Latest Headlines

  1. AgigA Tech Awarded Patent For Adaptive Management Of Supercapacitors
    12/4/2018

    AgigA Tech, Inc., a leading provider of high-speed, high-density, battery-free non-volatile memory solutions and a subsidiary of Cypress Semiconductor Corp., recently announced the issuance of United States Patent No. 10,134,451 relating to the adaptive training and adjustment to changing capacitor values based upon age and usage behavior

  2. Astronics AeroSat Certifies Its FliteStream T-310 High-Speed SATCOM Connectivity Solution For Business Aviation
    12/4/2018

    Astronics Corporation, a leading provider of advanced technologies for the global aerospace, defense and semiconductor industries, announced that its wholly owned subsidiary, Astronics AeroSat Corporation, has certified its next generation FliteStream T-310 SATCOM connectivity solution for business aircraft

  3. Advantest To Exhibit Wide Range Of Semiconductor Test Solutions Enabling 5G Connectivity At SEMICON Japan On December 12-14
    12/4/2018

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature more than a dozen of its advanced test solutions that enable 5G connectivity for such diverse applications as mobile electronics, medical devices, automotive systems, retail business and big data at SEMICON Japan 2018 on December 12-14 at Tokyo Big Sight

  4. Microtronic Announces New Informational Tech Bulletin Series On Optimizing Semiconductor Macro Defect Wafer Inspection
    12/4/2018

    Microtronic, Inc., the well-known maker of high-speed full-wafer semiconductor macro defect inspection systems, wants to shed new light on a topic that is frequently misunderstood in the industry: macro vs. micro inspection

  5. Mitsubishi Electric And The University Of Tokyo Reveal New Mechanism For Enhancing Reliability Of SiC Power Semiconductor Devices
    12/4/2018

    Mitsubishi Electric Corporation and the University of Tokyo announced recently what they believe to be an all-new mechanism for enhancing the reliability of silicon carbide (SiC) power semiconductor devices in power electronics systems

  6. Toshiba Adds New 4TB CANVIO Portable Hard Drive Model For Safe And Reliable Personal Data Storage
    12/4/2018

    Toshiba America Electronic Components Inc. recently announces a new addition to its popular family of CANVIO external hard drives (HDDs), a 4TB option in its ADVANCE, BASICS and READY series

  7. Broadcom Inc. And HCL Technologies Announce A Global Preferred Services Partnership
    12/3/2018

    Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, and HCL Technologies (HCL), a leading global technology company, today announced a global preferred services partnership agreement. Effective immediately, HCL becomes the preferred services partner for Broadcom’s enterprise software products (part of former CA Technologies) and will provide professional services, education and training services. Broadcom customers will have access to HCL’s technological expertise across consulting, implementation,

  8. EV Group Unveils Next-Generation Fusion Wafer Bonder For ‘More Moore’ Scaling And Front-End Processing
    12/3/2018

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all new BONDSCALE™ automated production fusion bonding system

  9. TU Wien And Silvaco Collaborate On New MRAM Device Technology Development
    11/26/2018

    Silvaco, Inc. today announced the opening of a second Christian Doppler Laboratory (CDL) in partnership with the Institute for Microelectronics, TU Wien. The new CDL, officially opened November 12th will develop new device simulation solutions for MRAM, a novel non-volatile memory technology. "The fact that memory components are constantly becoming smaller and smaller is driven by the constant need for devices with lower power and higher capacity," said Dr. Siegfried Selberherr, Professor at the

  10. QuantumClean® & ChemTrace® Show How To Reduce Wafer Fab CoO At SEMICON Europa 2018
    11/1/2018

    QuantumClean & ChemTrace will demonstrate how its ultra-high purity chamber tool part cleaning, proprietary coatings and microcontamination analytical testing can help reduce wafer fabrication Cost-of-Ownership (CoO)