Latest Headlines

1. Gigaphoton Excimer Laser For Advanced Packaging Installed At Japanese Company 12/7/2025

   Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that it has delivered an excimer laser for semiconductor advanced packaging to a Japanese company engaged in research and development of advanced semiconductors, and the installation of the system was successfully completed in November.

2. UMC And Polar Collaborate To Meet Growing Demand For U.S. Onshore Semiconductor Manufacturing 12/4/2025

   United Microelectronics Corporation (“UMC”), a leading global semiconductor foundry, and Polar Semiconductor, LLC (“Polar”), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, today announced they have signed a Memorandum of Understanding (MOU) to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace & defense.

3. Rigaku Launches XTRAIA MF-3400, A Measuring Instrument For Next-Generation Semiconductors 12/4/2025

   Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers.

4. Vinci Emerges From Stealth To Transform Semiconductor Design And Simulation 12/2/2025

   Vinci, the pioneer of Physics-Driven AI for hardware design and simulation, emerged from stealth today and announced $46M in total funding, with its Series A led by Xora Innovation and its Seed round led by Eclipse.

5. Alpha And Omega Semiconductor Enables 48V Hot Swap In AI Servers With New High SOA MOSFET IN LFPAK 8x8 12/2/2025

   Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its AOLV66935 a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8x8 package.

6. Nordic Semiconductor Unveils nRF54LV10A - A Breakthrough Low-Voltage Bluetooth LE SoC For Next-Gen Healthcare Wearables 12/2/2025

   Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today launches the nRF54LV10A SoC, setting a new benchmark for integration, performance, and battery life in the smallest medical devices.

7. Marvell To Acquire Celestial AI, Accelerating Scale-Up Connectivity For Next-Generation Data Centers 12/2/2025

   Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, today announced it has entered into a definitive agreement to acquire Celestial AI, a pioneer of a disruptive Photonic Fabric technology platform purpose-built for scale-up optical interconnect.

8. NVIDIA And Synopsys Announce Strategic Partnership To Revolutionize Engineering And Design 12/1/2025
9. STMicroelectronics Streamlines Smart-Home Device Integration With Industry-First Matter NFC Chip 11/25/2025

   STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging the latest Matter smart-home standard.

10. ROHM Launches Wide SOA MOSFET For AI Servers In Compact 5x6mm Package 11/25/2025

    ROHM Semiconductor today announced it has developed the 100V power MOSFET - RS7P200BM - achieving industry-leading SOA in a 5060-size (5.0mm × 6.0mm) package.