Business Wire

  1. OKI Achieves 3D Integration Of Thin-Film Analog ICs Using CFB Technology In Collaboration With Nisshinbo Micro Devices 1/28/2025

    OKI, in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) integration (Note 1) of thin-film analog ICs (Note 2) using Crystal Film Bonding (CFB) technology (Note 3).

  2. MACOM's 500W GaN-On-Si Power Transistor For L-Band ASR Applications 10/10/2017

    MACOM Technology Solutions Inc. (“MACOM”) recently announced the newest entry in its GaN-on-Si power transistor portfolio for pulsed L-Band radar systems targeted for airport surveillance radar (ASR) applications at 1.2 to 1.4 GHz.

  3. New Solar Company Silevo Launches With Industry's Best Performance-To-Cost Ratio Modules 10/13/2011
    Silevo, Inc., a solar cell innovator and photovoltaic solar module manufacturer, today emerged from stealth mode to announce the industry's best performance-to-cost ratio for solar modules by evolving the use of silicon with new groundbreaking technology
  4. TriQuint Unveils PowerBand: Revolutionary High Power, Wideband RF Transistors 11/17/2008
    TriQuint Semiconductor, a leading RF product manufacturer and foundry services provider, today announced the availability of a revolutionary new high power discrete RF transistor family for broadband applications including radar, signal jammers and wireless communications
  5. Singapore's Institute Of Microelectronics And Chartered Develop Advanced Fine-Pitch Packaging Solutions At 65nm 11/17/2008
    A*STAR’s Institute of Microelectronics (IME), Singapore and Chartered Semiconductor Manufacturing, one of the world’s top dedicated semiconductor foundries, have successfully optimized a range of fine-pitch packaging technologies for copper metallization and low-k dielectric silicon processes at 65 nanometer (nm) and below
  6. Hodogaya Promotes Its Transport Materials For The Novaled PIN OLED Structures 11/13/2008
    Hodogaya Chemical Co., LTD, long experienced specialist and market leader in charge transport materials, and Novaled AG, leader in power efficient and long living Organic Light Emitting Diodes (OLEDs) have agreed to offer hole transport materials for Novaled PIN OLED structures
  7. Tegal Receives Order For Deep Silicon Etch Cluster Tool For Power Management And MEMS Sensor Applications 11/13/2008
    Tegal Corporation, a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, announced today that the Company received an order for a Tegal 4200SE Advanced Multichamber ICP plasma etching system for Deep Reactive Ion Etching applications in Power Device and MEMS Sensor fabrication
  8. SUSS MicroTec Introduces The iVista LC 11/11/2008
    SUSS MicroTec Test Systems, the premier supplier of wafer-level test solutions for semiconductor devices, today announced the iVista LC High-Resolution Digital Microscope
  9. Ramtron Announces Faster And Power Flexible 1-Megabit Parallel F-RAM 11/11/2008
    Ramtron International Corporation, a leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, today launched the first parallel device in a family of new parallel and serial F-RAM products that offer higher-speed read/write performance, lower voltage operation, and optional device features
  10. Peregrine Semiconductor Invents DuNE Technology For Mobile Antenna Tuning 11/10/2008
    Peregrine Semiconductor Corporation, a leading supplier of high-performance RF CMOS and mixed-signal communications ICs, today announced a breakthrough in the highly sought-after solution to mobile antenna tuning