STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that its automotive NFC Reader IC (ST25R3914) and its automotive 8-bit microcontroller (STM8AF) have been chosen for the Qi-compliant automotive wireless charging reference design from Rohm
Mass-Vac, Inc. has introduced a high capacity vacuum pump inlet-exhaust trap for collecting the heavy particulates associated with semiconductor manufacturing processes
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature its wide range of solutions for advanced IC testing and wafer metrology at SEMICON Korea on January 23-25 at COEX in Seoul, South Korea
WISeKey International Holding Ltd (WIHN.SW) ("WISeKey"), a leading Swiss based cybersecurity and IoT company, today announced that it has joined the Global Semiconductor Alliance ("GSA") IoT Security Working Group ("SWG) to address end-to-end IoT security
Wiliot, the semiconductor pioneer and innovator, raises a $30 million series B for a total of $50 million in funding
Power efficiency, scalability, reliability and ease of use are some of the most obvious requirements for wireless IoT networks, but as more and more devices are being connected also the requirements for density and interference tolerance are becoming more and more important for end customers
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature more than a dozen of its advanced test solutions that enable 5G connectivity for such diverse applications as mobile electronics, medical devices, automotive systems, retail business and big data at SEMICON Japan 2018 on December 12-14 at Tokyo Big Sight
Microtronic, Inc., the well-known maker of high-speed full-wafer semiconductor macro defect inspection systems, wants to shed new light on a topic that is frequently misunderstood in the industry: macro vs. micro inspection
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all new BONDSCALE™ automated production fusion bonding system
QuantumClean & ChemTrace will demonstrate how its ultra-high purity chamber tool part cleaning, proprietary coatings and microcontamination analytical testing can help reduce wafer fabrication Cost-of-Ownership (CoO)
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