Latest Headlines

  1. Helix Semiconductors’ MxC 200 DC-DC Power ICs Now Available Through Digi-Key
    7/9/2019

    Fabless power semiconductor company Helix Semiconductors and Digi-Key, a leading electronic components distributor, today announced that the two companies have entered into a global distribution partnership

  2. UnitySC Unveils A New Metrology Platform For Advance Packaging And Wafer Processing Ecosystem In Semiconductor Manufacturing
    7/9/2019

    UnitySC European leader and Key player in inspection and metrology solutions, today launched Unity_ATHOS ™ system for 2D/3D advanced metrology and process control in High Density Fan-Out, Embedded Fan-Out and heterogeneous packaging with and without TSV

  3. Generation And Sampling Of Quantum States Of Light In A Silicon Chip
    7/2/2019

    Scientists from the University of Bristol and the Technical University of Denmark have found a promising new way to build the next generation of quantum simulators combining light and silicon micro-chips.

  4. EV Group Revolutionizes Lithography With New Maskless Exposure Technology
    7/2/2019

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled MLE™ (Maskless Exposure), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications

  5. Advantest And MultiLane Introduce Plugable High-Speed Test Instruments For The V93000 Platform
    6/26/2019

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has partnered with MultiLane Inc. to develop instrumentation that extends the V93000 platform’s ability to cost-effectively test the next generation of digital high-speed interfaces

  6. MagnaChip Introduces New Component To Enhance 5G/LTE Smartphone Battery Life And Protection
    6/26/2019

    MagnaChip Semiconductor Corporation ("MagnaChip" or the "Company") (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today a new low-Rss(on)* LV (Low Voltage) MOSFET with reduced chip size for smartphone battery PCMs (Protection Circuit Modules)

  7. Silanna Semiconductor Introduces Versatile 12A Buck Converter For Ultra-Compact PCB Layout
    6/25/2019

    Silanna Semiconductor, an innovative producer of disruptive technologies, today announced its highly integrated SZPL8216A family of synchronous point-of-load (PoL) buck converters

  8. Sanan IC Expands Wafer Foundry Portfolio For Power Electronics With 150mm GaN-On-Silicon Process
    6/24/2019

    SANAN INTEGRATED CIRCUIT CO., LTD. (Sanan IC), a pure-play wafer foundry with its advanced compound semiconductor technology platform, today announced the commercial release of its 150mm gallium nitride (GaN) on silicon wafer foundry services intended for the latest high voltage AC/DC and DC/AC power electronics applications in the global market

  9. Raytheon Honors Lansdale Semi With Highest Award
    6/17/2019

    R. Dale Lillard, President, Lansdale Semiconductor, Inc., recently announced that the company was honored for the sixth consecutive year by Raytheon Integrated Defense Systems for Supplier Excellence. This year, Lansdale achieved Raytheon’s highest 5 Star Award.

  10. Vishay Intertechnology 1 A And 2 A FRED Pt® Ultrafast Rectifiers In SMP Package Increase Power Density, Improve Efficiency
    6/12/2019

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its offering of FRED Pt® Ultrafast recovery rectifiers with eight new 100 V and 200 V devices in the eSMP® series SMP (DO-220AA) package, including the industry’s first to offer current ratings to 2 A. Measuring 3.85 mm by 2.03 mm with a low 1 mm profile, the Vishay Semiconductors diodes provide space-saving alternatives to devices in the SMA (DO-214AC)