Current Headlines
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MP Materials Selects Northlake, Texas, As The Site Of '10X,' A New U.S. Rare Earth Magnet Manufacturing Campus
2/26/2026
MP Materials Corp.today announced it has selected a 120‑acre site in Northlake, Texas, to develop “10X,” the company’s planned large-scale rare earth magnet manufacturing campus.
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Modus Test Partners With yieldWerx To Deliver Closed-Loop Socket To Silicon Correlation
2/26/2026
Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence.
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Axcelis Unveils Purion H6: Next-Generation High Current Ion Implanter For Advanced Semiconductor Manufacturing
2/4/2026
Axcelis Technologies, Inc. (NASDAQ:ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today introduced the Purion H6™ high current ion implanter—engineered to meet the demands of next-generation semiconductor devices with unmatched purity, precision and productivity.
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Siemens Acquires Canopus AI To Bring AI-Based Metrology To Semiconductor Manufacturing
2/4/2026
Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.
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THine Announces Its Optical DSP-Free Chipset, Best Suited For 'Slow And Wide' Interconnection In Scale-Up AI Networks Of The Next Generation
2/1/2026
THine Electronics, Inc. a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, today announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW technology for short-reach optical interconnect of PCI Express7(PCIe7) 2TB/s linear pluggable optics(LPO) or co-packaged optics(CPO), enabling to save power by 73% and lower latency by 90%.
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Nova Announces Adoption Of Metrion® By Two Leading Global Manufacturers
1/29/2026
Nova (Nasdaq:NVMI) a leading innovator in metrology and process control solutions for advanced semiconductor manufacturing, today announced the adoption of its Nova Metrion® platform by global leaders in Memory and Logic device production.
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Arasan Announces The Immediate Availability Of The Industry's First xSPI NOR + eMMC NAND Combo PHY IP
1/29/2026
Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, today announced the immediate availability of its xSPI + eMMC combo PHY IP. This IP integrates both xSPI and eMMC 5.1 PHY into a single, unified solution, enabling support for two different storage protocols within the same IP.
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2.5Gbps MIPI D-PHY Redriver From Diodes Incorporated Optimizes Signal Integrity For Automotive Camera Monitoring Systems And ADAS
1/29/2026
Diodes Incorporated (Diodes) today announces the release of the automotive-compliant* PI2MEQX2505Q
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Credo Introduces Industry's First 224G Multiprotocol AI Scale-Up Retimer Supporting UALink, ESUN And Ethernet
1/29/2026
Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced its Blue Heron 224G AI scale-up retimer, optimized to support the growing need for extended cable and PCB backplane links using UALink, ESUN, and Ethernet protocols.
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SK Keyfoundry Launches 4th-Generation 200V High-Voltage 0.18 Micron BCD Process, Accelerating Expansion Into Automotive•AI Power Semiconductor Markets
1/28/2026
SK keyfoundry, an 8-inch pure-play foundry in Korea, announced that it has recently launched its fourth-generation 200V high-voltage 0.18-micron BCD (Bipolar-CMOS-DMOS) process and will begin full-scale product development with major domestic and global customers, targeting mass production within the year.