Business Wire

  1. Agileo Automation Launches Agil'EDA To Accelerate SEMI EDA Adoption For Semiconductor Equipment OEMs 3/25/2026

    Agileo Automation, a leading global provider of control and connectivity solutions for semiconductor manufacturing, today unveils Agil'EDA, a new software implementing Equipment Data Acquisition (EDA/Interface A).

  2. OKI Launches EMS For AI Server Equipment Featuring Proprietary High Heat Dissipation Technology 3/24/2026

    OKI will launch Comprehensive Electronics Manufacturing Services (EMS) for AI server equipment on March 25, 2026.

  3. Keysight Introduces Hands-On Semiconductor Teaching Labs For Universities 3/24/2026

    Keysight Technologies, Inc.today announced three new semiconductor teaching lab solutions designed to help universities prepare students for careers in the global semiconductor industry. The three solutions—Basic Design and Measurement,

  4. DG Matrix Selects Infineon As A Key Silicon Carbide Supplier For Its Multi-Port Solid-State Transformer Platform 3/24/2026

    DG Matrix, the global leader in solid-state transformer solutions, today announced that it will source latest-generation silicon carbide (SiC) MOSFETs from Infineon Technologies AG, a global semiconductor leader in power systems and IoT, for use in its Interport multi-port solid-state transformer platform.

  5. Semtech SurgeSwitch Tackles The USB-PD VBus Protection Gap At 53 V 3/24/2026

    Semtech Corporation, a leading provider of high-performance semiconductors powering data center networking, Internet of Things (IoT) connectivity and cellular infrastructure solutions, today announced the TDS5311P, the industry’s first circuit protection device to deliver near-constant clamping voltage for USB Power Delivery (PD) Extended Power Range (EPR) applications at 48 V.

  6. Power Integrations Extends The Power Range Of Flyback Topologies To 440W, Creating A Simpler Power Solution Than Resonant Designs 3/23/2026

    Power Integrations , a leading company in high-efficiency power conversion using high-voltage integrated circuits , today announced a breakthrough technology for flyback topologies, extending the power range of flyback converters to 440W—far exceeding the limits of traditionally more complex LLC resonant topologies.

  7. Faraday Broadens IP Offerings On UMC's 14nm Process For Edge AI And Consumer Markets 3/3/2026

    Faraday Technology Corporation a leading ASIC design and IP provider, today announced the continued expansion of its IP product lines on UMC’s 14nm FinFET Compact (14FCC) platform, covering USB 2.0/USB 3.2 Gen1 PHY, LVDS TX/RX I/O, DDR 3/4 combo PHY (up to 4.2 Gbps), and LPDDR 4/4X/5 PHY (up to 6.4 Gbps).

  8. United Semiconductors Reserves Payload Space With Starlab To Advance Commercial-Scale In-Space Semiconductor Manufacturing 3/3/2026

    Starlab Space LLC, the commercial space station developer expanding access to low Earth orbit research, today announced a payload reservation agreement with United Semiconductors LLC (USLLC) to support the transition of its space-based semiconductor crystal growth technology from demonstration aboard the International Space Station (ISS) to sustained commercial-scale production in low Earth orbit.

  9. Credo Acquires CoMira Solutions 3/2/2026

    Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that it has acquired high-speed connectivity IP innovator CoMira Solutions.

  10. StratEdge Powers Up For 2026: Showcasing Molded Ceramic Packages At IMAPS Device Packaging And GOMACTech 2/27/2026

    StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high reliability packages, will highlight its molded ceramic and gold plated tab products lines at two March exhibitions.