Business Wire

  1. X-FAB Sarawak Set To Begin Volume Production Of 0.35 Micrometer Analog/Mixed-Signal High-Voltage Technology 9/3/2008
    X-FAB Silicon Foundries, today announced that its Malaysian facility in Kuching, Sarawak, Malaysia – with its modern 200 mm production line – now is fully qualified for volume production and second sourcing of the company’s 0.35 micrometer high-voltage process technology called XH035
  2. Cymer Unveils New XLR 500d, Enabling High Productivity Dry ArF Lithography 9/3/2008
    Cymer, Inc., the market’s leading developer of light sources used to create advanced semiconductor chips, has unveiled the XLR 500d—an argon fluoride (ArF) laser light source for 32 nanometer (nm) dry lithography
  3. SiTest Solutions Standardizes On Verigy V5000e For Flash Memory Test 9/2/2008
    Verigy, a premier semiconductor test company, today announced that SiTest Solutions Ltd., a leading service provider for test engineering solutions and services, selected Verigy’s V5000 family as its flash memory test platform
  4. IAR Systems, NXP Semiconductors And Micrium Collaborate To Launch Flexible RTOS-Based Reference Design Platform 8/28/2008
    IAR Systems, NXP Semiconductors, and Micrium have announced the launch of a new reference design platform targeted at RTOS-based, ARM-powered embedded systems for industrial applications
  5. CRFS Selects XJTAG Boundary Scan To Speed Development Of RFeye Spectrum Monitoring System 8/28/2008
    CRFS (Cambridge Radio Frequency Services), a developer and manufacturer of innovative real-time spectral analysis tools, has selected the XJTAG boundary scan development system to debug, test and programme its RFeye™ real-time spectrum monitoring system
  6. Aviza Technology Receives Multiple Orders For Its Omega fxP Etch Systems For Deep Silicon Etch Applications 8/27/2008
    Aviza Technology, Inc., a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced multiple orders for its 200 mm and 300 mm Omega fxP etch systems and deep silicon (DSi) etch modules to three leading semiconductor manufacturers in Europe
  7. Harris Corporation Announces Strategic Alliance With Freescale Semiconductor For New Range Of TV Transmitters 8/27/2008
    Harris Corporation (NYSE:HRS), an international communications and information technology company, announced that it will integrate technology from Freescale Semiconductor, a global leader in the design and manufacture of embedded semiconductors, into its new TV transmitters for terrestrial broadcasters
  8. 1 Amp Constant-Current, Low Dropout Driver (LDD) From Catalyst Semiconductor Targets High-Power LED Lighting Applications 8/27/2008
    Catalyst Semiconductor, Inc. a supplier of analog, mixed-signal and non-volatile memory semiconductors, has expanded its line of constant-current, LDD™ (low dropout driver) products to include a new, simple-to-use, high-power device for architectural, landscape, automotive and general LED lighting products
  9. EMRISE Sells Printed Circuit Board Division Assets To Sierra Circuits, Inc. 8/27/2008
    EMRISE CORPORATION a multi-national manufacturer of defense and aerospace electronic devices and communications equipment, today announced that it has sold the assets of its printed circuit board (PCB) business, EMRISE Circuit Division (ECD), in Monrovia, CA., to Sierra Circuits, Inc. (Sierra), a leading provider of quick-turn printed circuit boards located in Sunnyvale, CA.
  10. SUSS MicroTec Announces CB Wafer Bonders Series For Advanced MEMS 8/26/2008
    SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor industry, announces the CB Series, semi and fully automated wafer bonders, for Advanced MEMS devices for the automotive and consumer markets