Business Wire

  1. eASIC Delivers 45nm Zero Mask-Charge New ASIC Family 8/4/2008
    Leveraging the rapid success of its award winning 90nm Nextreme ASIC Products, eASIC Corporation today announced its next generation Nextreme-2 Family – the semiconductor industry’s first 45nm, zero mask-charge New ASIC family
  2. UMC's Embedded DRAM, URAM Proven In 65nm Customer Silicon 8/4/2008
    UMC, a leading global semiconductor foundry, today announced that it has produced functional 65nm customer products incorporating URAM, the company’s patented embedded DRAM (eDRAM) technology. URAM enables higher performance, lower power consumption, and reduced chip size compared to traditional embedded 6T SRAM or external DRAM
  3. IXYS Announces New 5.2kV High Power Thyristor For Better Energy Efficiency 7/31/2008
    IXYS Corporation announced that its wholly owned UK subsidiary, Westcode Semiconductors Limited, has expanded its “Mega Watts” family of Medium Voltage thyristors, with the new 5.2kV device with RMS current rating of 1100A and is encapsulated in a 34mm (1.39”) pole face hermetic pressure contact package
  4. First 8” MEMS Cluster Tool From Oerlikon On Its Way To Korea 7/31/2008
    u-IT Cluster Center, a Korean RFID/USN infrastructure facility providing foundry service of MEMS Sensors (USN Fab) and RFID/USN related activities from design to testing of RFID/USN products (RFID/USN Engineering Lab), signed a contract for purchasing a CLUSTERLINE® 200 II manufacturing tool from Oerlikon for 6” & 8” MEMS R&D and mass production
  5. KLA-Tencor Announces Intent To Acquire The Microelectronic Inspection Equipment Business Unit Of Vistec Semiconductor Systems 7/30/2008
    KLA-Tencor today announced that it has entered into an agreement to acquire the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems, which is wholly owned by Golden Gate Capital, a San Francisco-based private equity firm
  6. Veeco Receives Multi-Unit Order from Spectrolab To Support Capacity Increase 7/28/2008
    Veeco Instruments Inc. today announced that during the recently completed second quarter the Company received a multi-unit order for its TurboDisc K-475 As/P (arsenic phosphide) metal organic chemical vapor (MOCVD) deposition systems from Boeing Spectrolab Inc.
  7. Teradyne Introduces The IP750Ex For Image Sensor Device Test 7/28/2008
    Teradyne, Inc. announced that Hynix Semiconductor, Inc., Icheon-si, Kyoungki-do Korea, has launched the production of their first CMOS image sensor using the new Teradyne IP750Ex™ test system for wafer testing
  8. Peregrine Semiconductor And Rubicon Technology Advance On 8” Sapphire Wafers For UltraCMOS RFICs 7/28/2008
    Peregrine Semiconductor Corporation, a leading supplier of high-performance RF CMOS and mixed-signal communications ICs and Rubicon Technology, a leading manufacturer of sapphire substrates and other advanced technology materials, today announced that Rubicon has begun initial production of 8” sapphire wafers for supply to Peregrine for its UltraCMOS™ Silicon-on-Sapphire (SOS) semiconductor processing
  9. Peregrine Semiconductor Ships 300 Millionth UltraCMOS RFIC 7/22/2008
    Peregrine Semiconductor Corporation, a leading supplier of high-performance RF CMOS and mixed-signal communications ICs, today announced that it has shipped its 300 millionth UltraCMOS™ RFIC
  10. Diodes Incorporated Qualifies Power Management ICs For Automotive Markets 7/22/2008
    Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete and analog semiconductor markets, today announced the qualification of a series of its popular Zetex power management ICs to the AEC-Q100 automotive quality specification