Latest Headlines

  1. Efabless Empowers 40 Commercial Companies To Design Chips 6/24/2024

    Efabless Corporation, the creator platform for chips, is excited to announce that it has enabled 40 new companies to design chips.

  2. Vishay Intertechnology Releases Second-Generation Automotive Grade IHLE® Inductor With Integrated EMI Shield In 4040 Case Size 6/5/2024

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its IHLE® series of low profile, high current inductors featuring integrated E-field shields with a new second-generation Automotive Grade device in the 10 mm by 10 mm 4040 case size.

  3. EV Group Doubles Throughput Of Innovative Semiconductor Layer Transfer Technology With New EVG®880 LayerRelease™ System 5/28/2024

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®880 LayerRelease™ system, a dedicated high-volume manufacturing (HVM) equipment platform incorporating EVG's innovative infrared (IR) LayerRelease™ technology.

  4. TCS & IIT-Bombay To Build India's First Quantum Diamond Microchip Imager 5/28/2024

    Tata Consultancy Services, a global leader in IT services, consulting, and business solutions, has entered a strategic partnership with the Indian Institute of Technology, Bombay (IIT-Bombay), to develop India’s first Quantum Diamond Microchip Imager.

  5. Weebit Nano And Efabless Collaborate To Enable Easy, Affordable Prototyping Of Innovative SoC Designs 5/24/2024

    Weebit Nano Limited (ASX:WBT), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and Efabless Corporation, the creator platform for chips, announce their collaboration to enable fast and easy prototyping of intelligent devices using Weebit’s technology.

  6. The Dominican Republic And Purdue University Sign MOU To Drive Semiconductor Growth 5/23/2024

    The Ministry of Industry, Commerce, and MSMEs of the Dominican Republic (MICM) announced a significant Memorandum of Understanding (MOU) with Purdue University to propel the country's semiconductor industry and national development.

  7. ROHM Semiconductor And Nanjing SemiDrive Technology Jointly Develop A Reference Design: Utilizing PMICs And SerDes ICs For SoC 5/22/2024

    ROHM Semiconductor and Nanjing SemiDrive Technology Ltd., China’s largest SoC manufacturer for smart cockpits, today announced they have jointly developed a smart cockpit reference design.

  8. Skylo Technologies Certifies Sony's Altair ALT1250 Chipset For Its Satellite Network 5/1/2024

    Skylo Technologies, the pioneer in satellite network connectivity, today announces the certification of Sony Semiconductor Israel's (Sony) ALT1250 chipset as part of the Skylo Certification Program.

  9. Micron, Biden-Harris Administration, U.S. Senate Majority Leader Schumer Announce $6.1B In CHIPS And Science Act Funding For Historic Planned Investment In Domestic Leading-Edge Memory Manufacturing In Idaho And New York 4/25/2024

    Micron Technology, Inc. (Nasdaq: MU), one of the world’s largest semiconductor companies and the only U.S.-based manufacturer of memory, and the Biden-Harris Administration today announced that they have signed a non-binding Preliminary Memorandum of Terms (PMT) for $6.1 billion in funding under the CHIPS and Science Act to support planned leading-edge memory manufacturing in Idaho and New York.

  10. Cadence And TSMC Collaborate On Wide-Ranging Innovations To Transform System And Semiconductor Design 4/24/2024

    Cadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.