STMicroelectronics Earns USB-IF Certification For Complete USB PD EPR Solution; Efficiently Delivers Up To 140W From A Single Adapter2/28/2023
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has achieved USB-IF (USB Implementers Forum) certification of two ICs for use in adapter (source) and device (sink) sides of a USB Power Delivery (USB PD) EPR1 power supply/charger product.
Applied Materials’ New eBeam Metrology System Paves The Way To High-NA EUV Lithography2/28/2023
Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
MACOM To Demonstrate 100G/Lane High Speed Optical Link With Linear Drive Interface At OFC 20232/28/2023
MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, announced a demonstration of its Linear Drive 100Gbps per lane optical links at the Optical Networking and Communications Conference 2023 (OFC) in San Diego. The live demonstration of the optical link, using MACOM PURE DRIVE Transimpedance Amplifiers (TIA) and Laser Drivers and Broadcom’s Tomahawk 5 switch chip, will take place at MACOM’s booth #3927 and Broadcom’s booth #6425.
Gallium Semiconductor Releases Library Of Nonlinear Models For Its Portfolio Of GaN Products2/28/2023
Gallium Semiconductor, an innovative supplier of RF semiconductor solutions, today announced the release of its library of nonlinear models for its portfolio of GaN products. The library consists of 22 models covering all of Gallium Semi’s broadband Dual Flat No-Leads (DFN) plastic and Air Cavity Ceramic (ACC) packaged products. All models are designed and validated with broadband S-parameters and load pull measurements to cover a broad range of applications.
Arctic Semiconductor And Compal Introduce World’s First Universal Small Cell Infrastructure Platform For 5G Networks2/27/2023
Arctic Semiconductor formerly known as SiTune Corporation, a leader in low-power, universal RF chipsets, today announced that its groundbreaking RF transceiver, IceWings™ is powering a new universal 5G small cell infrastructure platform from Compal Electronics, one of the world’s largest ODMs.
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