Latest Headlines

  1. Renesas Electronics Develops Low-Power Technology For Embedded Flash Memory Based On SOTB Process To Enable Energy Harvesting And Eliminate Need For Batteries
    6/12/2019

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, recently announced the development of new low-power technology for use in embedded flash memory based on a 65 nanometer (nm) SOTB (Silicon On Thin Buried Oxide) process

  2. Vishay Intertechnology 1 A And 2 A FRED Pt® Ultrafast Rectifiers In SMP Package Increase Power Density, Improve Efficiency
    6/12/2019

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its offering of FRED Pt® Ultrafast recovery rectifiers with eight new 100 V and 200 V devices in the eSMP® series SMP (DO-220AA) package, including the industry’s first to offer current ratings to 2 A. Measuring 3.85 mm by 2.03 mm with a low 1 mm profile, the Vishay Semiconductors diodes provide space-saving alternatives to devices in the SMA (DO-214AC)

  3. NXP And Microsoft Bring Microsoft Azure Sphere Security To The Intelligent Edge With A New Energy-Efficient Processor
    6/12/2019

    NXP Semiconductors N.V. (NASDAQ:NXPI) today announced collaboration with Microsoft to deliver a new Microsoft Azure Sphere certified crossover applications processor, as an extension to their popular i.MX 8 high-performance applications processor series

  4. GaN Systems Shows How GaN Is Revolutionizing Wireless Charging At Wireless Power Week
    6/11/2019

    GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, will deliver presentations and display numerous innovative wireless power transfer solutions enabled by GaN at Wireless Power Week taking place in London on June 17-21, 2019.

  5. EV Group Brings Nanoimprint Lithography To Full-Scale Production With The First Fully Integrated 300-mm Nanoimprint Lithography Track System
    6/11/2019

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, recently unveiled the HERCULES NIL 300 mm—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG’s proprietary SmartNIL wafer-level nanoimprint lithography (NIL) process in a single platform for wafers up to 300 mm in diameter

  6. ALTEN Calsoft Labs Acquires Wafer Space, A Semiconductor And Embedded Systems Company
    6/10/2019

    ALTEN Calsoft Labs, a leading Engineering R&D services and Enterprise Digital Transformation solutions company, has acquired Wafer Space

  7. IMT Announces 8-inch Wafer Fabrication Capabilities
    6/5/2019

    Innovative Micro Technology, Inc. (IMT) officially announced today that it is offering 8-inch (200mm) wafer fabrication capabilities, marshalling in a new era in the company’s ability to serve the growing MEMS industry

  8. Achronix Chooses Rambus GDDR6 PHY IP For Next-Generation FPGA
    6/4/2019

    Rambus Inc. recently announced that Achronix Semiconductor Corporation, a leader in FPGA-based hardware data acceleration devices and high-performance eFGPA IP, has selected the Rambus GDDR6 PHY for its next-generation Speedster7t FPGA family

  9. EPC To Provide eGaN Power Devices In Wafer Form
    6/4/2019

    EPC announces the availability of their industry-leading enhancement-mode gallium nitride (GaN) devices in wafer form for ease of integration

  10. pSemi Corporation Announces Next Generation UltraCMOS® Technology
    6/4/2019

    pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, today announced the release of UltraCMOS® 13. The platform represents the next generation of pSemi's proprietary RFSOI technology, manufactured in high-volume 300mm foundries, enabling superior performance and integration for RF front-end components.