Business Wire

  1. Aviza Technology Introduces StratIon fxP, The World's First 300-mm Ready Ion Beam Deposition System 11/6/2008
    Aviza Technology, Inc., a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced the introduction of StratIon fxP, the world’s first 300-mm ready Ion Beam Deposition system
  2. Qspeed Introduces High-Performance Common Cathode Diode In Industry-Standard TO-220 Package 11/6/2008
    Qspeed Semiconductor announces the full production release of its first common cathode product in an industry standard TO-220 package. The LQA20T300C, comprised of two 10-amp, 300-volt diodes in a common cathode configuration, is the latest addition to Qspeed’s portfolio of high performance power semiconductors
  3. Tokyo Electron (TEL) Introduces A Dual Purpose 300mm Dicing Frame Prober 11/4/2008
    Tokyo Electron, Ltd. (TEL) today unveiled the company’s new 300mm Dicing Frame Prober, the WDF 12DP. Designed to address the increasing demand for probing of ultra thin and diced wafers, the system can also be used as a standard wafer prober
  4. Microchip Technology Enhances Mid-Range 8-Bit PIC Microcontroller Core 11/4/2008
    Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced an enhancement to the microcontroller (MCU) architecture supporting Mid-range 8-bit PIC12 and PIC16 MCUs
  5. Carl Zeiss Receives Prestigious R&D 100 Award For Revolutionary Helium-Ion-Microscope 11/3/2008
    Carl Zeiss SMT, a leading global provider of electron- and ion-beam imaging and analysis equipment, was honored recently with a prestigious R&D 100 Award for one of the 100 most technologically significant new products in 2008
  6. Agilent Technologies Introduces Industry's First Device Analyzer With Curve Tracer Functionality For Power-Device Evaluation 11/3/2008
    Agilent Technologies Inc. today introduced the industry’s first power device analyzer/curve tracer able to characterize semiconductor devices at up to 3,000 volts and 20 amps in a single box solution
  7. ON Semiconductor To Showcase Energy-Efficient Solutions For Automotive, Industrial And Portable Designs With Live Stand Demonstrations 11/3/2008
    ON Semiconductor, a leading global supplier of high-performance, energy-efficient, silicon solutions, will be using electronica 2008 to run a number of live demonstrations based on the company’s efficient control, signal path and power management technologies for automotive, industrial and portable applications
  8. Cypress Adds Color To LUPA High-Speed SXGA CMOS Image Sensor For Machine Vision And Motion Analysis Applications 11/3/2008
    Cypress Semiconductor Corp. today announced the commercial sampling of a high-sensitivity, high-speed SXGA (Super Extended Graphics Array) resolution CMOS image sensor with color
  9. FEI's New TrueCrystal Package Provides Rapid, Accurate Strain Profiling For Semiconductor Manufacturing 11/3/2008
    FEI Company, a leading provider of atomic-scale imaging and analysis systems, today released its new TrueCrystal Strain Analysis package that can be installed on a Titan or Tecnai scanning/transmission electron microscope (S/TEM) system
  10. SEMATECH Acquires TSV RIE Tool From Tokyo Electron Limited 10/29/2008
    SEMATECH, in partnership with the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, is pleased to announce that it has received a 300 mm Telius SP UD system from Tokyo Electron Limited (TEL)