Current Headlines
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DENSO Develops Its First Inverter Using SiC Power Semiconductors
3/31/2023
DENSO CORPORATION, a leading mobility supplier, announced it has developed its first-ever inverter with silicon carbide (SiC) semiconductors.
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Georgia Tech And GlobalFoundries To Collaborate On Joint Semiconductor Research And Workforce Development
3/31/2023
Georgia Institute of Technology, one of the top public research universities in the U.S., and GlobalFoundries (Nasdaq: GFS) (GF), one of the world’s leading semiconductor manufacturers, today announced a new partnership to expand collaboration on semiconductor research, education, talent, and workforce development.
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Vishay Intertechnology Enhances Anti-Surge Thick Film Power Resistor In 0805 Case Size With Higher 0.5 W Power Rating
3/29/2023
Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has enhanced the Vishay Draloric RCS0805 e3 anti-surge thick film resistor in the 0805 case size with a higher power rating of 0.5 W.
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New Tech Could Enable More Efficient Fibre-Optical Telecommunications
3/29/2023
The unique development could pave the way for the creation of technologies predicated on micro-manufacturing, such as more efficient fibre-optical telecommunications, data centres, micro-3D cameras and even future quantum computers.
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Adeia Signs Long-Term Semiconductor Patent License Agreement With Western Digital
3/28/2023
Adeia Inc. (Nasdaq: ADEA) ("Adeia" or the "Company"), the company whose patented innovations enhance billions of devices, today announced that Western Digital (Nasdaq: WDC), a global leader in data storage solutions, entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.
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Aehr Receives Volume Production Order For WaferPak Full Wafer Contactors From Major Silicon Carbide Semiconductor Customer For Test And Burn-In Of Silicon Carbide Semiconductor Wafers
3/21/2023
Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and reliability qualification equipment, today announced it has received an order from its second major silicon carbide semiconductor customer for production quantities of WaferPak™ full wafer Contactors to be used with previously ordered FOX-XP™ systems for test and burn-in of silicon carbide semiconductor wafers in their production facility.
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NVIDIA, ASML, TSMC And Synopsys Set Foundation For Next-Generation Chip Manufacturing
3/21/2023
GTC-NVIDIA today announced a breakthrough that brings accelerated computing to the field of computational lithography, enabling semiconductor leaders like ASML, TSMC and Synopsys to accelerate the design and manufacturing of next-generation chips, just as current production processes are nearing the limits of what physics makes possible.
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ROHM Establishes Ultra-High-Speed Control IC Technology That Maximizes The Performance Of GaN Devices
3/21/2023
ROHM Semiconductor today introduced ultra-high-speed control IC technology that maximizes the performance of GaN and other high-speed switching devices.
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Navitas Takes GaN Integration To Next Level With GaNSense™ Control
3/20/2023
Navitas Semiconductor (Nasdaq: NVTS), the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride (GaN) power ICs and silicon carbide (SiC) technology, has launched a new family of GaNSense Control ICs that deliver unprecedented levels of performance and integration.
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STMicroelectronics Earns USB-IF Certification For Complete USB PD EPR Solution; Efficiently Delivers Up To 140W From A Single Adapter
2/28/2023
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has achieved USB-IF (USB Implementers Forum) certification of two ICs for use in adapter (source) and device (sink) sides of a USB Power Delivery (USB PD) EPR1 power supply/charger product.