Latest Headlines

31. yieldWerx And PTC Announce Strategic Collaboration To Support End-To-End Semiconductor Lifecycle Analytics In Malaysia And India 6/19/2025

    yieldWerx, a leading innovator in semiconductor yield management solutions, and PTC, a premier Malaysia-based consulting firm for the semiconductor manufacturing industry, have announced a strategic collaboration to address the growing need for comprehensive data analytics across the semiconductor manufacturing lifecycle in the rapidly expanding markets of Malaysia and India.

32. Marvell Develops Industry's First 2nm Custom SRAM For Next-Generation AI Infrastructure Silicon 6/17/2025

    Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions expanded its custom technology platform with the launch of the industry's first 2nm custom Static Random Access Memory (SRAM), designed to boost the performance of custom XPUs and devices powering cloud data centers and AI clusters.

33. Plug And Play Expands Semiconductor Ecosystem Program With New Synopsys Collaboration To Accelerate Chip Design Innovation 6/5/2025

    Plug and Play, the world's largest innovation platform based in Silicon Valley, has announced a new collaboration with Synopsys, a global silicon-to-systems design solutions company.

34. Thin Film Interconnect (TFI) And Heisler Semiconductor LLC Announce Strategic Technology Partnership 6/4/2025

    Thin Film Interconnect (TFI), based in Frederick, Maryland, is pleased to announce a strategic technology partnership with Heisler Semiconductor LLC, headquartered in Baltimore, Maryland.

35. Navitas & BrightLoop Partners To Provide Next-Generation Hydrogen Fuel-Cell Charging 6/3/2025

    Navitas Semiconductor (Nasdaq: NVTS), the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, today announced its partnership with BrightLoop supporting their latest series of hydrogen fuel-cell chargers with automotive qualified Gen 3 ‘Fast’ SiC (G3F) MOSFETs for heavy-duty agricultural transportation equipment.

36. Lumotive Powers E-Photonics' Launch Of Software-Defined LiDAR Solutions For ITS Applications At ITS Spain 5/15/2025

    Lumotive, a leader in programmable optical semiconductor technology, today announced that its transformative beam-steering technology is powering E-Photonics' newly launched infrastructure monitoring solutions for Intelligent Transportation Systems (ITS).

37. Achronix Announces New Vectorpath 815 FPGA Accelerator Card 5/15/2025

    Achronix Semiconductor Corporation, the leader in data acceleration FPGAs, today announced the launch of the VectorPath® 815 (VP815), a new PCIe accelerator card powered by the industry- leading Speedster® 7t1500 FPGA, and engineered to meet the growing demands of AI workloads and high-performance computing (HPC).

38. Secafy Licenses Menta's eFPGA IP To Power Chiplet-Based Secure Semiconductor Designs 5/14/2025

    Menta SAS, a leading provider of embedded FPGA (eFPGA) IP, today announced that Japanese technology company Secafy has licensed Menta's eFPGA IP to integrate into its upcoming chiplet-based products.

39. ROOTS Develops Ultra-Compact 450㎛ PiG Technology Optimized For Smart Multi-Beam Headlights 5/8/2025

    ROOTS CO., LTD., a company with proprietary Phosphor in Glass (PiG) technology—an essential optical component in automotive headlights—has successfully developed an ultra-compact 450㎛ PiG optimized for next-generation smart multi-beam headlights.

40. NEO Semiconductor Unveils Breakthrough 1T1C And 3T0C IGZO-Based 3D X-DRAM Technology 5/7/2025

    NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the latest advancement in its groundbreaking 3D X-DRAM technology family — the industry-first 1T1C- and 3T0C-based 3D X-DRAM cell, a transformative solution designed to deliver unprecedented density, power efficiency, and scalability for the most demanding data applications.