Business Wire

  1. Hodogaya Promotes Its Transport Materials For The Novaled PIN OLED Structures
    11/13/2008
    Hodogaya Chemical Co., LTD, long experienced specialist and market leader in charge transport materials, and Novaled AG, leader in power efficient and long living Organic Light Emitting Diodes (OLEDs) have agreed to offer hole transport materials for Novaled PIN OLED structures
  2. Tegal Receives Order For Deep Silicon Etch Cluster Tool For Power Management And MEMS Sensor Applications
    11/13/2008
    Tegal Corporation, a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, announced today that the Company received an order for a Tegal 4200SE Advanced Multichamber ICP plasma etching system for Deep Reactive Ion Etching applications in Power Device and MEMS Sensor fabrication
  3. SUSS MicroTec Introduces The iVista LC
    11/11/2008
    SUSS MicroTec Test Systems, the premier supplier of wafer-level test solutions for semiconductor devices, today announced the iVista LC High-Resolution Digital Microscope
  4. Ramtron Announces Faster And Power Flexible 1-Megabit Parallel F-RAM
    11/11/2008
    Ramtron International Corporation, a leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, today launched the first parallel device in a family of new parallel and serial F-RAM products that offer higher-speed read/write performance, lower voltage operation, and optional device features
  5. Peregrine Semiconductor Invents DuNE Technology For Mobile Antenna Tuning
    11/10/2008
    Peregrine Semiconductor Corporation, a leading supplier of high-performance RF CMOS and mixed-signal communications ICs, today announced a breakthrough in the highly sought-after solution to mobile antenna tuning
  6. Aviza Technology Introduces StratIon fxP, The World’s First 300-mm Ready Ion Beam Deposition System
    11/6/2008
    Aviza Technology, Inc., a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, today announced the introduction of StratIon fxP, the world’s first 300-mm ready Ion Beam Deposition system
  7. Qspeed Introduces High-Performance Common Cathode Diode In Industry-Standard TO-220 Package
    11/6/2008
    Qspeed Semiconductor announces the full production release of its first common cathode product in an industry standard TO-220 package. The LQA20T300C, comprised of two 10-amp, 300-volt diodes in a common cathode configuration, is the latest addition to Qspeed’s portfolio of high performance power semiconductors
  8. Tokyo Electron (TEL) Introduces A Dual Purpose 300mm Dicing Frame Prober
    11/4/2008
    Tokyo Electron, Ltd. (TEL) today unveiled the company’s new 300mm Dicing Frame Prober, the WDF 12DP. Designed to address the increasing demand for probing of ultra thin and diced wafers, the system can also be used as a standard wafer prober
  9. Microchip Technology Enhances Mid-Range 8-Bit PIC Microcontroller Core
    11/4/2008
    Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced an enhancement to the microcontroller (MCU) architecture supporting Mid-range 8-bit PIC12 and PIC16 MCUs
  10. Carl Zeiss Receives Prestigious R&D 100 Award For Revolutionary Helium-Ion-Microscope
    11/4/2008
    Carl Zeiss SMT, a leading global provider of electron- and ion-beam imaging and analysis equipment, was honored recently with a prestigious R&D 100 Award for one of the 100 most technologically significant new products in 2008