Business Wire
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Tower Semiconductor Completes Merger With Jazz Technologies
9/19/2008
Tower Semiconductor Ltd., an independent specialty wafer foundry, today announced the completion of its merger with Jazz Technologies, Inc., a leader in Analog-Intensive Mixed-Signal foundry solutions.
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ROHM Electronics Announces Complete Line Of PWM Output H-Bridge Driver ICs For DC Brush Motors Offering Selection Of Motor Speed Control Options
9/19/2008
ROHM Electronics formally introduces its complete line of H-bridge driver ICs offering designers a simple upgrade path to pulse-width modulation (PWM) speed control using either analog or digital inputs
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Eagle Test Systems Selects Camstar's Enterprise Manufacturing And Quality Execution Platform
9/18/2008
Camstar Systems, Inc., today announced that Eagle Test Systems, Inc. (Nasdaq: EGLT), a provider of automated test equipment solutions for high-performance analog, mixed-signal and radio frequency (RF) semiconductors, has selected Camstar’s Electronics Suite to increase visibility and traceability across manufacturing processes and to support yield and quality improvements
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Frost & Sullivan Awards Vitesse Semiconductor For Energy-Saving Solutions
9/18/2008
Frost & Sullivan recognizes Vitesse Semiconductor Corporation with the 2008 Global Frost & Sullivan Green Excellence of the Year Award. Vitesse’s development of the EcoEthernet solutions is a significant first step toward reducing worldwide network switching power consumption
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SUSS MicroTec Announces ISO 9001:2000 Certification
9/18/2008
SUSS MicroTec., announces that SUSS MicroTec Inc., manufacturer and supplier of production and process wafer bonding systems, now holds the globally recognized ISO 9001 certification for having established a high level process and system-oriented quality management (QM) based on ISO 9001 standards
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Semilab Licenses Implant And Metal Thickness Metrology Technology From Applied Materials
9/17/2008
Semilab Co. Ltd., announced today that it has licensed key patents and transferred relevant know-how from Applied Materials, Inc. The acquired intellectual property (IP) covers technology and systems used in semiconductor applications for measuring implant and metal thickness
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Fairchild Semiconductor's Digital Power Controllers Deliver Highly Efficient And Flexible Point-Of-Load Power Conversion Solutions
9/16/2008
Fairchild Semiconductor addresses energy-efficiency specifications, such as Energy Star, with its first point-of-load digital power control and management products for communication and computing applications
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NEC Electronics And ELMOS To Enter Strategic Partnership
9/16/2008
NEC Electronics Corporation and ELMOS Semiconductor AG are going to join forces demonstrated by entering into a worldwide long-term partnership. The agreement will encompass the joint development, cross-use of engineering and manufacturing services as well as common marketing of products for the automotive and industrial markets
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Achronix Semiconductor Launched To Break Through FPGA Performance Barriers
9/16/2008
Achronix Semiconductor today announced that it has already begun shipping the world’s fastest FPGAs. The Speedster family, with the SPD60 as its initial member, delivers speeds up to 1.5 GHz, which represents a three-fold increase in performance over existing FPGAs
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ClariPhy Demonstrates 10G MLSD PHY In XFP Application At ECOC 2008
9/15/2008
ClariPhy Communications, today announced that it will demonstrate its all-digital CMOS 10-Gbit/s maximum likelihood sequence detection (MLSD) technology in an XFP application at ECOC 2008, Europe’s largest conference on optical communications
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