Current Headlines

  1. Hyundai Mobis Acquires Semiconductor Development Process Certification For ISO 26262 ASIL-D 8/21/2025

    Hyundai Mobis has obtained the highest grade of ISO 26262 certification, an international standard for functional safety, for its entire vehicle semiconductor R&D process.

  2. Nordson Electronics Solutions To Exhibit High-Yield Fluid Dispensing Technologies For Panel-Level And Wafer-Level Packaging At SEMICON Taiwan 2025 8/18/2025

    Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.

  3. OKI Develops Tiling Crystal Film Bonding (CFB) Technology For Heterogeneous Integration Of Optical Semiconductors Onto 300 mm Silicon Wafers 8/14/2025

    OKI has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology.

  4. NEO Semiconductor Introduces World's First Extreme High Bandwidth Memory (X-HBM) Architecture For AI Chips 8/5/2025

    NEO Semiconductor, a leading developer of breakthrough memory technologies, today introduced the world's first Extreme High Bandwidth Memory (X-HBM) architecture for AI chips.

  5. UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance And Enhanced Manageability 8/5/2025

    Universal Chiplet Interconnect Express (UCIe) Consortium, the open standard for interconnects between chiplets within a package, today announced the release of the UCIe 3.0 specification, marking the next stage in the evolution of its open chiplet standard.

  6. iDEAL Signs Technology Partner Agreement For SuperQ MOSFETs With Power System Specialist Richardson Electronics, Ltd 7/31/2025

    iDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.

  7. Navitas Powers Xiaomi's Next Generation GaN Charger 7/31/2025

    Navitas Semiconductor (Nasdaq: NVTS), the industry leader in next-generation GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power semiconductors, today announced that Xiaomi’s next-generation 90W GaN charger will be powered by Navitas’ GaNSense Control ICs.

  8. Rigaku Launches XTRAIA XD-3300 Mass Production For Semiconductor Market 7/29/2025

    Rigaku Corporation, a global solution partner in X-ray metrology systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), has launched full-fledged commercial production of XTRAIA XD-3300, a high-resolution microspot X-ray diffraction system.

  9. SkyWater Technology Expands Leadership In U.S. Semiconductor Manufacturing With Infineon IP License Agreement 7/29/2025

    SkyWater Technology, the trusted technology realization partner, today announced a license agreement with Infineon Technologies, granting access to a robust library of silicon-proven, mixed-signal ASIC design IP.

  10. CoAsia SEMI And Rebellions Join Forces To Jointly Develop Next-Generation AI Chiplet Based On REBEL 7/28/2025

    CoAsia SEMI (CEO DS, Shin), a system semiconductor design specialist subsidiary of CoAsia, is supporting the development of AI chiplet and software solutions for data centers by providing its advanced packaging technologies to Rebellions (CEO Sung hyun, Park), a Korean AI semiconductor unicorn.