Downloads
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Forged Aluminum Heat Sinks with Pin Fins: APR Series
2/13/2013
The APR Series of forged heat aluminum heat sinks features omni-directional pins, precision forging technology for high power applications, multiple pin heights, and much more. This series is designed for BGA and other surface mount ICs (integrated circuits).
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Low Height Thin-Fin Forged Aluminum Heat Sinks: APF Series
2/13/2013
The APF Series Heat Sinks feature low profile thin fins, improved thermal performance over conventional heat sinks, multiple fin heights, precision forging technology for high power applications, and more. This series is designed for BGA and other surface mount ICs (integrated circuits).
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Adhesive Peel and Stick Aluminum Heat Sinks: BDN Series
2/13/2013
The BDN series of extruded heat sinks feature a pre-applied adhesive which reduces assembly costs. Additional features include a thermally optimized pin fin, an excellent mechanical bond, adhesive shear strength of 36 psi. at 100oC, and more. This series is designed for BGA, PGA, PLCC, and QFP IC (integrated circuit) packages.
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Heat Sinks with Low Thermal Resistance
2/13/2013
Heat sinks are used for the dissipation of heat from high performance integrated circuits (ICs). Two different series are featured here; the forged heat sink series, and the extruded heat sink series. These heat sinks feature excellent thermal performance and are applicable to BGA, PGA, PLCC, QFP, and other IC packages.
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TALYS ASP310 Wet Bath Monitoring Analyzer Brochure
2/4/2013
The TALYS analyzer fulfills the needs of equipment suppliers to semiconductor, solar and LED Fabs. This low cost, highperformance wet bath monitor allows real-time end-of-bath alerts and enables effective bath dosing. Retrievable prediction routines for monitoring multiple bath chemistries are stored within TALYS. The prediction routines will permit a single analyzer to be used when a bath chemistry changes.
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Intelligent Multiple Head Camera Platform: VCSBC quadro
1/28/2013
The VCSBC is a multiple head board-level camera based off of the VC360 Intelligent Camera configuration. VCSBC quadro can be equipped with one, two, or four sensor heads and is an ideal economic platform for several multi-sensor imaging solutions.
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PoE (Power over Ethernet) Camera for OEM Applications: VCnano PoE
1/28/2013
The VCnano PoE line measures in at 76 x 45 x 40 mm and weighs only 250 g. Its compact size and light weight, along with its ability to be powered entirely through its Ethernet connection, make installation and interfacing in machines and factories very simple.
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Suprasil® UVL: For Cost Effective DUV Performance- DUV Excimer Optics
1/9/2013
This high purity and chlorine free fused silica material is made from flame hydrolysis and under controlled conditions to improve the DUV Excimer laser damage resistance for highest energy applications. In this case the material is doped with a guaranteed Hydrogen content to reduce fluorescence caused by high energy laser irradiation. This material has very low impurity levels (<0.01ppm) which results in low DUV absorption and is free of bubbles & inclusions.
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Mobile Audio Conferencing System: R-Talk
1/8/2013
NTT AT’s R-Talk turns any kind of phone into a teleconference phone. It’s small and compact, making it easily portable and travel friendly. The R-Talk mobile audio conferencing system can be connected to a standard business phone, a mobile phone, a smart phone, or any computer with a USB port.
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Mobile Audio Conferencing System: R-Talk Brochure
1/8/2013
This brochure contains a detailed description of the R-Talk 800EX, an audio conferencing system that can turn a standard business phone, a mobile phone, a smart phone, or any computer with a USB port, into a video conferencing system with high reliability and sound quality. To find out how this new and innovative system works, download the brochure.