Latest Headlines

  1. EMASS Tapes Out 16nm ECS-DoT, Advancing Always-On Edge AI 1/28/2026

    EMASS, a Nanoveu subsidiary specializing in next-generation semiconductor technology, today announced the successful tape-out of its 16nm ECS-DoT system-on-chip (SoC).

  2. FPT Announces The Establishment Of An Advanced Semiconductor Testing And Packaging Plant, Accelerating The Integration Of Vietnam's Semiconductor Value Chain 1/28/2026

    On January 28, 2026, in Hanoi,FPT Corporation officially announced the establishment of the FPT Advanced Semiconductor Testing and Packaging Plant, aiming to strengthen connectivity across the semiconductor value chain and to realize Vietnam's major national orientations on mastering core and sovereign technologies, in line with Resolution No. 57-NQ/TW, Decision No. 1131/QĐ-TTg and Decision No. 1018/QĐ-TTg, thereby enabling Vietnam to move deeper into the global semiconductor supply chain.

  3. Ambersemi Announces Silicon Tape-Out Of Powertile™ Vertical Power Solution For AI Data Centers 1/27/2026

    Amber Semiconductor, Inc. (AmberSemi™), a fabless semiconductor company pioneering the next generation of power management for data centers, today announced the successful tape out of its AmberSemi PowerTile™ vertical power delivery solution designed specifically for AI processors in data centers.

  4. Alpha And Omega Semiconductor Unveils Its Powerful αMOS E2 600V Super Junction MOSFET Platform 1/27/2026

    Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today unveiled its powerful αMOS E2 600V Super Junction MOSFET platform.

  5. GCT Semiconductor Launches Commercial Shipments Of 5G Chipset 1/6/2026

    GCT Semiconductor Holding Inc. (“GCT” or the "Company") a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced the first commercial shipments of its 5G chipset to GCT’s lead customers.

  6. Aegis Aerospace Partners With United Semiconductors To Launch World's First In-Space Advanced Materials Manufacturing Facility 1/6/2026

    Aegis Aerospace Inc., a leader in space and defense technology, has announced a groundbreaking partnership with United Semiconductors LLC to pioneer semiconductor manufacturing in space.

  7. BOS Semiconductors Selects Ceva's AI DSP For Next-Generation ADAS Platforms 1/6/2026

    As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation.

  8. Nordic Semiconductor Simplifies Edge AI For Billions Of IoT Devices 1/6/2026

    Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, is bringing AI intelligence and functionality to the smallest battery-powered IoT devices.

  9. Tower Semiconductor Partners With LightIC To Expand Silicon Photonics Beyond AI Infrastructure Into Physical AI And Automotive 1/5/2026

    Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, and LightIC Technologies (“LightIC”), a developer of silicon photonics–based FMCW LiDAR solutions, today announced a strategic collaboration leveraging Tower’s mature silicon photonics platform to support LightIC’s Frequency-Modulated Continuous-Wave (FMCW) LiDAR products, including the Lark™ long-range automotive LiDAR and the FR60™ compact LiDAR for robotics and Physical AI applications.

  10. Valens Semiconductor And Sakae Riken Kogyo Unveil e-Mirror With Order Of Magnitude More Imaging Data Via MIPI A-PHY 1/5/2026

    Valens Semiconductor (NYSE: VLN) and Sakae Riken Kogyo Co., Ltd today announced the automotive market's first production-ready MIPI A-PHY-enabled e-mirror.