Current Headlines

81. WISekey Joins Global Semiconductor Alliance IoT Security Working Group To Address End-To-End IoT Security
    1/14/2019

    WISeKey International Holding Ltd (WIHN.SW) ("WISeKey"), a leading Swiss based cybersecurity and IoT company, today announced that it has joined the Global Semiconductor Alliance ("GSA") IoT Security Working Group ("SWG) to address end-to-end IoT security

82. First Battery-Free Bluetooth® Sticker Sensor Tag Demonstrated At NRF
    1/14/2019

    Wiliot, the semiconductor pioneer and innovator, raises a $30 million series B for a total of $50 million in funding

83. Building Massive IoT - Wirepas And Nordic Semiconductor Create The World's Densest IoT Sensor Network
    12/5/2018

    Power efficiency, scalability, reliability and ease of use are some of the most obvious requirements for wireless IoT networks, but as more and more devices are being connected also the requirements for density and interference tolerance are becoming more and more important for end customers

84. Advantest To Exhibit Wide Range Of Semiconductor Test Solutions Enabling 5G Connectivity At SEMICON Japan On December 12-14
    12/4/2018

    Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) will feature more than a dozen of its advanced test solutions that enable 5G connectivity for such diverse applications as mobile electronics, medical devices, automotive systems, retail business and big data at SEMICON Japan 2018 on December 12-14 at Tokyo Big Sight

85. Microtronic Announces New Informational Tech Bulletin Series On Optimizing Semiconductor Macro Defect Wafer Inspection
    12/4/2018

    Microtronic, Inc., the well-known maker of high-speed full-wafer semiconductor macro defect inspection systems, wants to shed new light on a topic that is frequently misunderstood in the industry: macro vs. micro inspection

86. EV Group Unveils Next-Generation Fusion Wafer Bonder For ‘More Moore’ Scaling And Front-End Processing
    12/3/2018

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the all new BONDSCALE™ automated production fusion bonding system

87. QuantumClean® & ChemTrace® Show How To Reduce Wafer Fab CoO At SEMICON Europa 2018
    11/1/2018

    QuantumClean & ChemTrace will demonstrate how its ultra-high purity chamber tool part cleaning, proprietary coatings and microcontamination analytical testing can help reduce wafer fabrication Cost-of-Ownership (CoO)

88. Pulsed RF Power Semiconductor Device Markets Will Exceed US$275M By 2023
    10/30/2018

    ABI Research forecasts markets for pulsed RF power devices up to 4 GHz will show continued solid growth over the next five years and exceed US$275M by 2023.

89. pSemi Announces Frequency Extension And Volume Production Of Its 55 GHz DSA
    10/30/2018

    Semi Corporation (formerly Peregrine Semiconductor), a Murata company focused on semiconductor integration, announces volume production of the PE43508 digital step attenuator (DSA).

90. SemiGen Acquires Thin Film Circuit Manufacturer Ion Beam Milling
    10/9/2018

    SemiGen, Inc., an ISO and ITAR registered provider of RF and microwave contract assembly, automated PCB assembly (PCBA), foundry services, semiconductor devices, and RF supplies, announces the acquisition of Ion Beam Milling (www.ionbeammilling.com) of Manchester, New Hampshire.