Business Wire

1. Fujifilm To Showcase 'One-Stop Solutions' Approach At SEMICON West 2025 10/2/2025

   FUJIFILM Corporation today announced that its U.S.-based subsidiary for semiconductor materials, FUJIFILM Electronic Materials U.S.A., Inc. (Fujifilm), will participate in “SEMICON West 2025”, an international exhibition of semiconductor manufacturing equipment and materials, to be held in Phoenix, Arizona, from October 7-9, 2025, where it will highlight its broad portfolio of advanced high-purity chemicals & semiconductor materials.

2. Kioxia And Sandisk Announce Start Of Fab2 Operations At Kitakami, Japan, To Meet AI-Driven Market Demand 10/1/2025

   Kioxia Corporation , a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A), and Sandisk Corporation today announced the start of operations at Fab2 (K2), a state-of-the-art semiconductor manufacturing facility, at the company's Kitakami facility in Iwate Prefecture, Japan.

3. L&T Technology Services Wins $100M Multi-Year Contract From US Industrial Equipment Maker 10/1/2025

   L&T Technology Services Limited , a global leader in AI, digital and ER&D consulting services, today announced a significant milestone in its Sustainability segment with the signing of a $100M multi-year agreement with a US-based industrial equipment manufacturer for the semiconductor value chain.

4. Alphawave Semi Delivers Cutting-Edge UCIe Chiplet IP On TSMC 3DFabric Platform 10/1/2025

   Alphawave Semi , a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, has announced the successful tape-out of its cutting edge UCIe 3D IP on the advanced TSMC SoIC (SoIC-X) technology in the 3DFabric platform.

5. Resonac Launches 27-Member "JOINT3" Consortium To Develop Next-Generation Semiconductor Packaging 9/3/2025

   Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc.

6. CG Semi Unveils One Of India's First End-To-End OSAT Facilities In Sanand, Gujarat 8/28/2025

   CG Semi Private Limited (“CG Semi”), a subsidiary of CG Power and Industrial Solutions Limited (“CG Power”) and part of the Murugappa Group, has announced the launch of its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.

7. Rigaku Launches Sales Of The XHEMIS TX-3000, A TXRF Analytical System For Leading-Edge Semiconductor Processes 8/26/2025

   Rigaku Corporation, a global solution partner in X-ray analytical systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched sales of the XHEMIS (pronounced “ZEM-mis”) TX-3000, a total reflection X-ray fluorescence (TXRF) system that supports analysis of trace contamination on wafer surfaces in semiconductor manufacturing.

8. Rocket Lab Announces Expanded U.S. Investments For National Security Programs And Semiconductor Manufacturing 8/22/2025

   Rocket Lab Corporation (“Rocket Lab” or “the Company”), a global leader in launch services and space systems, today announced it is boosting its U.S.

9. Nordson Electronics Solutions To Exhibit High-Yield Fluid Dispensing Technologies For Panel-Level And Wafer-Level Packaging At SEMICON Taiwan 2025 8/18/2025

   Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON Taiwan 2025, September 10-12, booth i2326.

10. OKI Develops Tiling Crystal Film Bonding (CFB) Technology For Heterogeneous Integration Of Optical Semiconductors Onto 300 mm Silicon Wafers 8/14/2025

    OKI has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology.