Latest Headlines

  1. Himax To Present Innovative Solutions For tinyML Opportunities With WiseEye™ AI During CES 2024 12/20/2023

    Himax Technologies, Inc. (Nasdaq: HIMX) (“Himax” or “Company”), a leading supplier and fabless manufacturer of display drivers and other semiconductor products, today announced that during CES 2024 the Company will unveil its new generation WiseEyeTM AI processor, WE2, with a diverse array of new sensor fusion use cases, encompassing image, video and audio.

  2. RIBER Launches MBE 8000 For Mass epiwafer Production 12/19/2023

    Riber, the global leader for molecular beam epitaxy (MBE) equipment serving the semiconductor industry, is pleased to announce the final qualification of its MBE 8000 production platform by leading US epiwafer manufacturer.

  3. ROHM And Toshiba Agree To Collaborate In The Manufacturing Of Power Devices 12/8/2023

    A plan by ROHM Co., Ltd. (“ROHM”) and Toshiba Electronic Devices & Storage Corporation (“Toshiba Electronic Devices & Storage”) to collaborate in the manufacture and increased volume production of power devices has been recognized and will be supported by the Ministry of Economy, Trade and Industry as a measure supporting the Japanese Government’s target of secure and stable semiconductor supply.

  4. NEO Semiconductor Releases Technology CAD (TCAD) Simulation Data For Ground-Breaking 3D X-DRAM 12/6/2023

    NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash and DRAM memory, today announced findings of 3D X-DRAM™ simulations. Semiconductor manufacturers and engineers use TCAD to simulate emerging technologies and optimize new products.

  5. Applied Materials And CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets 12/5/2023

    Applied Materials, Inc. and CEA-Leti today announced an expansion of their longstanding collaboration to focus on developing differentiated materials engineering solutions for several specialty semiconductor applications.

  6. ASM Announces €300M Expansion Of U.S. Operations In Scottsdale, Arizona 12/5/2023

    ASM International N.V. (Euronext Amsterdam: ASM), one of the fastest growing semiconductor equipment companies and global market leader in Atomic Layer Deposition, announced plans for a new North American expansion to accommodate growing demand for research and development in the semiconductor industry.

  7. NXP Introduces The Next Generation Of Automotive Ultra-Wideband ICs Combining Secure Ranging And Short-Range Radar 11/28/2023

    NXP® Semiconductors (NASDAQ: NXPI) today announced the Trimension™ NCJ29D6, a fully integrated automotive single-chip Ultra-Wideband (UWB) family combining next-generation secure and precise real-time localization with short-range radar to address multiple use cases with a single system, including secure car access, child presence detection, intrusion alert, gesture recognition and more. Integrated by major automotive OEMs, devices from this family are expected to be on the road in model year 2025 vehicles.

  8. Renesas Introduces 32-Bit RX MCU With High-Speed, High-Precision Analog Front End For High-End Industrial Sensor Systems 11/22/2023

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its 32-bit microcontroller (MCU) offering with a new RX device for high-end industrial sensor systems.

  9. JST Manufacturing Formally Introduces Ospray Single-Wafer Wet Processing Family 11/14/2023

     JST Manufacturing, Inc., a leading provider of wet benches and chemical processing systems for semiconductor manufacturing, today formally introduced its Ospray family of single-wafer wet processing systems.

  10. Advantest Rolls Out Pin Scale Multilevel Serial – Next-Generation High-Speed ATE Instrument 11/14/2023

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) today announced Pin Scale Multilevel Serial, its newest high-speed I/O (HSIO) instrument.