Latest Headlines

  1. Cypress Strengthens Internet Of Things Leadership With Cirrent Software Offering
    12/6/2018

    Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today announced that it has expanded its portfolio of Internet of Things (IoT) solutions with the addition of Cirrent, a leading provider of software and cloud services for consumer Wi-Fi® products. IoT companies use Cirrent’s software and cloud services to make their products easier to use, more reliable, and more secure. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20181206005268/en/ “Cirrent helps users

  2. Bank Islam Brunei Darussalam Chooses Rambus To Secure Mobile Payments
    12/5/2018

    Rambus Inc. a leader in digital security, semiconductor and IP products and services, recently announced that Bank Islam Brunei Darussalam (BIBD), the largest bank in Brunei, has selected the Rambus Token Service Provider (TSP) as part of its mobile payment strategy to enable secure transactions to its customers

  3. Skyworks Unveils Connectivity Solutions For Emerging Automotive Platforms
    12/5/2018

    Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things, recently introduced its suite of next generation SkyOne Ultra 3.0 devices specifically designed for advanced automotive applications

  4. Spectra7 Achieves Low Latency Error Free Performance With Mellanox ConnectX-5 Network Adapters
    12/5/2018

    Spectra7 Microsystems Inc., a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it has achieved robust error free performance with Mellanox ConnectX-5 network adapters configured for Ethernet low latency CA-N transmission

  5. Building Massive IoT - Wirepas And Nordic Semiconductor Create The World's Densest IoT Sensor Network
    12/5/2018

    Power efficiency, scalability, reliability and ease of use are some of the most obvious requirements for wireless IoT networks, but as more and more devices are being connected also the requirements for density and interference tolerance are becoming more and more important for end customers

  6. AgigA Tech Awarded Patent For Adaptive Management Of Supercapacitors
    12/4/2018

    AgigA Tech, Inc., a leading provider of high-speed, high-density, battery-free non-volatile memory solutions and a subsidiary of Cypress Semiconductor Corp., recently announced the issuance of United States Patent No. 10,134,451 relating to the adaptive training and adjustment to changing capacitor values based upon age and usage behavior

  7. Astronics AeroSat Certifies Its FliteStream T-310 High-Speed SATCOM Connectivity Solution For Business Aviation
    12/4/2018

    Astronics Corporation, a leading provider of advanced technologies for the global aerospace, defense and semiconductor industries, announced that its wholly owned subsidiary, Astronics AeroSat Corporation, has certified its next generation FliteStream T-310 SATCOM connectivity solution for business aircraft

  8. Advantest To Exhibit Wide Range Of Semiconductor Test Solutions Enabling 5G Connectivity At SEMICON Japan On December 12-14
    12/4/2018

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature more than a dozen of its advanced test solutions that enable 5G connectivity for such diverse applications as mobile electronics, medical devices, automotive systems, retail business and big data at SEMICON Japan 2018 on December 12-14 at Tokyo Big Sight

  9. Microtronic Announces New Informational Tech Bulletin Series On Optimizing Semiconductor Macro Defect Wafer Inspection
    12/4/2018

    Microtronic, Inc., the well-known maker of high-speed full-wafer semiconductor macro defect inspection systems, wants to shed new light on a topic that is frequently misunderstood in the industry: macro vs. micro inspection

  10. Mitsubishi Electric And The University Of Tokyo Reveal New Mechanism For Enhancing Reliability Of SiC Power Semiconductor Devices
    12/4/2018

    Mitsubishi Electric Corporation and the University of Tokyo announced recently what they believe to be an all-new mechanism for enhancing the reliability of silicon carbide (SiC) power semiconductor devices in power electronics systems