Latest Headlines

  1. Silanna Semiconductor Introduces Versatile 12A Buck Converter For Ultra-Compact PCB Layout

    Silanna Semiconductor, an innovative producer of disruptive technologies, today announced its highly integrated SZPL8216A family of synchronous point-of-load (PoL) buck converters

  2. Sanan IC Expands Wafer Foundry Portfolio For Power Electronics With 150mm GaN-On-Silicon Process

    SANAN INTEGRATED CIRCUIT CO., LTD. (Sanan IC), a pure-play wafer foundry with its advanced compound semiconductor technology platform, today announced the commercial release of its 150mm gallium nitride (GaN) on silicon wafer foundry services intended for the latest high voltage AC/DC and DC/AC power electronics applications in the global market

  3. Raytheon Honors Lansdale Semi With Highest Award

    R. Dale Lillard, President, Lansdale Semiconductor, Inc., recently announced that the company was honored for the sixth consecutive year by Raytheon Integrated Defense Systems for Supplier Excellence. This year, Lansdale achieved Raytheon’s highest 5 Star Award.

  4. Vishay Intertechnology 1 A And 2 A FRED Pt® Ultrafast Rectifiers In SMP Package Increase Power Density, Improve Efficiency

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its offering of FRED Pt® Ultrafast recovery rectifiers with eight new 100 V and 200 V devices in the eSMP® series SMP (DO-220AA) package, including the industry’s first to offer current ratings to 2 A. Measuring 3.85 mm by 2.03 mm with a low 1 mm profile, the Vishay Semiconductors diodes provide space-saving alternatives to devices in the SMA (DO-214AC)

  5. NXP And Microsoft Bring Microsoft Azure Sphere Security To The Intelligent Edge With A New Energy-Efficient Processor

    NXP Semiconductors N.V. (NASDAQ:NXPI) today announced collaboration with Microsoft to deliver a new Microsoft Azure Sphere certified crossover applications processor, as an extension to their popular i.MX 8 high-performance applications processor series

  6. GaN Systems Shows How GaN Is Revolutionizing Wireless Charging At Wireless Power Week

    GaN Systems, the global leader in GaN (gallium nitride) power semiconductors, will deliver presentations and display numerous innovative wireless power transfer solutions enabled by GaN at Wireless Power Week taking place in London on June 17-21, 2019.

  7. EV Group Brings Nanoimprint Lithography To Full-Scale Production With The First Fully Integrated 300-mm Nanoimprint Lithography Track System

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, recently unveiled the HERCULES NIL 300 mm—a fully integrated track system that combines cleaning, resist coating and baking pre-processing steps with EVG’s proprietary SmartNIL wafer-level nanoimprint lithography (NIL) process in a single platform for wafers up to 300 mm in diameter

  8. ALTEN Calsoft Labs Acquires Wafer Space, A Semiconductor And Embedded Systems Company

    ALTEN Calsoft Labs, a leading Engineering R&D services and Enterprise Digital Transformation solutions company, has acquired Wafer Space

  9. IMT Announces 8-inch Wafer Fabrication Capabilities

    Innovative Micro Technology, Inc. (IMT) officially announced today that it is offering 8-inch (200mm) wafer fabrication capabilities, marshalling in a new era in the company’s ability to serve the growing MEMS industry

  10. pSemi Corporation Announces Next Generation UltraCMOS® Technology

    pSemi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, today announced the release of UltraCMOS® 13. The platform represents the next generation of pSemi's proprietary RFSOI technology, manufactured in high-volume 300mm foundries, enabling superior performance and integration for RF front-end components.