Current Headlines

  1. Finwave Semiconductor And GlobalFoundries Partner On RF GaN-on-Si Technology For Cellular Handset Applications 8/29/2024

    Finwave Semiconductor, Inc., a leading innovator in GaN (Gallium Nitride) technology, today announced a strategic technology development and licensing agreement with GlobalFoundries (GF), the world’s leading specialty foundry with a rich history of RF leadership.

  2. Nearfield Instruments Secures Purchase Order For Its QUADRA Metrology System From Leading Semiconductor Manufacturing Fab In Asia 7/30/2024

    Nearfield Instruments, provider of metrology and process control equipment for advanced semiconductor fabrication plants, today announced the receipt of a purchase order for its QUADRA® metrology systems from a major semiconductor manufacturing fab in Asia.

  3. Weebit Nano And DB HiTek Tape-Out ReRAM Module In DB HiTek's 130nm BCD process 7/30/2024

    Weebit Nano Limited (Weebit), a leading developer and licensor of advanced memory technologies for the global semiconductor industry, and tier-1 semiconductor foundry DB HiTek have taped-out (released to manufacturing) a demonstration chip integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM or RRAM) module in DB HiTek’s 130nm Bipolar-CMOS-DMOS (BCD) process.

  4. Boston Semi Equipment Launches New Test Site Module For Zeus Test Handler To Support Power IC Manufacturers 7/24/2024

    Boston Semi Equipment (BSE), a global leader in advanced automation solutions for the semiconductor and consumer electronics industries, today introduced a new test site module for its Zeus gravity feed test handler to support high-voltage and partial discharge (HVPD) applications in power electronics manufacturing.

  5. Rice Researchers Advancing Microelectronics Manufacturing On DARPA-Funded Team 7/22/2024

    A large collaborative team led by the University of Texas at Austin with Rice University as a key partner was awarded $840M to develop the next generation of high-performing semiconductor microsystems for the U.S. Department of Defense.

  6. Forge Nano Expands Semiconductor Business; Unveils New 200mm Wafer Atomic Layer Deposition Cluster Tool Ahead of SEMICON West 7/1/2024

    Forge Nano, Inc., a leading ALD equipment provider and materials science company, today further expanded into the semiconductor market with the unveiling of its new Atomic Layer Deposition (ALD) product offering

  7. Riber: Order For A Compact 21 Research Platform In France 6/27/2024

    RIBER, the global leader for Molecular Beam Epitaxy (MBE) equipment serving the semiconductor industry, is announcing the sale of a double Compact 21 research system in France.

  8. Efabless Empowers 40 Commercial Companies To Design Chips 6/24/2024

    Efabless Corporation, the creator platform for chips, is excited to announce that it has enabled 40 new companies to design chips.

  9. Vishay Intertechnology Releases Second-Generation Automotive Grade IHLE® Inductor With Integrated EMI Shield In 4040 Case Size 6/5/2024

    Vishay Intertechnology, Inc. (NYSE: VSH) today expanded its IHLE® series of low profile, high current inductors featuring integrated E-field shields with a new second-generation Automotive Grade device in the 10 mm by 10 mm 4040 case size.

  10. EV Group Doubles Throughput Of Innovative Semiconductor Layer Transfer Technology With New EVG®880 LayerRelease™ System 5/28/2024

    EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®880 LayerRelease™ system, a dedicated high-volume manufacturing (HVM) equipment platform incorporating EVG's innovative infrared (IR) LayerRelease™ technology.