Supplier News
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Miniature Stepper Motors With Lead Screws As Fine As 4 Microns Per Half Step
5/4/2005
MicroMo Electronics, Inc. announces the addition of lead screw output shafts to complement the ARSAPE ® line of miniature two-phase stepper motors for precise linear actuation...
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$99 Devkit Supports All Goal Semiconductor Mixed-Signal And MCU Products Plus Industry-Standard 8051s And Ships With C Compiler
3/28/2005
Goal Semiconductor today introduced the UniVersaKit (UVK), a new development kit and evaluation system that supports all Goal VERSA product families as well as most industry-standard 8051 microcontrollers and ships complete with IDE (Integrated Development Environment), C compiler and assembler.
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ASE Standardizes On Ansoft Solution For IC Packaging
11/3/2004
Taiwanese IC packaging leader Advanced Semiconductor Engineering (ASE) Inc. (NYSE: ACX) today announced its commitment to Ansoft's (NASDAQ: ANST) HFSS(tm), Q3D Extractor(tm) and AnsoftLinks(tm) simulation products for IC packaging design and model extraction. ASE's standardization on Ansoft extends their existing investment and commitment to Ansoft solutions
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SUSS Photolithography Solution Selected for Expanding Volume Manufacturing of LEDs
10/28/2004
Osram Opto Semiconductors continues to rely on photolithography solutions from SUSS MicroTec AG (FWB: SMH) for its high volume light emitting diode (LED) production. In 2004 Osram Opto Semiconductors has placed an additional follow-on order for SUSS LithoFab200 Production Lithography Cluster. The cluster is used for the manufacturing of nitride and arsenide/phosphide based LEDs
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U-Chip Partners With Ansoft For High-Performance, Low-Power IC Design
10/26/2004
Taiwanese semiconductor memory specialist U-Chip and Ansoft Corporation (NASDAQ: ANST) jointly announce their partnership for integrated circuit (IC) design and simulation. The power of Ansoft's Nexxim circuit simulator is essential for U-chip to predict transient behavior and power consumption of their embedded read only memory (ROM) IC designs
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DuPont, Samsung Announce Joint Venture Agreement For Flexible Circuit Materials
9/29/2004
DuPont Electronic Technologies and Cheil Industries, Inc., part of the Samsung Group, have signed a 50/50 joint venture agreement, pending local and government approvals, to establish SD Flex Company, LLC...
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How to Benefit form the Vaisala SAW Hygrometer DM500
3/3/2004
Good planning is essential for achieving high performance measurement results with any metrology tool. Successful application of the Vaisala DM500 Precision SAW Hygrometer is best achieved with a three step planning approach...
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Safe Measurements in Hazardous Areas
3/3/2004
The Vaisala HMT360 Series Industrial Humidity and Temperature Transmitter was launched in 1999 with the European EEx approval for use in hazardous areas...
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Prudential Cleanroom Services' Receives ISO 9001: 2000 Certification
2/17/2004
Prudential Cleanroom Services, a world leader in cleanroom laundry service systems, today announced that it has completed ISO 9001: 2000 certification...
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Chartered, Nordic VLSI Offer Suite of High-Performance Mixed-Signal IP
2/9/2004
Nordic VLSI joins Chartered Express-VCX IP program
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