Latest Headlines

  1. GaN Systems Shows How GaN Is Revolutionizing Wireless Charging At Wireless Power Week
    6/11/2019

    GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, will deliver presentations and display numerous innovative wireless power transfer solutions enabled by GaN at Wireless Power Week taking place in London on June 17-21, 2019.

  2. EV Group Brings Nanoimprint Lithography To Full-Scale Production With The First Fully Integrated 300-mm Nanoimprint Lithography Track System
    6/11/2019

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, recently unveiled the HERCULES NIL 300 mm—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG’s proprietary SmartNIL wafer-level nanoimprint lithography (NIL) process in a single platform for wafers up to 300 mm in diameter

  3. ALTEN Calsoft Labs Acquires Wafer Space, A Semiconductor And Embedded Systems Company
    6/10/2019

    ALTEN Calsoft Labs, a leading Engineering R&D services and Enterprise Digital Transformation solutions company, has acquired Wafer Space

  4. IMT Announces 8-inch Wafer Fabrication Capabilities
    6/5/2019

    Innovative Micro Technology, Inc. (IMT) officially announced today that it is offering 8-inch (200mm) wafer fabrication capabilities, marshalling in a new era in the company’s ability to serve the growing MEMS industry

  5. Achronix Chooses Rambus GDDR6 PHY IP For Next-Generation FPGA
    6/4/2019

    Rambus Inc. recently announced that Achronix Semiconductor Corporation, a leader in FPGA-based hardware data acceleration devices and high-performance eFGPA IP, has selected the Rambus GDDR6 PHY for its next-generation Speedster7t FPGA family

  6. EPC To Provide eGaN Power Devices In Wafer Form
    6/4/2019

    EPC announces the availability of their industry-leading enhancement-mode gallium nitride (GaN) devices in wafer form for ease of integration

  7. pSemi Corporation Announces Next Generation UltraCMOS® Technology
    6/4/2019

    pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, today announced the release of UltraCMOS® 13. The platform represents the next generation of pSemi's proprietary RFSOI technology, manufactured in high-volume 300mm foundries, enabling superior performance and integration for RF front-end components.

  8. Aehr Secures Order For FOX-P™ System From New Customer Skorpios Technologies For Test And Burn-In Of Silicon Photonics Devices
    6/4/2019

    Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced it has received an order from new customer Skorpios Technologies, Inc., a vertically integrated silicon photonics company, for its FOX-P test and burn-in system

  9. GreenWaves Technologies Named A 2019 ‘Cool Vendor’ In AI Semiconductors By Gartner
    6/3/2019

    GreenWaves Technologies (GreenWaves), a fabless semiconductor start-up designing disruptive ultra-low-power AI embedded processors for battery-operated edge devices, announced recently that it has been named a Gartner “Cool Vendor” based on the April 29, 2019 report “Cool Vendors in AI Semiconductors,” authored by Alan Priestley, VP Analyst, and Saniye Alaybeyi, Senior Director Analyst

  10. AMEC Ranks Among Top Performers In Customer Satisfaction Survey Conducted By Leading Market Research Firm, VLSIresearch
    5/15/2019

    For the second consecutive year, Advanced Micro-Fabrication Equipment Inc. China. China (AMEC) today announced that it has landed among the top-ranked worldwide semiconductor equipment companies that participated in the 2019 Customer Satisfaction Survey (CSS) conducted annually by leading US market research firm, VLSIresearch