Downloads
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Compact Supercritical Dryer: PCO-4SC Datasheet
10/8/2013
NTT-AT’s PCO-4SC Supercritical Dryer has been designed to prevent pattern collapse in semiconductors in the manufacturing process. To find out how to prevent pattern collapse in fine structures, download the datasheet.
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Compact Supercritical Dryer
10/8/2013
A pattern collapse occurs during the fabrication process when the liquid surrounding the semiconductor pattern dries up. To prevent this, NTT-AT has developed the PCO-4SC to conduct supercritical drying operations.
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Pressure/Vacuum Compact Clean Oven: PCO-083TA Datasheet
10/5/2013
The PCO-083TA compact clean oven removes bubbles in seals or adhesion resins through pressure and heat treatment. It’s ideally suited for the thermal treatment of semiconductor devices in their mounting process.
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Pressure/Vacuum Compact Clean Oven: PCO-083TA
10/5/2013
The PCO-083TA is clean oven that provides both pressure and vacuum treatments. A wide variety of heat-treatment processes under pressurization and depressurization conditions are made possible through this system. It can also provide low-oxygen curing for polyimide, material synthesis under pressure, and pressure-and-heat-treatment for the removal of bubbles in seal or adhesion resins.
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Pressure Controllable Automatic Curing System: PCOA-01T Datasheet
10/2/2013
NTT-AT’s PCOA-01T is a pressure controllable automatic curing system that removes bubbles in seals and in adhesion resins, uses increased pressure for materials synthesis, and provides a low oxygen cure of resins.
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Pressure Controllable Automatic Curing System: PCOA-01T
10/2/2013
The PCOA-01T is a pressure controllable automatic curing system that provides thermal treatment of a wide variety of electronic devices in the mounting/manufacturing process. It removes bubbles in seals and in adhesion resins, provides a low oxygen cure of resins, and conducts materials synthesis under increased pressure.
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Spin Coating Film Transfer and Hot-Pressing: STP Machine Datasheet
9/30/2013
NTT AT’s STP machine is a spin coating film transfer and hot-pressing machine used to fill, seal, and planarize electronic devices during their manufacturing process. It’s particularly ideal for MEMS and LSI.
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Spin Coating Film Transfer and Hot-Pressing: STP Machine
9/30/2013
The STP machine is the ideal solution for advanced electronic device manufacturing. It can be used to seal, fill, and planarize, MEMS, LSI, and other devices.
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HEVC Software CODEC “HEVC-1000 SDK” Datasheet
8/21/2013
The HEVC software development kit is ideal for adding H.265/HEVC video encoding to applications for video conversion, 4K video distribution, digital signage systems, video delivery to mobile devices, and more
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HEVC Software CODEC “HEVC-1000 SDK”
8/21/2013
The HEVC-1000 SDK is a software development kit that provides functionality for H.265/HEVC video encoding and decoding. It provides approximately twice the compression performance as H.264/AVC with the same video image quality, which reduces bandwidth and file size by 50%.