Current Headlines

  1. PhotonIC Debuts Product Portfolio Based Upon Its Platform: Resiliency Of Optoelectronic Chip Supply-Chain™ (ROCS) 2/27/2026

    PhotonIC Technologies, a global fabless optoelectronic semiconductor company, today introduces a complete product portfolio leveraging its ROCS platform —engineered to give end customers greater control and predictability over performance scaling, geopolitical risks, and manufacturing strategy.

  2. StratEdge Powers Up For 2026: Showcasing Molded Ceramic Packages At IMAPS Device Packaging And GOMACTech 2/27/2026

    StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high reliability packages, will highlight its molded ceramic and gold plated tab products lines at two March exhibitions.

  3. MP Materials Selects Northlake, Texas, As The Site Of '10X,' A New U.S. Rare Earth Magnet Manufacturing Campus 2/26/2026

    MP Materials Corp.today announced it has selected a 120‑acre site in Northlake, Texas, to develop “10X,” the company’s planned large-scale rare earth magnet manufacturing campus.

  4. Modus Test Partners With yieldWerx To Deliver Closed-Loop Socket To Silicon Correlation 2/26/2026

    Modus Test, a leader in advanced test socket testing solutions and performance validation, and yieldWerx, a semiconductor data and yield analytics platform, today announced a strategic partnership to help close the gap between test hardware and yield intelligence.

  5. Axcelis Unveils Purion H6: Next-Generation High Current Ion Implanter For Advanced Semiconductor Manufacturing 2/4/2026

    Axcelis Technologies, Inc. (NASDAQ:ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today introduced the Purion H6™ high current ion implanter—engineered to meet the demands of next-generation semiconductor devices with unmatched purity, precision and productivity.

  6. Siemens Acquires Canopus AI To Bring AI-Based Metrology To Semiconductor Manufacturing 2/4/2026

    Siemens today announced the acquisition of Canopus AI, an innovator in computational and AI-driven metrology solutions, enabling semiconductor manufacturers to achieve new levels of precision and efficiency in wafer and mask inspection processes.

  7. THine Announces Its Optical DSP-Free Chipset, Best Suited For 'Slow And Wide' Interconnection In Scale-Up AI Networks Of The Next Generation 2/1/2026

    THine Electronics, Inc. a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, today announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW technology for short-reach optical interconnect of PCI Express7(PCIe7) 2TB/s linear pluggable optics(LPO) or co-packaged optics(CPO), enabling to save power by 73% and lower latency by 90%.

  8. Nova Announces Adoption Of Metrion® By Two Leading Global Manufacturers 1/29/2026

    Nova (Nasdaq:NVMI) a leading innovator in metrology and process control solutions for advanced semiconductor manufacturing, today announced the adoption of its Nova Metrion® platform by global leaders in Memory and Logic device production.

  9. Arasan Announces The Immediate Availability Of The Industry's First xSPI NOR + eMMC NAND Combo PHY IP 1/29/2026

    Arasan Chip Systems, a leading provider of semiconductor IP for mobile and automotive SoCs, today announced the immediate availability of its xSPI + eMMC combo PHY IP. This IP integrates both xSPI and eMMC 5.1 PHY into a single, unified solution, enabling support for two different storage protocols within the same IP.

  10. 2.5Gbps MIPI D-PHY Redriver From Diodes Incorporated Optimizes Signal Integrity For Automotive Camera Monitoring Systems And ADAS 1/29/2026

    Diodes Incorporated (Diodes) today announces the release of the automotive-compliant* PI2MEQX2505Q