Current Headlines
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Applied Materials Expands Patterning Solutions Portfolio For Angstrom Era Chipmaking
2/26/2024
Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.” As chipmakers transition to process nodes at 2nm and below, they increasingly benefit from new materials engineering and metrology techniques that help overcome EUV and High-NA EUV patterning challenges, including line edge roughness, tip-to-tip spacing limitations, bridge defects and edge placement errors.
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Alpha And Omega Semiconductor Announces Application-Specific EZBuck Regulator To Power Intel Meteor Lake And Arrow Lake Platforms
2/22/2024
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its new application-specific EZBuck regulator.
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Wipro And Intel Foundry Announce New Collaboration To Advance Chip Design And Development
2/21/2024
Wipro Limited, a leading global technology services and consulting company, today announced an expanded collaboration with Intel Foundry to accelerate chip design innovation. As the key Design Services and Alliance Partner, Wipro will work with Intel Foundry to accelerate the development of Intel’s most advanced process nodes, including the Intel18A process node.
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EdgeQ Deploys Arteris IP For Its 5G+AI Base Station-On-A-Chip For Wireless Infrastructure
2/13/2024
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that EdgeQ has deployed Arteris’ FlexNoC network-on-chip (NoC) IP on its revolutionary 5G and AI-driven Base Station-on-a-Chip.
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Redwire Space Announces Strategic Expansion Of Its In-Space Manufacturing Technology Portfolio To Tap Into Global Semiconductor Market
1/29/2024
Redwire Corporation, a leader in space infrastructure for the next generation space economy, announced today the strategic expansion of its in-space manufacturing technology portfolio with the first pathfinder mission for its autonomous semiconductor manufacturing platform, MSTIC. MSTIC will launch to the International Space Station (ISS) onboard Northrup Grumman’s 20th cargo resupply services mission (NG-20).
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Rakon Launches Small Form Factor IC-OCXO With 8hr Holdover For Cloud Data Centres And Next-Generation Telecom Networks
1/25/2024
Rakon has launched its first IC-OCXO products combining its in-house designed Mercury semiconductor chip and XMEMS resonators under the brand MercuryX. MercuryX OCXOs provide ultra-high stability and an extended holdover of 8 hours. in real-world conditions, all in a small form factor package size. The new OCXOs are an excellent fit for timing and synchronisation in AI computing / data centres and 5G, 5G Advanced and 6G telecommunications networks as well as satellite terminals and instrumentation.
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Moov Releases Equipment Management Software For Semiconductor Manufacturers
1/25/2024
Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced the release of its new Equipment Management Software (EMS) for semiconductor manufacturers.
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Valens Semiconductor Enables Unprecedented, Resilient Surround View Systems For Long Vehicles, With Its New VA700R Series, Capable Of 40-Meter Multi-Gig Connectivity
1/24/2024
Today, Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, unveiled the VA700R Series, which offers industry leading bandwidth and link distance for long vehicle sensor connectivity. Enabling 4Gbps at distances of up to 40 meters/130 feet, while supplying power and bi-directional control over the cable, the VA700R provides the connectivity infrastructure upon which innovative visibility solutions can be designed for truck drivers.
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SEALSQ Announces An Initiative Focused On Semiconductor Personalization Centers, SEALCOINS Incentivization, And Advanced Iot Integration Aiming To Mitigate Global Dependency On Semiconductor Manufacturing And Fortify Microchip Deployment Capabilities
1/23/2024
SEALSQ Corp ("SEALSQ" or "Company") (NASDAQ: LAES), a leader in the fields of Semiconductors, PKI, and Post-Quantum technology, today announced a groundbreaking strategy set to incentivize the creating of Semiconductors Personalization Centers to contribute into the decentralization of the global semiconductor, cryptocurrency, AI and IoT sectors.
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Sondrel Completes A Multi-Billion Transistor Chip Design At 5nm
1/23/2024
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, has announced that it has completed its most complex chip design to date. Designed on a 5nm process node, this ultra-complex design has more than 50 billion transistors.