LATEST HEADLINES

• Resonac Launches 27-Member "JOINT3" Consortium To Develop Next-Generation Semiconductor Packaging

  9/3/2025

  Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a consortium comprising Resonac and 26 other companies from Japan, the United States, Singapore, etc.

• Pfeiffer Vacuum+Fab Solutions Showcases Complete Range Of Semiconductor Solutions At SEMICON West 2025

  8/29/2025

  As a leading provider of innovative vacuum and abatement solutions, Pfeiffer Vacuum+Fab Solutions aims to showcase its comprehensive range of products and services designed to optimize semiconductor manufacturing processes.

• CG Semi Unveils One Of India's First End-To-End OSAT Facilities In Sanand, Gujarat

  8/28/2025

  CG Semi Private Limited (“CG Semi”), a subsidiary of CG Power and Industrial Solutions Limited (“CG Power”) and part of the Murugappa Group, has announced the launch of its first Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, Gujarat.

• Marvell Unveils Industry's First 64 Gbps/Wire Bi-Directional Die-To-Die Interface IP In 2nm To Power Next Generation XPUs

  8/26/2025

  Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, today announced the industry's first 2nm 64 Gbps bi-directional die-to-die (D2D) interconnect, enabling chip designers to significantly boost the bandwidth and performance of next-generation XPUs while reducing power and silicon area.

• Rapidus Announces Strategic Collaboration With Keysight To Improve Yield And Achieve High-Precision PDK For 2nm GAA Semiconductors

  8/26/2025

  Rapidus Corporation, a leading-edge Japanese foundry that manufactures advanced logic semiconductors, today announced a strategic collaboration with Keysight Technologies Japan K.K., the Japanese subsidiary of Keysight Technologies, Inc., and has signed a Memorandum of Cooperation.