Latest Headlines

  1. Applied Materials Expands Patterning Solutions Portfolio For Angstrom Era Chipmaking 2/26/2024

    Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to address the patterning requirements of chips in the “angstrom era.” As chipmakers transition to process nodes at 2nm and below, they increasingly benefit from new materials engineering and metrology techniques that help overcome EUV and High-NA EUV patterning challenges, including line edge roughness, tip-to-tip spacing limitations, bridge defects and edge placement errors.

  2. Wipro And Intel Foundry Announce New Collaboration To Advance Chip Design And Development 2/21/2024

    Wipro Limited, a leading global technology services and consulting company, today announced an expanded collaboration with Intel Foundry to accelerate chip design innovation. As the key Design Services and Alliance Partner, Wipro will work with Intel Foundry to accelerate the development of Intel’s most advanced process nodes, including the Intel18A process node.

  3. EdgeQ Deploys Arteris IP For Its 5G+AI Base Station-On-A-Chip For Wireless Infrastructure 2/13/2024

    Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that EdgeQ has deployed Arteris’ FlexNoC network-on-chip (NoC) IP on its revolutionary 5G and AI-driven Base Station-on-a-Chip.

  4. Rakon Launches Small Form Factor IC-OCXO With 8hr Holdover For Cloud Data Centres And Next-Generation Telecom Networks 1/25/2024

    Rakon has launched its first IC-OCXO products combining its in-house designed Mercury semiconductor chip and XMEMS resonators under the brand MercuryX. MercuryX OCXOs provide ultra-high stability and an extended holdover of 8 hours. in real-world conditions, all in a small form factor package size. The new OCXOs are an excellent fit for timing and synchronisation in AI computing / data centres and 5G, 5G Advanced and 6G telecommunications networks as well as satellite terminals and instrumentation.

  5. Moov Releases Equipment Management Software For Semiconductor Manufacturers 1/25/2024

    Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced the release of its new Equipment Management Software (EMS) for semiconductor manufacturers.

  6. Valens Semiconductor Enables Unprecedented, Resilient Surround View Systems For Long Vehicles, With Its New VA700R Series, Capable Of 40-Meter Multi-Gig Connectivity 1/24/2024

    Today, Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, unveiled the VA700R Series, which offers industry leading bandwidth and link distance for long vehicle sensor connectivity. Enabling 4Gbps at distances of up to 40 meters/130 feet, while supplying power and bi-directional control over the cable, the VA700R provides the connectivity infrastructure upon which innovative visibility solutions can be designed for truck drivers.

  7. SEALSQ Announces An Initiative Focused On Semiconductor Personalization Centers, SEALCOINS Incentivization, And Advanced Iot Integration Aiming To Mitigate Global Dependency On Semiconductor Manufacturing And Fortify Microchip Deployment Capabilities 1/23/2024

    SEALSQ Corp ("SEALSQ" or "Company") (NASDAQ: LAES), a leader in the fields of Semiconductors, PKI, and Post-Quantum technology, today announced a groundbreaking strategy set to incentivize the creating of Semiconductors Personalization Centers to contribute into the decentralization of the global semiconductor, cryptocurrency, AI and IoT sectors.

  8. Sondrel Completes A Multi-Billion Transistor Chip Design At 5nm 1/23/2024

    Sondrel, a leading provider of ultra-complex chips for leading global technology brands, has announced that it has completed its most complex chip design to date. Designed on a 5nm process node, this ultra-complex design has more than 50 billion transistors.

  9. Lumotive Joins With Tech Leaders To Demo Digital Beam Steering At CES 2024 1/4/2024

    Lumotive, a pioneer in optical semiconductor technology, today announced that it is partnering with three of the world's strongest tech brands to showcase its award-winning digital beam steering capabilities at the upcoming Consumer Electronics Show (CES). Lumotive's breakthrough Light Control Metasurface (LCM™) technology, which will also receive a prestigious CES 2024 Innovation Award, will power hands-on demonstrations featuring Sony Semiconductor Solutions (Sony), Adaps, and Seoul Robotics products at the world's premiere tech gathering in Las Vegas.

  10. SEALSQ's Post-Quantum Semiconductor Technology Fortifies Cryptocurrency Security 12/28/2023

    SEALSQ Corp ("SEALSQ" or "Company") (NASDAQ: LAES), a company that focuses on developing and selling Semiconductors, PKI and Post-Quantum technology hardware and software products, today announced that its post-quantum semiconductor technology based on cutting-edge cryptographic algorithms, is specifically designed to withstand attacks from and secure cryptocurrency transactions against the looming threat of quantum computing.