Business Wire

  1. Resonac Launches 27-Member "JOINT3" Consortium To Develop Next-Generation Semiconductor Packaging 9/3/2025

    Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc.

  2. CG Semi Unveils One Of India's First End-To-End OSAT Facilities In Sanand, Gujarat 8/28/2025

    CG Semi Private Limited (“CG Semi”), a subsidiary of CG Power and Industrial Solutions Limited (“CG Power”) and part of the Murugappa Group, has announced the launch of its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.

  3. Rigaku Launches Sales Of The XHEMIS TX-3000, A TXRF Analytical System For Leading-Edge Semiconductor Processes 8/26/2025

    Rigaku Corporation, a global solution partner in X-ray analytical systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched sales of the XHEMIS (pronounced “ZEM-mis”) TX-3000, a total reflection X-ray fluorescence (TXRF) system that supports analysis of trace contamination on wafer surfaces in semiconductor manufacturing.

  4. Rocket Lab Announces Expanded U.S. Investments For National Security Programs And Semiconductor Manufacturing 8/22/2025

    Rocket Lab Corporation (“Rocket Lab” or “the Company”), a global leader in launch services and space systems, today announced it is boosting its U.S.

  5. Nordson Electronics Solutions To Exhibit High-Yield Fluid Dispensing Technologies For Panel-Level And Wafer-Level Packaging At SEMICON Taiwan 2025 8/18/2025

    Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.

  6. OKI Develops Tiling Crystal Film Bonding (CFB) Technology For Heterogeneous Integration Of Optical Semiconductors Onto 300 mm Silicon Wafers 8/14/2025

    OKI has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology.

  7. UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance And Enhanced Manageability 8/5/2025

    Universal Chiplet Interconnect Express (UCIe) Consortium, the open standard for interconnects between chiplets within a package, today announced the release of the UCIe 3.0 specification, marking the next stage in the evolution of its open chiplet standard.

  8. Rigaku Launches XTRAIA XD-3300 Mass Production For Semiconductor Market 7/29/2025

    Rigaku Corporation, a global solution partner in X-ray metrology systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), has launched full-fledged commercial production of XTRAIA XD-3300, a high-resolution microspot X-ray diffraction system.

  9. SkyWater Technology Expands Leadership In U.S. Semiconductor Manufacturing With Infineon IP License Agreement 7/29/2025

    SkyWater Technology, the trusted technology realization partner, today announced a license agreement with Infineon Technologies, granting access to a robust library of silicon-proven, mixed-signal ASIC design IP.

  10. Teledyne HiRel Semiconductors Announces High-Density 16 GByte DDR4 Module 7/24/2025

    Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C.