Latest Headlines

  1. EV Group Revolutionizes Lithography With New Maskless Exposure Technology

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled MLE™ (Maskless Exposure), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications

  2. Alpha And Omega Semiconductor Releases 700V And 600V αMOS5 Super Junction MOSFETs In 300mm Fab

    Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, recently announced the release of 700V and 600V αMOS5 Super Junction MOSFET families in 300mm technologies

  3. Advantest And MultiLane Introduce Plugable High-Speed Test Instruments For The V93000 Platform

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has partnered with MultiLane Inc. to develop instrumentation that extends the V93000 platform’s ability to cost-effectively test the next generation of digital high-speed interfaces

  4. MagnaChip Introduces New Component To Enhance 5G/LTE Smartphone Battery Life And Protection

    MagnaChip Semiconductor Corporation ("MagnaChip" or the "Company") (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today a new low-Rss(on)* LV (Low Voltage) MOSFET with reduced chip size for smartphone battery PCMs (Protection Circuit Modules)

  5. Silanna Semiconductor Introduces Versatile 12A Buck Converter For Ultra-Compact PCB Layout

    Silanna Semiconductor, an innovative producer of disruptive technologies, today announced its highly integrated SZPL8216A family of synchronous point-of-load (PoL) buck converters

  6. Sanan IC Expands Wafer Foundry Portfolio For Power Electronics With 150mm GaN-On-Silicon Process

    SANAN INTEGRATED CIRCUIT CO., LTD. (Sanan IC), a pure-play wafer foundry with its advanced compound semiconductor technology platform, today announced the commercial release of its 150mm gallium nitride (GaN) on silicon wafer foundry services intended for the latest high voltage AC/DC and DC/AC power electronics applications in the global market

  7. Raytheon Honors Lansdale Semi With Highest Award

    R. Dale Lillard, President, Lansdale Semiconductor, Inc., recently announced that the company was honored for the sixth consecutive year by Raytheon Integrated Defense Systems for Supplier Excellence. This year, Lansdale achieved Raytheon’s highest 5 Star Award.

  8. Renesas Electronics Develops Low-Power Technology For Embedded Flash Memory Based On SOTB Process To Enable Energy Harvesting And Eliminate Need For Batteries

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, recently announced the development of new low-power technology for use in embedded flash memory based on a 65 nanometer (nm) SOTB (Silicon On Thin Buried Oxide) process

  9. Vishay Intertechnology 1 A And 2 A FRED Pt® Ultrafast Rectifiers In SMP Package Increase Power Density, Improve Efficiency

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its offering of FRED Pt® Ultrafast recovery rectifiers with eight new 100 V and 200 V devices in the eSMP® series SMP (DO-220AA) package, including the industry’s first to offer current ratings to 2 A. Measuring 3.85 mm by 2.03 mm with a low 1 mm profile, the Vishay Semiconductors diodes provide space-saving alternatives to devices in the SMA (DO-214AC)

  10. NXP And Microsoft Bring Microsoft Azure Sphere Security To The Intelligent Edge With A New Energy-Efficient Processor

    NXP Semiconductors N.V. (NASDAQ:NXPI) today announced collaboration with Microsoft to deliver a new Microsoft Azure Sphere certified crossover applications processor, as an extension to their popular i.MX 8 high-performance applications processor series