Business Wire

  1. Innovasic Semiconductor Announces Production Of Pin Compatible 80C186EB And 80C188EB Embedded Processors
    8/14/2008
    Innovasic Semiconductor, a leader in extended life semiconductor solutions, today announced production units are shipping for the IA186EB and IA188EB
  2. Cost-Effective SoC From Freescale Promotes Adoption Of GPON
    8/13/2008
    Freescale Semiconductor, an industry Gigabit Passive Optical Network (GPON) silicon volume leader, has introduced a cost-effective, highly integrated solution designed to help lower costs for carriers and spur adoption of GPON equipment in markets worldwide
  3. Mentor Graphics Eldo Adopted By TSMC For Cell Library Characterization Of 40 Nanometer Technology Node
    8/12/2008
    Mentor Graphics Corporation today announced that Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) has selected Mentor’s Eldo® analog simulation tool to characterize cells in its 40 nanometer (nm) standard cell libraries
  4. Crocus Establishes Prototyping Environment For Next Generation MRAM Technology
    8/12/2008
    Crocus Technologies, a premier developer of Magnetic Random Access Memory (MRAM), today announced that it has qualified its complete manufacturing environment for the development and rapid prototyping of MRAM
  5. Applied Materials Awarded Multi-Year Solar Service Contract From Green Energy Technology
    8/11/2008
    Applied Materials, Inc. announced today that it has signed a five-year service contract with Green Energy Technology Inc. (GET) of Taiwan to support GET’s Applied SunFab™ Thin Film Line for solar module manufacturing
  6. Bel Power Selects Microchip Technology’s MCP6291 Op Amp And 8-Bit PIC Microcontroller For DC-To-DC Power Supply
    8/11/2008
    Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, today announced that Bel Power Inc. has selected its MCP6291 low-power, high-bandwidth operational amplifier (op amp) and PIC12F675 microcontroller (MCU) for its next-generation Power over Ethernet (PoE) half-brick DC-to-DC converter
  7. ON Semiconductor Further Expands Discrete Packaging Portfolio With New Micro-Packaged Transistors And Diodes
    8/7/2008
    ON Semiconductor, a global leader of efficient power semiconductor solutions, has announced the expansion of its discrete packaging portfolio with new micro-packaged transistors and diodes. The new additions broaden the company’s micro-packaged portfolio of transistors and diodes targeted to meet the needs of today’s most demanding space-constrained portable applications
  8. Numonyx And Hynix Extend Efforts To Introduce New, Innovative NAND Flash Memory Products And Technologies
    8/5/2008
    Hynix Semiconductor Inc. and Numonyx B.V. today announced a five-year agreement to expand its joint development programs for the fast-growing NAND flash memory segment
  9. eASIC Delivers 45nm Zero Mask-Charge New ASIC Family
    8/4/2008
    Leveraging the rapid success of its award winning 90nm Nextreme ASIC Products, eASIC Corporation today announced its next generation Nextreme-2 Family – the semiconductor industry’s first 45nm, zero mask-charge New ASIC family
  10. UMC’s Embedded DRAM, URAM Proven In 65nm Customer Silicon
    8/4/2008
    UMC, a leading global semiconductor foundry, today announced that it has produced functional 65nm customer products incorporating URAM, the company’s patented embedded DRAM (eDRAM) technology. URAM enables higher performance, lower power consumption, and reduced chip size compared to traditional embedded 6T SRAM or external DRAM