Downloads

  1. Miniature, Low Power OCXO: Model 148 Datasheet 3/5/2013

    The CTS Model 148 is an OCXO (oven-controlled crystal oscillator) that features an ultra-compact size and low power consumption.

  2. Miniature, Low Power OCXO: Model 148 3/5/2013

    This oven-controlled crystal oscillator (OCXO) covers the 8 MHz to 100 MHz frequency range and is the industry’s smallest of its kind. It utilizes a unique SC cut crystal technology to achieve low power consumption (0.23W at +25ºC) and features an incredibly compact size, allowing for additional board space.

  3. Heat Sinks with Low Thermal Resistance 2/13/2013

    Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.

  4. Forged Aluminum Heat Sinks with Plate Fins: AER Series 2/13/2013

    The AER Series of forged heat aluminum heat sinks features precision forging technology for high power applications. Multiple fin heights and various mounting methods are available. This series is designed for BGA and other surface mount ICs (integrated circuits).

  5. Forged Aluminum Heat Sinks with Pin Fins: APR Series 2/13/2013

    The APR Series of forged heat aluminum heat sinks features omni-directional pins, precision forging technology for high power applications, multiple pin heights, and much more. This series is designed for BGA and other surface mount ICs (integrated circuits).

  6. Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series 2/13/2013

    The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).

  7. Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series 2/13/2013

    The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.

  8. Intelligent Multiple Head Camera Platform: VCSBC quadro 1/28/2013

    The VCSBC is a multiple head board-level camera based off of the VC360 Intelligent Camera configuration. VCSBC quadro can be equipped with one, two, or four sensor heads and is an ideal economic platform for several multi-sensor imaging solutions.

  9. PoE (Power over Ethernet) Camera for OEM Applications: VCnano PoE 1/28/2013

    The VCnano PoE line measures in at 76 x 45 x 40 mm and weighs only 250 g. Its compact size and light weight, along with its ability to be powered entirely through its Ethernet connection, make installation and interfacing in machines and factories very simple.

  10. Suprasil® UVL: For Cost Effective DUV Performance- DUV Excimer Optics 1/9/2013

    This high purity and chlorine free fused silica material is made from flame hydrolysis and under controlled conditions to improve the DUV Excimer laser damage resistance for highest energy applications. In this case the material is doped with a guaranteed Hydrogen content to reduce fluorescence caused by high energy laser irradiation.  This material has very low impurity levels (<0.01ppm) which results in low DUV absorption and is free of bubbles & inclusions.