Business Wire

1. UCIe Consortium Introduces 3.0 Specification With 64 GT/s Performance And Enhanced Manageability 8/5/2025

   Universal Chiplet Interconnect Express (UCIe) Consortium, the open standard for interconnects between chiplets within a package, today announced the release of the UCIe 3.0 specification, marking the next stage in the evolution of its open chiplet standard.

2. Rigaku Launches XTRAIA XD-3300 Mass Production For Semiconductor Market 7/29/2025

   Rigaku Corporation, a global solution partner in X-ray metrology systems and a Group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”), has launched full-fledged commercial production of XTRAIA XD-3300, a high-resolution microspot X-ray diffraction system.

3. SkyWater Technology Expands Leadership In U.S. Semiconductor Manufacturing With Infineon IP License Agreement 7/29/2025

   SkyWater Technology, the trusted technology realization partner, today announced a license agreement with Infineon Technologies, granting access to a robust library of silicon-proven, mixed-signal ASIC design IP.

4. Teledyne HiRel Semiconductors Announces High-Density 16 GByte DDR4 Module 7/24/2025

   Teledyne HiRel Semiconductors, a leader in ruggedized semiconductors for mission-critical environments, today announced the release of the TDD416Y12NEPBM01, a compact DDR4 memory module, screened and qualified as an Enhanced Product (EP) and rated for operation from –40°C to +105°C.

5. Incize And Atomera Announce Strategic Collaboration To Advance GaN-On-Si Technology For Next-Gen RF And Power Devices 7/9/2025

   Incize, a Belgian cutting-edge semiconductor characterization and modeling company, and Atomera, a pioneer in advanced semiconductor materials, today announced a strategic collaboration to enhance Gallium Nitride on Silicon (GaN-on-Si) technologies.

6. Materion Completes Acquisition To Expand Semiconductor Footprint And Capabilities In Asia 7/9/2025

   Materion reported today that it has completed its previously announced acquisition of manufacturing assets for tantalum solutions in Dangjin City, South Korea, serving the semiconductor market.

7. Accenture Acquires SYSTEMA To Drive Manufacturing Automation For Semiconductor Clients 7/1/2025

   Accenture has acquired SYSTEMA, a provider of software solutions and consulting services for manufacturing automation, headquartered in Dresden, Germany. SYSTEMA’s long-standing experience in working for semiconductor manufacturers and other high tech companies will bolster Accenture’s capabilities to comprehensively support clients in these industries.

8. Agileo Automation Announces Future Expansion Of A2ECF-SEMI Automation Framework With SEMI EDA Standards 6/17/2025

   CEA LID World Summit – Agileo Automation, a leading provider of control and connectivity solutions for global semiconductor manufacturing equipment, today announced the future expansion of its A2ECF-SEMI automation framework to include SEMI’s EDA (Equipment Data Acquisition) standards suite.

9. OpenGMSL Association Announces Formation To Revolutionize The Future Of In-Vehicle Connectivity 6/5/2025

   A leading automotive original equipment manufacturer (OEM), Tier 1 suppliers, semiconductor manufacturers and ecosystem partners today announced the formation of the OpenGMSL Association, an initiative bringing together industry leaders to transform SerDes transmission of video and/or high-speed data as an open, worldwide standard across the automotive ecosystem.

10. GCT Semiconductor And Iridium Sign MOU To Collaborate On Integrating Iridium NTN Direct Service Into GCT Chipset 6/4/2025

    GCT Semiconductor Holding Inc, a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced its collaboration with Iridium Communications Inc.