Product Showcase
-
Containment: Granulator Technology
5/3/2011
Used for lab scale and production operations at multiple International Pharma manufacturers, our Granulator containment technology applications take the idea of retrofits to another level.
-
Process Area Barriers Curtains
5/3/2011
Process Area Barrier Curtains are a useful tool in improving the containment levels in existing installations and as a method to restrict access.
-
Wet Process Analyzer
5/3/2011
ABB supplies the SEMICONDUCTOR, SOLAR CELL and FLAT PANEL DISPLAY industries with the first in-situ, real time, non-contact analyzer for wet bench monitoring.
-
Tray Dryer Powder Containment
5/2/2011
Tray Dryers are a common method of dryer wetcakes and granulated drug products. This is especially true in the early product development phase.
-
Crimping System
5/2/2011
Another ILC innovation in the area of flexible containment is the design of the advanced crimping system.
-
Containment: Offloading
5/2/2011
Containment solutions for the contained offloading of Aurora Filters.
-
Containment: Bag In Bag Out
5/2/2011
The DoverPac® Bag In/Bag Out (BIBO) containment system is a family of contained transfer designs for multiple processes. The primary components for this validated operation consist of multiple groove canisters, docking interface hardware, and softgoods in either continuous liner form or discreet liners.
-
CONTAINMENT: Milling Powder
5/2/2011
Containment challenges are presented in a variety of ways by different types of particle reduction machines.
-
Pulsed-Bias Pulsed-RF Harmonic Load Pull For GaN And WBG Devices
3/7/2011
Wide Band-Gap devices, such as GaN offer several advantages over GaAs, including higher operating voltage (over 100V breakdown), higher operating temperature (over 150°C channel temperature), and higher power density (5-30W/mm). Despite these obvious advantages, the large output power capability presents a great deal of heat dissipation. SiC has an impressive thermal conductivity, but for large periphery GaN devices, it is not sufficient for eliminating thermal effects. GaN HEMTs can also suffer from the effects of trapping in the surface passivation along the gate width.
-
Offloading
1/24/2011
ILC supports contained offloading.