Latest Headlines

  1. NXP, Dongfeng Venucia, And Hangsheng Electronics Collaboration Achieves Milestone: First Global Mass Production Of Smart eCockpits
    11/21/2019

    NXP Semiconductors N.V. (NASDAQ: NXPI), Dongfeng Venucia, and Hangsheng Electronics today jointly announced that the Venucia T90 e-cockpit, “Venucia 3.0 PLUS,” marks a mass production milestone in the companies’ joint efforts to bring next-generation eCockpits to drivers

  2. ERS' Thermal Chucks Will Be Available In SEMICS' Renowned OPUS3 Product Line Of Manufacturing Probers
    11/13/2019

    ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is pleased to announce a new engagement with the Korean semiconductor equipment supplier, SEMICS Inc.

  3. Renesas Electronics Expands RA Microcontroller Ecosystem With Ready To Use Partner Solutions
    11/12/2019

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA) microcontroller (MCU) Family of 32-bit Arm Cortex-M MCUs

  4. LAPIS Semiconductor's New Multiband Wireless Communication LSI Optimized For Smart Meters World-Wide
    11/12/2019

    ROHM Group company LAPIS Semiconductor recently announced the availability of a multiband (sub-1GHz/2.4GHz) wireless communication LSI, ML7421, optimized for applications requiring low power consumption over relatively long distances, such as smart meters, gas/fire alarms, smart agriculture and home/building security systems

  5. Thermo Fisher Centrios Improves Semiconductor Circuit Editing For Process Nodes 14nm And Above
    11/12/2019

    Circuit edit (CE) engineers, whether supporting designers or in service labs, who are looking for a cost-effective solution can increase their productivity with the next-generation Thermo Scientific Centrios circuit edit system

  6. GOWIN Semiconductor Releases The First FPGA With Integrated Bluetooth Radio
    11/12/2019

    GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, announces the release of their latest mSoC FPGA with integrated Bluetooth 5.0 Low Energy radio enabling an entirely new wave of FPGA computing capabilities at the edge

  7. NXP Announces New Automotive Ultra-Wideband Chip Capable Of Turning Smartphones Into Car Keys
    11/12/2019

    NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest provider of automotive semiconductors, today announced an addition to its UWB portfolio with a new automotive UWB IC

  8. Alpha And Omega Semiconductor Introduces 18V 2A, And 3A EZBuck In Thermally Enhanced Ultra-Thin TSOT23-6 Package
    11/6/2019

    Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, today introduced AOZ6682CI and AOZ6683CI

  9. Boston Semi Equipment Revolutionizes Handling Of Multi-Port, Low Pressure MEMS Sensors
    11/4/2019

    Boston Semi Equipment (BSE), a global semiconductor test handler manufacturer and an innovative provider of test automation technical services, announced today that it has enhanced its Zeus gravity feed handlers with the capability of handling extremely low pressure MEMS devices with multiple ports

  10. Half-Bridge Evaluation Board From GaN Systems And ON Semiconductor Demonstrates Next Performance Leap In GaN
    11/4/2019

    GaN Systems, the global leader in GaN power semiconductors and ON Semiconductor, a world-leading supplier of power semiconductor ICs, today announced the availability of a high-speed, half-bridge GaN daughter board using GaN Systems’ 650 V, 30 A GaN E-HEMTs and ON Semiconductor’s award-winning NCP51820 high speed gate driver evaluation board