Business Wire

  1. TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone 5/16/2026

    TetraMem Inc., a Silicon Valley–based semiconductor company developing analog in-memory computing (IMC) solutions, today announced the successful tape-out, manufacturing, and initial silicon validation of its MLX200 platform, a 22nm multi-level RRAM-based analog IMC system-on-chip (SoC).

  2. A Quieter World For Quantum: Argonne Demonstrates Ultra-Low Noise Levels Of An Innovative Qubit Platform 4/30/2026

    Quantum bits (qubits) are the fundamental building blocks of quantum information processing.

  3. Alpha And Omega Semiconductor Unveils SmartClamp Protected DrMOS Family For AI Servers And High-End GPUs 4/30/2026

    Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide bandgap power devices, power management ICs, and modules, today announced the launch of the SmartClamp family of protected DrMOS.

  4. MACOM's 500W GaN-On-Si Power Transistor For L-Band ASR Applications 10/10/2017

    MACOM Technology Solutions Inc. (“MACOM”) recently announced the newest entry in its GaN-on-Si power transistor portfolio for pulsed L-Band radar systems targeted for airport surveillance radar (ASR) applications at 1.2 to 1.4 GHz.

  5. New Solar Company Silevo Launches With Industry's Best Performance-To-Cost Ratio Modules 10/13/2011
    Silevo, Inc., a solar cell innovator and photovoltaic solar module manufacturer, today emerged from stealth mode to announce the industry's best performance-to-cost ratio for solar modules by evolving the use of silicon with new groundbreaking technology
  6. TriQuint Unveils PowerBand: Revolutionary High Power, Wideband RF Transistors 11/17/2008
    TriQuint Semiconductor, a leading RF product manufacturer and foundry services provider, today announced the availability of a revolutionary new high power discrete RF transistor family for broadband applications including radar, signal jammers and wireless communications
  7. Singapore's Institute Of Microelectronics And Chartered Develop Advanced Fine-Pitch Packaging Solutions At 65nm 11/17/2008
    A*STAR’s Institute of Microelectronics (IME), Singapore and Chartered Semiconductor Manufacturing, one of the world’s top dedicated semiconductor foundries, have successfully optimized a range of fine-pitch packaging technologies for copper metallization and low-k dielectric silicon processes at 65 nanometer (nm) and below
  8. Hodogaya Promotes Its Transport Materials For The Novaled PIN OLED Structures 11/13/2008
    Hodogaya Chemical Co., LTD, long experienced specialist and market leader in charge transport materials, and Novaled AG, leader in power efficient and long living Organic Light Emitting Diodes (OLEDs) have agreed to offer hole transport materials for Novaled PIN OLED structures
  9. Tegal Receives Order For Deep Silicon Etch Cluster Tool For Power Management And MEMS Sensor Applications 11/13/2008
    Tegal Corporation, a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, announced today that the Company received an order for a Tegal 4200SE Advanced Multichamber ICP plasma etching system for Deep Reactive Ion Etching applications in Power Device and MEMS Sensor fabrication
  10. SUSS MicroTec Introduces The iVista LC 11/11/2008
    SUSS MicroTec Test Systems, the premier supplier of wafer-level test solutions for semiconductor devices, today announced the iVista LC High-Resolution Digital Microscope