconnect And Resilience Package Supports Socionext’s 5nm Automotive Chip Production 2/4/2021

    Arteris IP, the world’s leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property (IP), today announced that Socionext has implemented Arteris® FlexNoC® interconnect IP and the accompanying Resilience Package in multiple automotive chips, including an automotive systems-on-chip (SoCs) fabricated using 5nm semiconductor process technology.

  6. Sequitur Labs Joins STMicroelectronics Partner Program To Advance IoT Device And Data Security Customer Time-To-Market 2/2/2021

    Sequitur Labs, the leader in IoT security for connected devices, today announced it has joined the STMicroelectronics Partner Program to make Sequitur’s EmSPARK Security Suite available for technical and business collaboration between ST and third-party companies.

  7. Alpha And Omega Semiconductor Announces Type-C Power Delivery High Voltage Source Switch 2/2/2021

    Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of power semiconductors, power ICs, and digital power products, announced today a new Type-C Power Delivery (PD) high voltage source protection switch capable up to 28V absolute maximum voltage.

  8. Cellular IoT- And Bluetooth LE-Powered Device Enables Remote Monitoring Of Smart Power Grids 2/2/2021

    Nordic Semiconductor today announces that Maribor, Slovenia-based innovation lab, IRNAS, has selected Nordic’s nRF9160 low power SiP with integrated LTE-M/NB-IoT modem and GPS in combination with the nRF52811 Bluetooth Low Energy (Bluetooth LE) multiprotocol System-on-Chip (SoC) to provide the wireless connectivity for ‘RAM-1’.

  9. Seoul Viosys Begins Mass Production Of 25Gbps VCSELs For 5G Communications Applications 1/28/2021

    Seoul Viosys, a leading compound semiconductor provider, announced that for the first time in Korea, Seoul Viosys succeeded in developing vertical cavity surface emitting laser (VCSEL) technology, a near-field-only 25Gbps laser diode compatible with 5G wired networks for transmitting and receiving, and has started mass production to supply these products to three initial customers.

  10. GOWIN Semiconductor Announces AEC-Q100 Automotive Grade FPGA Availability 1/27/2021

    GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, is pleased to announce the release of its new Automotive Grade FPGAs, targeting applications for telematics, infotainment, and the powertrain.