ActLight, a Swiss technology firm known for its breakthrough Dynamic PhotoDiodes (DPDs), announced today that it has signed an agreement with a top semiconductor company for the integration and licensing of the DPD into their Application Specific Integrated Circuit (ASIC) for vital signs monitoring, to be used in the next generation of wearable devices
Yield Engineering Systems, Inc. (YES) is pleased to announce Scientech Corporation as new sales representatives covering China, Taiwan, Singapore and other Southeast Asian markets, starting immediately
TowerJazz, the global specialty foundry leader, recently announced its participation at European Microwave Week (EuMW), being held in Madrid, Spain on September 25 - 27, 2018.
ClassOne Technology, the premier supplier of new electroplating and wet process tools to the 200mm and smaller semiconductor manufacturing industry, today announced a multi-tool sale of its flagship Solstice® CopperMax™ electroplating system to China's premier Compound Semiconductor manufacturer
Researchers from Graphene Flagship Partners at the National Inter-University Consortium for Telecommunications (CNIT) in Italy, IMEC in Belgium and University of Cambridge in UK created and tested a graphene based phase modulator that outperforms existing silicon based ones.
Andes Technology Corporation, the leading supplier of high performance, low-power and small embedded CPU cores, has created a RISC-V core licensing project and has signed joint promotion agreements to form a multinational design service alliance with several top ASIC/SoC design service companies
Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc., today announced its new SXP 24G family of devices, the industry's first 24G SAS (SAS-4) expanders for server and networked storage
The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $117.9 billion during the second quarter of 2018, an increase of 6.0 percent over the previous quarter and 20.5 percent more than the second quarter of 2017
MTPV Power Corporation, a clean energy company that coverts heat to electricity using semiconductor chips, accepted Frost & Sullivan’s Global Technology Leadership Award for waste heat recovery solutions at Frost & Sullivan’s Excellence in Best Practices Awards Gala on July 18th in Nashville, Tennessee
Working to address “hotspots” in computer chips that degrade their performance, UCLA engineers have developed a new semiconductor material, defect-free boron arsenide, that is more effective at drawing and dissipating waste heat than any other known semiconductor or metal materials.
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