Business Wire
-
United Semiconductors Reserves Payload Space With Starlab To Advance Commercial-Scale In-Space Semiconductor Manufacturing
3/3/2026
Starlab Space LLC, the commercial space station developer expanding access to low Earth orbit research, today announced a payload reservation agreement with United Semiconductors LLC (USLLC) to support the transition of its space-based semiconductor crystal growth technology from demonstration aboard the International Space Station (ISS) to sustained commercial-scale production in low Earth orbit.
-
Credo Acquires CoMira Solutions
3/2/2026
Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that it has acquired high-speed connectivity IP innovator CoMira Solutions.
-
StratEdge Powers Up For 2026: Showcasing Molded Ceramic Packages At IMAPS Device Packaging And GOMACTech
2/27/2026
StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high reliability packages, will highlight its molded ceramic and gold plated tab products lines at two March exhibitions.
-
MP Materials Selects Northlake, Texas, As The Site Of '10X,' A New U.S. Rare Earth Magnet Manufacturing Campus
2/26/2026
MP Materials Corp.today announced it has selected a 120‑acre site in Northlake, Texas, to develop “10X,” the company’s planned large-scale rare earth magnet manufacturing campus.
-
THine Announces Its Optical DSP-Free Chipset, Best Suited For 'Slow And Wide' Interconnection In Scale-Up AI Networks Of The Next Generation
2/1/2026
THine Electronics, Inc. a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, today announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW technology for short-reach optical interconnect of PCI Express7(PCIe7) 2TB/s linear pluggable optics(LPO) or co-packaged optics(CPO), enabling to save power by 73% and lower latency by 90%.
-
2.5Gbps MIPI D-PHY Redriver From Diodes Incorporated Optimizes Signal Integrity For Automotive Camera Monitoring Systems And ADAS
1/29/2026
Diodes Incorporated (Diodes) today announces the release of the automotive-compliant* PI2MEQX2505Q
-
Credo Introduces Industry's First 224G Multiprotocol AI Scale-Up Retimer Supporting UALink, ESUN And Ethernet
1/29/2026
Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced its Blue Heron 224G AI scale-up retimer, optimized to support the growing need for extended cable and PCB backplane links using UALink, ESUN, and Ethernet protocols.
-
Alpha And Omega Semiconductor Unveils Its Powerful αMOS E2 600V Super Junction MOSFET Platform
1/27/2026
Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today unveiled its powerful αMOS E2 600V Super Junction MOSFET platform.
-
MACOM's 500W GaN-On-Si Power Transistor For L-Band ASR Applications
10/10/2017
MACOM Technology Solutions Inc. (“MACOM”) recently announced the newest entry in its GaN-on-Si power transistor portfolio for pulsed L-Band radar systems targeted for airport surveillance radar (ASR) applications at 1.2 to 1.4 GHz.
-
New Solar Company Silevo Launches With Industry's Best Performance-To-Cost Ratio Modules
10/13/2011
Silevo, Inc., a solar cell innovator and photovoltaic solar module manufacturer, today emerged from stealth mode to announce the industry's best performance-to-cost ratio for solar modules by evolving the use of silicon with new groundbreaking technology