Business Wire

  1. Cypress Strengthens Internet Of Things Leadership With Cirrent Software Offering

    Cypress Semiconductor Corp. (NASDAQ: CY), the embedded solutions leader, today announced that it has expanded its portfolio of Internet of Things (IoT) solutions with the addition of Cirrent, a leading provider of software and cloud services for consumer Wi-Fi® products. IoT companies use Cirrent’s software and cloud services to make their products easier to use, more reliable, and more secure. This press release features multimedia. View the full release here: “Cirrent helps users

  2. Bank Islam Brunei Darussalam Chooses Rambus To Secure Mobile Payments

    Rambus Inc. a leader in digital security, semiconductor and IP products and services, recently announced that Bank Islam Brunei Darussalam (BIBD), the largest bank in Brunei, has selected the Rambus Token Service Provider (TSP) as part of its mobile payment strategy to enable secure transactions to its customers

  3. Skyworks Unveils Connectivity Solutions For Emerging Automotive Platforms

    Skyworks Solutions, Inc., an innovator of high performance analog semiconductors connecting people, places and things, recently introduced its suite of next generation SkyOne Ultra 3.0 devices specifically designed for advanced automotive applications

  4. Spectra7 Achieves Low Latency Error Free Performance With Mellanox ConnectX-5 Network Adapters

    Spectra7 Microsystems Inc., a leading provider of high-performance analog semiconductor products for broadband connectivity markets, announced that it has achieved robust error free performance with Mellanox ConnectX-5 network adapters configured for Ethernet low latency CA-N transmission

  5. AgigA Tech Awarded Patent For Adaptive Management Of Supercapacitors

    AgigA Tech, Inc., a leading provider of high-speed, high-density, battery-free non-volatile memory solutions and a subsidiary of Cypress Semiconductor Corp., recently announced the issuance of United States Patent No. 10,134,451 relating to the adaptive training and adjustment to changing capacitor values based upon age and usage behavior

  6. Astronics AeroSat Certifies Its FliteStream T-310 High-Speed SATCOM Connectivity Solution For Business Aviation

    Astronics Corporation, a leading provider of advanced technologies for the global aerospace, defense and semiconductor industries, announced that its wholly owned subsidiary, Astronics AeroSat Corporation, has certified its next generation FliteStream T-310 SATCOM connectivity solution for business aircraft

  7. Mitsubishi Electric And The University Of Tokyo Reveal New Mechanism For Enhancing Reliability Of SiC Power Semiconductor Devices

    Mitsubishi Electric Corporation and the University of Tokyo announced recently what they believe to be an all-new mechanism for enhancing the reliability of silicon carbide (SiC) power semiconductor devices in power electronics systems

  8. Toshiba Adds New 4TB CANVIO Portable Hard Drive Model For Safe And Reliable Personal Data Storage

    Toshiba America Electronic Components Inc. recently announces a new addition to its popular family of CANVIO external hard drives (HDDs), a 4TB[1] option in its ADVANCE, BASICS and READY series

  9. Broadcom Inc. And HCL Technologies Announce A Global Preferred Services Partnership

    Broadcom Inc. (NASDAQ: AVGO), a global technology leader that designs, develops and supplies semiconductor and infrastructure software solutions, and HCL Technologies (HCL), a leading global technology company, today announced a global preferred services partnership agreement. Effective immediately, HCL becomes the preferred services partner for Broadcom’s enterprise software products (part of former CA Technologies) and will provide professional services, education and training services. Broadcom customers will have access to HCL’s technological expertise across consulting, implementation,

  10. TU Wien And Silvaco Collaborate On New MRAM Device Technology Development

    Silvaco, Inc. today announced the opening of a second Christian Doppler Laboratory (CDL) in partnership with the Institute for Microelectronics, TU Wien. The new CDL, officially opened November 12th will develop new device simulation solutions for MRAM, a novel non-volatile memory technology. "The fact that memory components are constantly becoming smaller and smaller is driven by the constant need for devices with lower power and higher capacity," said Dr. Siegfried Selberherr, Professor at the