Business Wire
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Polar Signs Agreement With Renesas To License GaN-on-Si Technology And Onshore Commercial Fabrication Of Advanced Devices On 200mm Wafers
4/16/2025
Polar Semiconductor (“Polar”), the only U.S.-owned merchant foundry specializing in sensor, power, and high-voltage semiconductors, announced today the finalization of a strategic agreement with Renesas Electronics Corporation (“Renesas”) to license their Gallium Nitride on Silicon D-Mode (GaN-on-Si) technology.
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Spirit Electronics Expands U.S. Semiconductor Capacity With Acquisition Of SMART Microsystems
4/16/2025
As part of its strategic commitment to strengthening domestic semiconductor manufacturing, Spirit Electronics has acquired SMART Microsystems, located at Lorain County Community College (LCCC) in Ohio.
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MACOM's 500W GaN-On-Si Power Transistor For L-Band ASR Applications
10/10/2017
MACOM Technology Solutions Inc. (“MACOM”) recently announced the newest entry in its GaN-on-Si power transistor portfolio for pulsed L-Band radar systems targeted for airport surveillance radar (ASR) applications at 1.2 to 1.4 GHz.
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New Solar Company Silevo Launches With Industry's Best Performance-To-Cost Ratio Modules
10/13/2011
Silevo, Inc., a solar cell innovator and photovoltaic solar module manufacturer, today emerged from stealth mode to announce the industry's best performance-to-cost ratio for solar modules by evolving the use of silicon with new groundbreaking technology
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TriQuint Unveils PowerBand: Revolutionary High Power, Wideband RF Transistors
11/17/2008
TriQuint Semiconductor, a leading RF product manufacturer and foundry services provider, today announced the availability of a revolutionary new high power discrete RF transistor family for broadband applications including radar, signal jammers and wireless communications
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Singapore's Institute Of Microelectronics And Chartered Develop Advanced Fine-Pitch Packaging Solutions At 65nm
11/17/2008
A*STAR’s Institute of Microelectronics (IME), Singapore and Chartered Semiconductor Manufacturing, one of the world’s top dedicated semiconductor foundries, have successfully optimized a range of fine-pitch packaging technologies for copper metallization and low-k dielectric silicon processes at 65 nanometer (nm) and below
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Hodogaya Promotes Its Transport Materials For The Novaled PIN OLED Structures
11/13/2008
Hodogaya Chemical Co., LTD, long experienced specialist and market leader in charge transport materials, and Novaled AG, leader in power efficient and long living Organic Light Emitting Diodes (OLEDs) have agreed to offer hole transport materials for Novaled PIN OLED structures
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Tegal Receives Order For Deep Silicon Etch Cluster Tool For Power Management And MEMS Sensor Applications
11/13/2008
Tegal Corporation, a leading designer and manufacturer of plasma etch and deposition systems used in the production of integrated circuits, MEMS, and nanotechnology devices, announced today that the Company received an order for a Tegal 4200SE Advanced Multichamber ICP plasma etching system for Deep Reactive Ion Etching applications in Power Device and MEMS Sensor fabrication
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SUSS MicroTec Introduces The iVista LC
11/11/2008
SUSS MicroTec Test Systems, the premier supplier of wafer-level test solutions for semiconductor devices, today announced the iVista LC High-Resolution Digital Microscope
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Ramtron Announces Faster And Power Flexible 1-Megabit Parallel F-RAM
11/11/2008
Ramtron International Corporation, a leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, today launched the first parallel device in a family of new parallel and serial F-RAM products that offer higher-speed read/write performance, lower voltage operation, and optional device features