Business Wire

  1. THine Announces Its Optical DSP-Free Chipset, Best Suited For 'Slow And Wide' Interconnection In Scale-Up AI Networks Of The Next Generation 2/1/2026

    THine Electronics, Inc. a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, today announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW technology for short-reach optical interconnect of PCI Express7(PCIe7) 2TB/s linear pluggable optics(LPO) or co-packaged optics(CPO), enabling to save power by 73% and lower latency by 90%.

  2. 2.5Gbps MIPI D-PHY Redriver From Diodes Incorporated Optimizes Signal Integrity For Automotive Camera Monitoring Systems And ADAS 1/29/2026

    Diodes Incorporated (Diodes) today announces the release of the automotive-compliant* PI2MEQX2505Q

  3. Credo Introduces Industry's First 224G Multiprotocol AI Scale-Up Retimer Supporting UALink, ESUN And Ethernet 1/29/2026

    Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced its Blue Heron 224G AI scale-up retimer, optimized to support the growing need for extended cable and PCB backplane links using UALink, ESUN, and Ethernet protocols.

  4. Alpha And Omega Semiconductor Unveils Its Powerful αMOS E2 600V Super Junction MOSFET Platform 1/27/2026

    Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today unveiled its powerful αMOS E2 600V Super Junction MOSFET platform.

  5. GCT Semiconductor Launches Commercial Shipments Of 5G Chipset 1/6/2026

    GCT Semiconductor Holding Inc. (“GCT” or the "Company") a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced the first commercial shipments of its 5G chipset to GCT’s lead customers.

  6. Rigaku Launches ONYX 3200, A Metrology Instrument For Semiconductor Manufacturing 12/17/2025

    Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) announced the launch of the ONYX 3200, a new semiconductor metrology system to measure film thickness, composition and bump* structures for wafer-level processes.

  7. DNP Achieves 10nm Line Pattern Resolution On Nanoimprint Template For Cutting-Edge Semiconductors 12/9/2025

    Dai Nippon Printing Co., Ltd. today announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter).

  8. Gigaphoton Excimer Laser For Advanced Packaging Installed At Japanese Company 12/7/2025

    Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that it has delivered an excimer laser for semiconductor advanced packaging to a Japanese company engaged in research and development of advanced semiconductors, and the installation of the system was successfully completed in November.

  9. UMC And Polar Collaborate To Meet Growing Demand For U.S. Onshore Semiconductor Manufacturing 12/4/2025

    United Microelectronics Corporation (“UMC”), a leading global semiconductor foundry, and Polar Semiconductor, LLC (“Polar”), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, today announced they have signed a Memorandum of Understanding (MOU) to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace & defense.

  10. Rigaku Launches XTRAIA MF-3400, A Measuring Instrument For Next-Generation Semiconductors 12/4/2025

    Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers.