LATEST HEADLINES

  • Gigaphoton Excimer Laser For Advanced Packaging Installed At Japanese Company
    12/7/2025

    Gigaphoton Inc. (Head Office: Oyama, Tochigi; President and CEO: Tatsuo Enami), a manufacturer of lightsources for semiconductor lithography, announced that it has delivered an excimer laser for semiconductor advanced packaging to a Japanese company engaged in research and development of advanced semiconductors, and the installation of the system was successfully completed in November.

  • UMC And Polar Collaborate To Meet Growing Demand For U.S. Onshore Semiconductor Manufacturing
    12/4/2025

    United Microelectronics Corporation (“UMC”), a leading global semiconductor foundry, and Polar Semiconductor, LLC (“Polar”), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, today announced they have signed a Memorandum of Understanding (MOU) to explore collaboration on delivering scalable U.S.-based 8-inch production of high-quality wafers that are essential across pillar industries including automotive, data centers, consumer electronics, and aerospace & defense.

  • Rigaku Launches XTRAIA MF-3400, A Measuring Instrument For Next-Generation Semiconductors
    12/4/2025

    Rigaku Corporation, a global solution partner in X-ray analytical systems and a group company of Rigaku Holdings Corporation (headquarters: Akishima, Tokyo; CEO: Jun Kawakami; hereinafter “Rigaku”) has launched the XTRAIA MF-3400, an instrument used in semiconductor manufacturing processes to measure the thickness and composition of wafers.

  • Vinci Emerges From Stealth To Transform Semiconductor Design And Simulation
    12/2/2025

    Vinci, the pioneer of Physics-Driven AI for hardware design and simulation, emerged from stealth today and announced $46M in total funding, with its Series A led by Xora Innovation and its Seed round led by Eclipse.

  • Alpha And Omega Semiconductor Enables 48V Hot Swap In AI Servers With New High SOA MOSFET IN LFPAK 8x8
    12/2/2025

    Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced its AOLV66935 a 100V High Safe Operating Area (SOA) MOSFET in an LFPAK 8x8 package.

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Electronic Military & Defense was developed as a resource for engineers, program managers, project managers, and other professionals involved in the design and development of electronic and electro-optic systems for a wide range of defense and aerospace applications. Check out the digital edition of our latest issue for exclusive editorial on open architecture and standards applied to defense applications, overlooked EMC vulnerabilities, microfabrication, display technologies, and more.

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