Current Headlines

  1. ROHM's 4th Generation SiC MOSFET Bare Chips Adopted In Three EV Models Of ZEEKR From Geely 8/29/2024

    ROHM Semiconductor today announced the adoption of power modules equipped with 4th generation SiC MOSFET bare chips for the traction inverters in three models of ZEEKR EV brand from Zhejiang Geely Holding Group (Geely), a top 10 global automaker.

  2. Finwave Semiconductor And GlobalFoundries Partner On RF GaN-on-Si Technology For Cellular Handset Applications 8/29/2024

    Finwave Semiconductor, Inc., a leading innovator in GaN (Gallium Nitride) technology, today announced a strategic technology development and licensing agreement with GlobalFoundries (GF), the world’s leading specialty foundry with a rich history of RF leadership.

  3. Nearfield Instruments Secures Purchase Order For Its QUADRA Metrology System From Leading Semiconductor Manufacturing Fab In Asia 7/30/2024

    Nearfield Instruments, provider of metrology and process control equipment for advanced semiconductor fabrication plants, today announced the receipt of a purchase order for its QUADRA® metrology systems from a major semiconductor manufacturing fab in Asia.

  4. Weebit Nano And DB HiTek Tape-Out ReRAM Module In DB HiTek's 130nm BCD process 7/30/2024

    Weebit Nano Limited (Weebit), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and tier-1 semiconductor foundry DB HiTek have taped-out (released to manufacturing) a demonstration chip integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM or RRAM) module in DB HiTek’s 130nm Bipolar-CMOS-DMOS (BCD) process.

  5. Boston Semi Equipment Launches New Test Site Module For Zeus Test Handler To Support Power IC Manufacturers 7/24/2024

    Boston Semi Equipment (BSE), a global leader in advanced automation solutions for the semiconductor and consumer electronics industries, today introduced a new test site module for its Zeus gravity feed test handler to support high-voltage and partial discharge (HVPD) applications in power electronics manufacturing.

  6. Rice Researchers Advancing Microelectronics Manufacturing On DARPA-Funded Team 7/22/2024

    A large collaborative team led by the University of Texas at Austin with Rice University as a key partner was awarded $840M to develop the next generation of high-performing semiconductor microsystems for the U.S. Department of Defense.

  7. Forge Nano Expands Semiconductor Business; Unveils New 200mm Wafer Atomic Layer Deposition Cluster Tool Ahead of SEMICON West 7/1/2024

    Forge Nano, Inc., a leading ALD equipment provider and materials science company, today further expanded into the semiconductor market with the unveiling of its new Atomic Layer Deposition (ALD) product offering

  8. Riber: Order For A Compact 21 Research Platform In France 6/27/2024

    RIBER, the global leader for Molecular Beam Epitaxy (MBE) equipment serving the semiconductor industry, is announcing the sale of a double Compact 21 research system in France.

  9. Efabless Empowers 40 Commercial Companies To Design Chips 6/24/2024

    Efabless Corporation, the creator platform for chips, is excited to announce that it has enabled 40 new companies to design chips.

  10. Vishay Intertechnology Releases Second-Generation Automotive Grade IHLE® Inductor With Integrated EMI Shield In 4040 Case Size 6/5/2024

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its IHLE® series of low profile, high current inductors featuring integrated E-field shields with a new second-generation Automotive Grade device in the 10 mm by 10 mm 4040 case size.