Ansoft Releases New Version Of Turbo Package Analyzer Software

Pittsburgh -- Ansoft Corporation announces Turbo Package Analyzer (TPA) v5. This latest version of TPA introduces new automation, design flow, and simulation capability needed for the extraction of the electrical characteristics of complex high-performance ball-grid array (BGA) style packaging, including wirebond (WBBGA), flip-chip (FCBGA), chip-scale packages (CSPs) and System in Packages (SiP).

TPA v5 increases the capacity of the solver to address larger-sized packaging problems and introduces greater automation for generating and/or modifying 3-D package layouts. TPA v5 introduces a new user interface that includes new 2-D editing and 3-D viewing capabilities, unlimited undo/redo capability, new editing, and automation features, such as geometry validation checking and support for VB scripting.

Combined with AnsoftLinks, a tool for simplifying data import and export between EDA and CAD packages, TPA v5 generates resistance, inductance, and capacitance (RLC) models directly from package design tools. It accepts CAD data and fully characterizes the entire package in three dimensions. Extracted sub-circuits can be exported into Nexxim, the company's circuit simulation software, or existing SPICE tools (SPICE/IBIS format) for subsequent transient analyses, such as crosstalk, overshoot and TDR.

TPA v5 is available for Microsoft Windows XP Professional, Windows XP x64 Edition and Windows Server 2003.

SOURCE: Ansoft LLC