Business Wire

  1. Rohm And Haas Unveils New ACuPLANE Copper Barrier CMP Solution 9/10/2008
    Rohm and Haas Electronic Materials, today launched its ACuPLANE™ Copper (Cu) Barrier CMP Solution for advanced Cu/low-k interconnect applications. The ACuPLANE system combines Rohm and Haas’s EcoVision 4000 CMP Pad and ACuPLANE 5000 Series slurries to deliver a tunable CMP system that meets the stringent requirements of advanced process nodes
  2. Analog Devices Selects Virage Logic's AEON Non-Volatile Memory Technology For High-Reliability Applications 9/9/2008
    Virage Logic Corporation, announced that Analog Devices, a global leader in high-performance semiconductors for signal processing applications, has licensed the company’s AEON embedded non-volatile memories (NVM) for use in a broad range of analog and mixed-signal products
  3. Microchip Technology Offers New Capacitive Touch Demo Board; Simplifies Integration Of Cap-Touch Interfaces Into 16-Bit MCUs 9/8/2008
    Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced an addition to its mTouch capacitive touch offerings, the PICDEM Touch Sense 2 Demo Board (Part # DM164128)
  4. Jazz Semiconductor Expands Analog-Intensive Mixed-Signal (AIMS) Functionality With Adoption Of Cadence Virtuoso IC 6.1 Custom Design Platform 9/8/2008
    Jazz Semiconductor, today announced availability of the Jazz IC 6.1 process design kit (PDK) for Cadence Design Systems’ Virtuoso® IC 6.1 custom design platform in Jazz’s 0.18-micron SiGe BiCMOS process (SBC18). The collaboration between Jazz and Cadence on integrated radio frequency/mixed-signal (RF/MS) platforms reduces time-to-market for AIMS products
  5. Laser Driver Chip Set Provides First Comprehensive Solution For SFP+ Transceivers 9/8/2008
    Vitesse Semiconductor Corporation, a leader in advanced ICs for Carrier and Enterprise networks, announced today the VSC7985 and VSC7986, the latest members of Vitesse’s industry leading 10 Gbps laser driver family
  6. Rudolph Releases New Wafer Edge And Backside Macro Inspection Modules 9/8/2008
    Rudolph Technologies, Inc., a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the release of its new E30 and B30 modules for wafer edge and backside inspection
  7. Dellux Technologies Selects OSRAM Golden Dragon LEDs For Main Tunnel Lighting 9/8/2008
    Dellux Technologies Inc., Canada, an international leader in LED tunnel lighting, has selected Golden DRAGON® LEDs from OSRAM Opto Semiconductors for the luminaires to be installed in the “Thüringer Schmücketunnel” on the A71 in the German state Thüringen. Upon installation of the new LED luminaires, in the fall of 2008, it will be the first tunnel in Germany and the longest in Europe to be illuminated by LED light
  8. KLA-Tencor Introduces New Surfscan SP2XP Monitor-Wafer Defect Inspection System For IC Fabs 9/4/2008
    KLA-Tencor Corporation introduced the Surfscan SP2XP, a new monitor-wafer inspection system for the integrated circuit (IC) market that builds upon the success of its sister tool with the same name, introduced last year for the wafer manufacturing market
  9. SUSS MicroTec Announces 300 mm ProbeShield System Order 9/4/2008
    SUSS MicroTec Test Systems has announced that it has received an order for the PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test, from a major Asian semiconductor memory manufacturer
  10. X-FAB Sarawak Set To Begin Volume Production Of 0.35 Micrometer Analog/Mixed-Signal High-Voltage Technology 9/3/2008
    X-FAB Silicon Foundries, today announced that its Malaysian facility in Kuching, Sarawak, Malaysia – with its modern 200 mm production line – now is fully qualified for volume production and second sourcing of the company’s 0.35 micrometer high-voltage process technology called XH035