Business Wire
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Teledyne e2v HiRel Releases Catalog Radiation Tolerant S-Band (2 GHz to 5 GHz) Ultra-Low Noise Amplifier For Space Applications
3/6/2024
Teledyne e2v HiRel announces the availability of a rad-tolerant S-Band low noise amplifier, model TDLNA2050SEP that is ideal for use in demanding high reliability, space and radar applications where low noise figure, minimal power consumption and small package footprint are critical to mission success.
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CG Power And Industrial Solutions Limited, Renesas, And Stars Microelectronics, To Jointly Build Outsourced Semiconductor Assembly And Test Facility In India
2/29/2024
CG Power and Industrial Solutions Limited (“CG”), a part of Tube Investments of India Limited and the Murugappa Group; Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions; and Stars Microelectronics (Thailand) Public Co. Ltd (“Stars Microelectronics”), a Thailand-based Outsourced Semiconductor Assembly and Test (OSAT) provider; had recently signed a Joint Venture Agreement (JVA) to establish a Joint Venture (JV) to build and operate an OSAT facility in India.
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Edgewater Wireless Selected To Join The Alliance Of Semiconductor Innovation Canada (ASIC)
2/29/2024
Edgewater Wireless Systems Inc., the industry leader in Wi-Fi Spectrum Slicing technology for residential and enterprise markets, is pleased to announce that it has joined the Alliance of Semiconductor Innovation Canada (‘ASIC’), an organization dedicated to promoting the Canadian semiconductor ecosystem.
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Renesas Unveils Powerful Single-Chip RZ/V2H MPU For Next-Gen Robotics With Vision AI And Real-Time Control
2/29/2024
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, has expanded its popular RZ Family of microprocessors (MPUs) with a new device targeting high-performance robotics applications.
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VeriSilicon NPU IP Is Shipped In Over 100 Million AI-Enabled Chips Worldwide
2/28/2024
VeriSilicon today announced that it has reached a milestone achievement with its Neural Network Processor (NPU) IP integrated into over 100 million AI-enabled chips across 10 major application sectors worldwide, including Internet of Things (IoT), wearables, smart TVs, smart home, security monitoring, servers, automotive electronics, smartphones, tablets, and smart healthcare.
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Alpha And Omega Semiconductor Announces Application-Specific EZBuck Regulator To Power Intel Meteor Lake And Arrow Lake Platforms
2/22/2024
Alpha and Omega Semiconductor Limited (AOS), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today introduced its new application-specific EZBuck regulator.
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Redwire Space Announces Strategic Expansion Of Its In-Space Manufacturing Technology Portfolio To Tap Into Global Semiconductor Market
1/29/2024
Redwire Corporation, a leader in space infrastructure for the next generation space economy, announced today the strategic expansion of its in-space manufacturing technology portfolio with the first pathfinder mission for its autonomous semiconductor manufacturing platform, MSTIC. MSTIC will launch to the International Space Station (ISS) onboard Northrup Grumman’s 20th cargo resupply services mission (NG-20).
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Nanotronics To Present On Next Gen Semiconductor Material At Photonics West
1/25/2024
Nanotronics, the Industrial AI company, will exhibit their updated suite of AI-powered factory control tools at the annual SPIE Photonics West, the world’s premier event for lasers, biomedical optics and biophotonic technologies, quantum, and optoelectronics. The conference takes place from January 30th - February 1st.
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KYOCERA SLD Laser Demonstrates High-Speed Underwater Wireless Optical Communication And Custom GaN Laser Capabilities
1/25/2024
KYOCERA SLD Laser, Inc. (KSLD), a world leader in commercialization of laser light sources, has announced the demonstration of a high-speed, bidirectional link for Underwater Wireless Optical Communication (UWOC) and custom-chip gallium nitride (GaN) laser capabilities.
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Keysight Introduces Chiplet PHY Designer For Simulating D2D To D2D PHY IP Supporting The UCIe Standard
1/24/2024
Keysight Technologies, Inc. introduces Chiplet PHY Designer, the latest member in its family of high speed digital design and simulation tools that provides die-to-die (D2D) interconnect simulation, which is a key step in verifying performance for heterogeneous and 3D integrated circuit (IC) designs commonly referred to as chiplets.