Business Wire

  1. Faraday Broadens IP Offerings On UMC's 14nm Process For Edge AI And Consumer Markets 3/3/2026

    Faraday Technology Corporation a leading ASIC design and IP provider, today announced the continued expansion of its IP product lines on UMC’s 14nm FinFET Compact (14FCC) platform, covering USB 2.0/USB 3.2 Gen1 PHY, LVDS TX/RX I/O, DDR 3/4 combo PHY (up to 4.2 Gbps), and LPDDR 4/4X/5 PHY (up to 6.4 Gbps).

  2. United Semiconductors Reserves Payload Space With Starlab To Advance Commercial-Scale In-Space Semiconductor Manufacturing 3/3/2026

    Starlab Space LLC, the commercial space station developer expanding access to low Earth orbit research, today announced a payload reservation agreement with United Semiconductors LLC (USLLC) to support the transition of its space-based semiconductor crystal growth technology from demonstration aboard the International Space Station (ISS) to sustained commercial-scale production in low Earth orbit.

  3. Credo Acquires CoMira Solutions 3/2/2026

    Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced that it has acquired high-speed connectivity IP innovator CoMira Solutions.

  4. StratEdge Powers Up For 2026: Showcasing Molded Ceramic Packages At IMAPS Device Packaging And GOMACTech 2/27/2026

    StratEdge Corporation, a leader in the design, production, and assembly of high-frequency, high-power, and high reliability packages, will highlight its molded ceramic and gold plated tab products lines at two March exhibitions.

  5. MP Materials Selects Northlake, Texas, As The Site Of '10X,' A New U.S. Rare Earth Magnet Manufacturing Campus 2/26/2026

    MP Materials Corp.today announced it has selected a 120‑acre site in Northlake, Texas, to develop “10X,” the company’s planned large-scale rare earth magnet manufacturing campus.

  6. THine Announces Its Optical DSP-Free Chipset, Best Suited For 'Slow And Wide' Interconnection In Scale-Up AI Networks Of The Next Generation 2/1/2026

    THine Electronics, Inc. a global leading fabless semiconductor supplier of innovative mixed signal LSI and analog technologies as well as valuable AI/IoT-based solutions and AI/data servers, today announced its optical DSP(digital signal processor)-free chipset with its ZERO EYE SKEW technology for short-reach optical interconnect of PCI Express7(PCIe7) 2TB/s linear pluggable optics(LPO) or co-packaged optics(CPO), enabling to save power by 73% and lower latency by 90%.

  7. 2.5Gbps MIPI D-PHY Redriver From Diodes Incorporated Optimizes Signal Integrity For Automotive Camera Monitoring Systems And ADAS 1/29/2026

    Diodes Incorporated (Diodes) today announces the release of the automotive-compliant* PI2MEQX2505Q

  8. Credo Introduces Industry's First 224G Multiprotocol AI Scale-Up Retimer Supporting UALink, ESUN And Ethernet 1/29/2026

    Credo Technology Group Holding Ltd (Credo), an innovator in providing connectivity at scale through fast, reliable, and energy-efficient system solutions, today announced its Blue Heron 224G AI scale-up retimer, optimized to support the growing need for extended cable and PCB backplane links using UALink, ESUN, and Ethernet protocols.

  9. Alpha And Omega Semiconductor Unveils Its Powerful αMOS E2 600V Super Junction MOSFET Platform 1/27/2026

    Alpha and Omega Semiconductor Limited (AOS) a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today unveiled its powerful αMOS E2 600V Super Junction MOSFET platform.

  10. GCT Semiconductor Launches Commercial Shipments Of 5G Chipset 1/6/2026

    GCT Semiconductor Holding Inc. (“GCT” or the "Company") a leading designer and supplier of advanced 5G and 4G semiconductor solutions, today announced the first commercial shipments of its 5G chipset to GCT’s lead customers.