Current Headlines

  1. Alpha And Omega Semiconductor Introduces New Source Down Packaging Technology

    Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, today introduced the “Source Down” in a DFN 5x6 package in combination with a 40V Shield-Gate Technology (AlphaSGT)

  2. Lattice sensAI Solutions Stack Receives Its Fifth Award In 2019 With The Italian Assodel Award Win

    Lattice Semiconductor Corporation, the low power programmable leader, recently announced Lattice sensAI solutions stack has been awarded the Assodel Award in the Industrial and Automotive Related Hardware Product category

  3. Helix Semiconductors’ MxC 200 DC-DC Power ICs Now Available Through Digi-Key

    Fabless power semiconductor company Helix Semiconductors and Digi-Key, a leading electronic components distributor, today announced that the two companies have entered into a global distribution partnership

  4. UnitySC Unveils A New Metrology Platform For Advance Packaging And Wafer Processing Ecosystem In Semiconductor Manufacturing

    UnitySC European leader and Key player in inspection and metrology solutions, today launched Unity_ATHOS ™ system for 2D/3D advanced metrology and process control in High Density Fan-Out, Embedded Fan-Out and heterogeneous packaging with and without TSV

  5. Cohu Announces Next Generation Inspection Platform

    Cohu, Inc., a global leader in back-end semiconductor equipment and services, recently announced the introduction of Neon, its next generation inspection platform optimized for small, fragile semiconductors used in mobility and consumer applications

  6. Generation And Sampling Of Quantum States Of Light In A Silicon Chip

    Scientists from the University of Bristol and the Technical University of Denmark have found a promising new way to build the next generation of quantum simulators combining light and silicon micro-chips.

  7. EV Group Revolutionizes Lithography With New Maskless Exposure Technology

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled MLE™ (Maskless Exposure), a revolutionary next-generation lithography technology developed to address future back-end lithography needs for advanced packaging, MEMS, biomedical and high-density printed circuit board (PCB) applications

  8. Alpha And Omega Semiconductor Releases 700V And 600V αMOS5 Super Junction MOSFETs In 300mm Fab

    Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of power semiconductors and power ICs, recently announced the release of 700V and 600V αMOS5 Super Junction MOSFET families in 300mm technologies

  9. Advantest And MultiLane Introduce Plugable High-Speed Test Instruments For The V93000 Platform

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has partnered with MultiLane Inc. to develop instrumentation that extends the V93000 platform’s ability to cost-effectively test the next generation of digital high-speed interfaces

  10. MagnaChip Introduces New Component To Enhance 5G/LTE Smartphone Battery Life And Protection

    MagnaChip Semiconductor Corporation ("MagnaChip" or the "Company") (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor products, announced today a new low-Rss(on)* LV (Low Voltage) MOSFET with reduced chip size for smartphone battery PCMs (Protection Circuit Modules)