Current Headlines
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ROHM And Toshiba Agree To Collaborate In The Manufacturing Of Power Devices
12/8/2023
A plan by ROHM Co., Ltd. (“ROHM”) and Toshiba Electronic Devices & Storage Corporation (“Toshiba Electronic Devices & Storage”) to collaborate in the manufacture and increased volume production of power devices has been recognized and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.
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NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data For Ground-Breaking 3D X-DRAM
12/6/2023
NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced findings of 3D X-DRAM™ simulations. Semiconductor manufacturers and engineers use TCAD to simulate emerging technologies and optimize new products.
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Applied Materials And CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets
12/5/2023
Applied Materials, Inc. and CEA-Leti today announced an expansion of their longstanding collaboration to focus on developing differentiated materials engineering solutions for several specialty semiconductor applications.
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ASM Announces €300M Expansion Of U.S. Operations In Scottsdale, Arizona
12/5/2023
ASM International N.V. (Euronext Amsterdam: ASM), one of the fastest growing semiconductor equipment companies and global market leader in Atomic Layer Deposition, announced plans for a new North American expansion to accommodate growing demand for research and development in the semiconductor industry.
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NXP Introduces The Next Generation Of Automotive Ultra-Wideband ICs Combining Secure Ranging And Short-Range Radar
11/28/2023
NXP® Semiconductors (NASDAQ: NXPI) today announced the Trimension™ NCJ29D6, a fully integrated automotive single-chip Ultra-Wideband (UWB) family combining next-generation secure and precise real-time localization with short-range radar to address multiple use cases with a single system, including secure car access, child presence detection, intrusion alert, gesture recognition and more. Integrated by major automotive OEMs, devices from this family are expected to be on the road in model year 2025 vehicles.
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Renesas Introduces 32-Bit RX MCU With High-Speed, High-Precision Analog Front End For High-End Industrial Sensor Systems
11/22/2023
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its 32-bit microcontroller (MCU) offering with a new RX device for high-end industrial sensor systems.
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JST Manufacturing Formally Introduces Ospray Single-Wafer Wet Processing Family
11/14/2023
JST Manufacturing, Inc., a leading provider of wet benches and chemical processing systems for semiconductor manufacturing, today formally introduced its Ospray family of single-wafer wet processing systems.
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Advantest Rolls Out Pin Scale Multilevel Serial – Next-Generation High-Speed ATE Instrument
11/14/2023
Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced Pin Scale Multilevel Serial, its newest high-speed I/O (HSIO) instrument.
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Rakon Introduces AI Computing Product Portfolio With Next-Generation Ultra Stable TCXO Platform Launch
10/31/2023
Rakon today launched Niku, a new in-house designed ASIC semiconductor chip for Ultra Stable TCXOs (Temperature Compensated Crystal Oscillators).
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Synopsys Delivers Seamless Interoperability For Semiconductor Design Ecosystem With New Synopsys Cloud OpenLink Program
10/31/2023
Synopsys, Inc. (Nasdaq: SNPS) today announced the launch of its new Synopsys Cloud OpenLink program to foster semiconductor industry interoperability through an open cloud environment. The first of its kind program enables chip designers to seamlessly access third-party electronic design automation (EDA) tools and IP in the Synopsys Cloud environment.